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Número de pieza | HMC643 | |
Descripción | GaAs MMIC 6-BIT DIGITAL PHASE SHIFTER | |
Fabricantes | Hittite Microwave Corporation | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de HMC643 (archivo pdf) en la parte inferior de esta página. Total 8 Páginas | ||
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Typical Applications
The HMC643 is ideal for:
• EW Receivers
5 • Weather & Military Radar
• Satellite Communications
www.DataSheet4U.c•oBmeamforming Modules
• Phase Cancellation
Functional Diagram
HMC643
GaAs MMIC 6-BIT DIGITAL
PHASE SHIFTER, 9 - 12 GHz
Features
Low RMS Phase Error: 3.5°
Low Insertion Loss: 6.5 dB
High Linearity: +38 dBm
360° Coverage, LSB = 5.625°
Die Size: 2.75 x 0.99 x 0.1 mm
General Description
The HMC643 is a 6-bit digital phase shifter
die which is rated from 9 to 12 GHz, providing 360
degrees of phase coverage, with a LSB of 5.625
degrees. The HMC643 features very low RMS phase
error of 3.5 degrees and extremely low insertion
loss variation of ±0.6 dB across all phase states.
This high accuracy phase shifter is controlled with
complementary logic of 0/-3V, and requires no fixed
bias voltage and is internally matched to 50 Ohms with
no external components. Simple external level shifting
circuitry can be used to convert a positive CMOS
control voltage into complementary negative control
signals.
Electrical Specifications, TA = +25° C, 50 Ohm System, Control Voltage = 0/-3V
Parameter
Frequency Range
Insertion Loss*
Input Return Loss*
Output Return Loss*
Phase Error*
RMS Phase Error
Insertion Loss Variation*
Input Power for 1 dB Compression
Input Third Order Intercept
Control Voltage Current
*Note: Major States Shown
Min.
9
Typ.
6.5
15
12
±7
3.5
±0.6
22
38
<1
Max.
12
10.0
-10 / +15
Units
GHz
dB
dB
dB
deg
deg
dB
dBm
dBm
μA
5 - 24
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
1 page v01.0707
Outline Drawing
5
www.DataSheet4U.com
HMC643
GaAs MMIC 6-BIT DIGITAL
PHASE SHIFTER, 9 - 12 GHz
Die Packaging Information [1]
Standard
Alternate
GP-2
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS IN INCHES (MILLIMETERS)
2. DIE THICKNESS IS 0.004
3. BACKSIDE METALLIZATION: GOLD
4. BACKSIDE METAL IS GROUND
5. BOND PADS METALLIZATION: GOLD
6. OVERALL DIE SIZE ±0.002
5 - 28
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
5 Page |
Páginas | Total 8 Páginas | |
PDF Descargar | [ Datasheet HMC643.PDF ] |
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