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PDF NT5SV32M6CT Data sheet ( Hoja de datos )

Número de pieza NT5SV32M6CT
Descripción (NT5SVxxMxxCT) 128Mb SDRAM
Fabricantes Nanya Techology 
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NT5SV32M4CT
NT5SV16M8CT
NT5SV8M16CT
128Mb Synchronous DRAM
Features
• High Performance:
fCK
Clock
Frequency
tCK Clock Cycle
tAC
Clock Access
Time1
www.DataSheettA4CU.coCTmilmocek2 Access
-7K 3
CL=2
133
7.5
5.4
-75B,
CL=3
133
7.5
-8B,
CL=2
100
10
Units
MHz
ns
ns
5.4 6 ns
1. Terminated load. See AC Characteristics on page 37.
2. Unterminated load. See AC Characteristics on page 37.
3. tRP = tRCD = 2 CKs
• Single Pulsed RAS Interface
• Fully Synchronous to Positive Clock Edge
• Four Banks controlled by BS0/BS1 (Bank Select)
• Programmable CAS Latency: 2, 3
• Programmable Burst Length: 1, 2, 4, 8
• Programmable Wrap: Sequential or Interleave
• Multiple Burst Read with Single Write Option
• Automatic and Controlled Precharge Command
• Data Mask for Read/Write control (x4, x8)
• Dual Data Mask for byte control (x16)
• Auto Refresh (CBR) and Self Refresh
• Suspend Mode and Power Down Mode
• Standard Power operation
• 4096 refresh cycles/64ms
• Random Column Address every CK (1-N Rule)
• Single 3.3V ± 0.3V Power Supply
• LVTTL compatible
• Package: 54-pin 400 mil TSOP-Type II
Description
The NT5SV32M4CT, NT5SV16M8CT, and NT5SV8M16CT
are four-bank Synchronous DRAMs organized as 8Mbit x 4
I/O x 4 Bank, 4Mbit x 8 I/O x 4 Bank, and 2Mbit x 16 I/O x 4
Bank, respectively. These synchronous devices achieve
high-speed data transfer rates of up to 133MHz by employing
a pipeline chip architecture that synchronizes the output data
to a system clock. The chip is fabricated with NTC’s
advanced 128Mbit single transistor CMOS DRAM process
technology.
The device is designed to comply with all JEDEC standards
set for synchronous DRAM products, both electrically and
mechanically. All of the control, address, and data input/out-
put (I/O or DQ) circuits are synchronized with the positive
edge of an externally supplied clock.
RAS, CAS, WE, and CS are pulsed signals which are exam-
ined at the positive edge of each externally applied clock
(CK). Internal chip operating modes are defined by combina-
tions of these signals and a command decoder initiates the
necessary timings for each operation. A fourteen bit address
bus accepts address data in the conventional RAS/CAS mul-
tiplexing style. Twelve row addresses (A0-A11) and two bank
select addresses (BS0, BS1) are strobed with RAS. Eleven
column addresses (A0-A9, A11) plus bank select addresses
and A10 are strobed with CAS. Column address A11 is
dropped on the x8 device, and column addresses A11 and
A9 are dropped on the x16 device.
Prior to any access operation, the CAS latency, burst length,
and burst sequence must be programmed into the device by
address inputs A0-A11, BS0, BS1 during a mode register set
cycle. In addition, it is possible to program a multiple burst
sequence with single write cycle for write through cache oper-
ation.
Operating the four memory banks in an interleave fashion
allows random access operation to occur at a higher rate
than is possible with standard DRAMs. A sequential and gap-
less data rate of up to 133MHz is possible depending on
burst length, CAS latency, and speed grade of the device.
Auto Refresh (CBR) and Self Refresh operation are sup-
ported.
REV 1.0
May, 2001
1
© NANYA TECHNOLOGY CORP. All rights reserved.
NANYA TECHNOLOGY CORP. reserves the right to change Products and Specifications without notice.

1 page




NT5SV32M6CT pdf
NT5SV32M4CT
NT5SV16M8CT
NT5SV8M16CT
128Mb Synchronous DRAM
Block Diagram
www.DataSheet4UCK.cEom CKE Buffer
CLK CLK Buffer
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A11
BS0
BS1
A10
Column Decoder
Cell Array
Memory Bank 0
Sense Amplifiers
Column Decoder
Cell Array
Memory Bank 1
Sense Amplifiers
D Q0
DQ X
CS
RAS
CAS
WE
Column Decoder
Cell Array
Memory Bank 2
Sense Amplifiers
DQM
Column Decoder
Cell Array
Memory Bank 3
Sense Amplifiers
Cell Array, per bank, for 8Mb x 4 DQ: 4096 Row x 2048 Col x 4 DQ (DQ0-DQ3).
Cell Array, per bank, for 4Mb x 8 DQ: 4096 Row x 1024 Col x 8 DQ (DQ0-DQ7).
Cell Array, per bank, for 2Mb x 16 DQ: 4096 Row x 512 Col x 16 DQ (DQ0-DQ15).
REV 1.0
May, 2001
5
© NANYA TECHNOLOGY CORP. All rights reserved.
NANYA TECHNOLOGY CORP. reserves the right to change Products and Specifications without notice.

5 Page





NT5SV32M6CT arduino
NT5SV32M4CT
NT5SV16M8CT
NT5SV8M16CT
128Mb Synchronous DRAM
Burst Read Command
The Burst Read command is initiated by having CS and CAS low while holding RAS and WE high at the rising edge of the clock.
The address inputs determine the starting column address for the burst, the Mode Register sets the type of burst (sequential or
interleave) and the burst length (1, 2, 4, 8). The delay from the start of the command to when the data from the first cell appears
on the outputs is equal to the value of the CAS latency that is set in the Mode Register.
Burst Read Operation
www.DataSheet4U.com
(Burst Length = 4, CAS latency = 2, 3)
T0 T1 T2 T3 T4 T5 T6 T7 T8
CK
COMMAND READ A
NOP
NOP
NOP
NOP
NOP
NOP
NOP
NOP
CAS latency = 2
tCK2, DQs
CAS latency = 3
tCK3, DQs
DOUT A 0
DOUT A1
DOUT A2
DOUT A 3
DOUT A 0
DOUT A1
DOUT A 2
DOUT A3
Read Interrupted by a Read
A Burst Read may be interrupted before completion of the burst by another Read Command, with the only restriction being that
the interval that separates the commands must be at least one clock cycle. When the previous burst is interrupted, the remain-
ing addresses are overridden by the new address with the full burst length. The data from the first Read Command continues to
appear on the outputs until the CAS latency from the interrupting Read Command is satisfied, at this point the data from the
interrupting Read Command appears.
Read Interrupted by a Read
(Burst Length = 4, CAS latency = 2, 3)
T0 T1 T2 T3 T4 T5 T6 T7 T8
CK
COMMAND READ A
READ B
NOP
NOP
NOP
NOP
NOP
NOP
NOP
CAS latency = 2
tCK2, DQs
CAS latency = 3
tCK3, DQs
DOUT A0
DOUT B0
DOUT B1
DOUT B 2
DOUT B3
DOUT A 0
DOUT B 0
DOUT B1
DOUT B 2
DOUT B3
REV 1.0
May, 2001
11
© NANYA TECHNOLOGY CORP. All rights reserved.
NANYA TECHNOLOGY CORP. reserves the right to change Products and Specifications without notice.

11 Page







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