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PDF HMC687LP4 Data sheet ( Hoja de datos )

Número de pieza HMC687LP4
Descripción BiCMOS MMIC Mixer W/Integrated LO Amplifier
Fabricantes Hittite Microwave Corporation 
Logotipo Hittite Microwave Corporation Logotipo



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No Preview Available ! HMC687LP4 Hoja de datos, Descripción, Manual

v02.0708
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Typical Applications
The HMC687LP4(E) is Ideal for:
• Cellular/3G & LTE/WiMAX/4G
8 • Basestations & Repeaters
• GSM, CDMA & OFDM
• Transmitters and Receivers
Functional Diagram
HMC687LP4 / 687LP4E
BiCMOS MMIC MIXER W/ INTEGRATED
LO AMPLIFIER, 1.7 - 2.2 GHz
Features
High Input IP3: +35 dBm
Low Conversion Loss: 8 dB
Low LO Drive: 0 dBm
Optimized for High Side LO Input
Upconversion & Downconversion Applications
24 Lead 4x4mm SMT Package: 16mm2
General Description
The HMC687LP4(E) is a high dynamic range passive
MMIC mixer with integrated LO amplifier in a 4x4 SMT
QFN package covering 1.7 to 2.2 GHz. Excellent input
IP3 performance of +35 dBm for down conversion is
provided for 3G & 4G GSM/CDMA applications at an
LO drive of 0 dBm. With an input 1 dB compression
of +23 dBm, the RF port will accept a wide range of
input signal levels. Conversion loss is 8 dB typical.
The DC to 500 MHz IF frequency response will sat-
isfy GSM/CDMA transmit or receive frequency plans.
The HMC687LP4(E) is optimized for high side LO
frequency plans and is pin for pin compatible with the
HMC685LP4(E) which is a 1.7 - 2.2 GHz converter
optimized for low side LO.
Electrical Specifications,
TA = +25° C, IF = 200 MHz, LO = 0 dBm, Vcc = Vcc1, 2, 3 = +5V, G_Bias = +2.5V*
Parameter
Min. Typ. Max.
Frequency Range, RF
1.7 - 2.2
Frequency Range, LO
1.7 - 2.4
Frequency Range, IF
DC - 500
Conversion Loss
8 10.5
Noise Figure (SSB)
8
LO to RF Isolation
22 31
LO to IF Isolation
22 29
RF to IF Isolation
31 44
IP3 (Input)
35
1 dB Compression (Input)
23
LO Drive Input Level (Typical)
-3 to +3
Supply Current Icc total
120 145
* Unless otherwise noted all measurements performed as downconverter with high side LO & IF = 200 MHz.
Units
GHz
GHz
MHz
dB
dB
dB
dB
dB
dBm
dBm
dBm
mA
8 - 262
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com

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HMC687LP4 pdf
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Outline Drawing
8
v02.0708
HMC687LP4 / 687LP4E
BiCMOS MMIC MIXER W/ INTEGRATED
LO AMPLIFIER, 1.7 - 2.2 GHz
NOTES:
1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED
PLASTIC SILICA AND SILICON IMPREGNATED.
2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.
3. LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN.
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
6. PAD BURR LENGTH SHALL BE 0.15mm MAX.
PAD BURR HEIGHT SHALL BE 0.25mm MAX.
7. PACKAGE WARP SHALL NOT EXCEED 0.05mm
8. ALL GROUND LEADS AND GROUND PADDLE
MUST BE SOLDERED TO PCB RF GROUND.
9. REFER TO HITTITE APPLICATION NOTE
FOR SUGGESTED PCB LAND PATTERN.
Package Information
Part Number
Package Body Material
HMC687LP4
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC687LP4E RoHS-compliant Low Stress Injection Molded Plastic
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
100% matte Sn
MSL Rating
MSL1 [1]
MSL1 [2]
Package Marking [3]
H687
XXXX
H687
XXXX
8 - 266
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com

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