NCV7517 Datasheet PDF - ON Semiconductor
| Part Number | NCV7517 | |
| Description | Hex Low-side Predriver | |
| Manufacturers | ON Semiconductor | |
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NCV7517
FLEXMOSt Hex Low-Side
MOSFET Pre-Driver
The NCV7517 programmable six channel low-side MOSFET
pre-driver is one of a family of FLEXMOSTM automotive grade
products for driving logic-level MOSFETs. The product is
controllable by a combination of serial SPI and parallel inputs. It
features programmable fault management modes and allows
power-limiting PWM operation with programmable refresh time.
The device offers 3.3 V/5.0 V compatible inputs and the serial output
www.DataSheet4dUri.cvoemr can be powered from either 3.3 V or 5.0 V. Power-on reset
provides controlled powerup and two enable inputs allow all outputs
to be simultaneously disabled.
Each channel independently monitors its external MOSFET's
drain voltage for fault conditions. Shorted load fault detection
thresholds are fully programmable using an externally programmed
reference voltage and a combination of four discrete internal ratio
values. The ratio values are SPI selectable and allow different
detection thresholds for each group of three output channels.
Fault information for each channel is 2-bit encoded by fault type
and is available through SPI communication. Fault recovery
operation for each channel is programmable and may be selected for
latch-off or automatic retry.
The FLEXMOS family of products offers application scalability
through choice of external MOSFETs.
Features
•ă16-Bit SPI with Frame Error Detection
•ă3.3 V/5.0 V Compatible Parallel and Serial Control Inputs
•ă3.3 V/5.0 V Compatible Serial Output Driver
•ăTwo Enable Inputs
•ăOpen-Drain Fault and Status Flags
•ăProgrammable
- Shorted Load Fault Detection Thresholds
- Fault Recovery Mode
- Fault Retry Timer
- Flag Masking
•ăLoad Diagnostics with Latched Unique Fault Type Data
- Shorted Load
- Open Load
- Short to GND
•ăThese are Pb-Free Devices*
•ăNCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
Benefits
•ăScalable to Load by Choice of External MOSFET
http://onsemi.com
MARKING
DIAGRAM
32 LEAD LQFP
FT SUFFIX
CASE 873A
NCV7517
AWLYYWWG
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G = Pb-Free Package
ORDERING INFORMATION
Device
NCV7517FTG
Package
LQFP
(Pb-Free)
Shipping†
250 Units/Tray
NCV7517FTR2G
LQFP 2000 Tape & Reel
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
*For additional information on our Pb-Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
©Ă Semiconductor Components Industries, LLC, 2007
November, 2007 - Rev. 0
1
Publication Order Number:
NCV7517/D
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NCV7517
MAXIMUM RATINGS (Voltages are with respect to device substrate.)
Rating
Value
Unit
DC Supply (VCC1, VCC2, VDD)
Difference Between VCC1 and VCC2
Difference Between GND (Substrate) and VSS
Output Voltage (Any Output)
-0.3 to 6.5
"0.3
"0.3
-0.3 to 6.5
V
V
V
V
Drain Feedback Clamp Voltage (Note 1)
-0.3 to 40
V
Drain Feedback Clamp Current (Note 1)
10 mA
Input Voltage (Any Input)
-0.3 to 6.5
V
Junction Temperature, TJ
Storage Temperature, TSTG
www.DataSheet4UP.ecaokmReflow Soldering Temperature: Lead-Free
60 to 150 seconds at 217°C (Note 2)
-40 to 150
-65 to 150
260 peak
°C
°C
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ATTRIBUTES
Characteristic
Value
ESD Capability
Human Body Model
Machine Model
w " 2.0 kV
w " 200 V
Moisture Sensitivity (Note 2)
MSL2
Package Thermal Resistance (Note 3)
Junction–to–Ambient, RqJA
Junction–to–Pin, RYJL
86.0 °C/W
58.5 °C/W
1. An external series resistor must be connected between the MOSFET drain and the feedback input in the application. Total clamp power
dissipation is limited by the maximum junction temperature, the application environment temperature, and the package thermal resistances.
2. For additional information, see or download ON Semiconductor's Soldering and Mounting Techniques Reference Manual, SOLDERRM/D, and
Application Note AND8003/D.
3. Values represent still air steady-state thermal performance on a 4 layer (42 x 42 x 1.5 mm) PCB with 1 oz. copper on an FR4 substrate, using
a minimum width signal trace pattern (384 mm2 trace area).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC1
VCC2
VDD
VIN High
VIN Low
TA
Main Power Supply Voltage
Gate Drivers Power Supply Voltage
Serial Output Driver Power Supply Voltage
Logic High Input Voltage
Logic Low Input Voltage
Ambient Still-Air Operating Temperature
Min
4.75
VCC1 - 0.3
3.0
2.0
0
-40
Max
5.25
VCC1 + 0.3
VCC1
VCC1
0.8
125
Unit
V
V
V
V
V
°C
http://onsemi.com
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| Information | Total 24 Pages | |
| Link URL | [ Copy URL to Clipboard ] | |
| Download | [ NCV7517.PDF Datasheet ] | |
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