HMC559 Datasheet PDF - Hittite Microwave Corporation
| Part Number | HMC559 | |
| Description | GaAs PHEMT MMIC POWER AMPLIFIER | |
| Manufacturers | Hittite Microwave Corporation | |
| Logo |  |
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www.datashTeeyt4pui.ccoaml Applications
The HMC559 wideband PA is ideal for:
• Telecom Infrastructure
• Microwave Radio & VSAT
• Military & Space
• Test Instrumentation
• Fiber Optics
Functional Diagram
HMC559
GaAs PHEMT MMIC
POWER AMPLIFIER, DC - 20.0 GHz
Features
P1dB Output Power: +28 dBm
Gain: 14 dB
Output IP3: +36 dBm
Supply Voltage: +10V @ 400 mA
50 Ohm Matched Input/Output
3.12 mm x 1.50 mm x 0.1 mm
General Description
The HMC559 is a GaAs MMIC PHEMT Distributed
Power Amplifier die which operates between DC and
20 GHz. The amplifier provides 14 dB of gain,
+36 dBm output IP3 and +28 dBm of output power
at 1 dB gain compression while requiring 400 mA
from a +10V supply. Gain flatness is slightly posi-
tive from 4 to 20 GHz making the HMC559 ideal for
EW, ECM and radar driver amplifier applications.
The HMC559 amplifier I/O’s are internally matched to
50 Ohms facilitating integration into Multi-Chip-Mod-
ules (MCMs). All data is taken with the chip connected
via two 0.075mm (3 mil) ribbon bonds of minimal length
0.31mm (12 mils).
1 - 180
Electrical Specifications, TA = +25° C, Vdd= +10V, Vgg2= +4V, Idd= 400 mA*
Parameter
Frequency Range
Gain
Gain Flatness
Gain Variation Over Temperature
Input Return Loss
Output Return Loss
Output Power for 1 dB Compression (P1dB)
Saturated Output Power (Psat)
Output Third Order Intercept (IP3)
Noise Figure
Supply Current
(Idd) (Vdd= 10V, Vgg1= -0.8V Typ.)
Min.
11
25
Typ.
DC - 6.0
13
±0.5
0.01
22
16
28
30
37
4.5
Max.
0.02
400
Min.
11
24.5
Typ.
6.0 - 12.0
13.5
±0.5
0.01
15
16
27.5
29
36
3.5
Max.
0.02
400
Min.
Typ. Max.
12.0 - 20.0
11.5 14
±1.5
0.02 0.03
13
8
23 27
28.5
33
4.5
400
Units
GHz
dB
dB
dB/ °C
dB
dB
dBm
dBm
dBm
dB
mA
* Adjust Vgg1 between -2 to 0V to achieve Idd= 400 mA typical.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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www.datashOeeut4utl.cinome Drawing
v00.1105
HMC559
GaAs PHEMT MMIC
POWER AMPLIFIER, DC - 20.0 GHz
Die Packaging Information [1]
Standard
Alternate
GP-1
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS IN INCHES [MILLIMETERS]
2. DIE THICKNESS IS 0.004 (0.100)
3. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE
4. BOND PAD METALIZATION: GOLD
5. BACKSIDE METALLIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS
8. OVERALL DIE SIZE IS ±.002
1 - 184
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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Part DetailsOn this page, you can learn information such as the schematic, equivalent, pinout, replacement, circuit, and manual for HMC559 electronic component. |
| Information | Total 8 Pages | |
| Link URL | [ Copy URL to Clipboard ] | |
| Download | [ HMC559.PDF Datasheet ] | |
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