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PDF A1103 Data sheet ( Hoja de datos )
| Número de pieza | A1103 | |
| Descripción | (A1101 - A1106) Continuous-Time Switch Family | |
| Fabricantes | Allegro MicroSystems | |
| Logotipo |  |
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A1101, A1102, A1103, A1104, and A1106
Continuous-Time Switch Family
FEATURES AND BENEFITS
• AEC-Q100 automotive qualified
• Continuous-time operation
□□Fast power-on time
□□Low noise
• Stable operation over full operating temperature range
• Reverse battery protection
• Solid-state reliability
• Factory-programmed at end-of-line for optimum
performance
• Robust EMC performance
• High ESD rating
• Regulator stability without a bypass capacitor
Packages:
3-pin SOT23W (suffix LH)
3-pin SIP (suffix UA)
LH: A1101, A1102,
A1103, A1104, and
A1106
Not to scale
UA: A1101,
A1102, A1103,
and A1104
UA: A1106
DESCRIPTION
The Allegro™ A1101-A1104 and A1106 Hall-effect switches
are next generation replacements for the popular Allegro
312x and 314x lines of unipolar switches. The A110x family,
produced with BiCMOS technology, consists of devices that
feature fast power-on time and low-noise operation. Device
programming is performed after packaging, to ensure increased
switchpoint accuracy by eliminating offsets that can be induced
by package stress. Unique Hall element geometries and low-
offset amplifiers help to minimize noise and to reduce the
residual offset voltage normally caused by device overmolding,
temperature excursions, and thermal stress.
The A1101-A1104 and A1106 Hall-effect switches include
the following on a single silicon chip: voltage regulator, Hall-
voltage generator, small-signal amplifier, Schmitt trigger, and
NMOS output transistor. The integrated voltage regulator
permits operation from 3.8 to 24 V. The extensive on-board
protection circuitry makes possible a ±30 V absolute maximum
voltage rating for superior protection in automotive and
industrial motor commutation applications, without adding
external components. All devices in the family are identical
except for magnetic switchpoint levels.
The small geometries of the BiCMOS process allow these
devices to be provided in ultrasmall packages. The package
styles available provide magnetically optimized solutions for
most applications. Package LH is an SOT23W, a miniature low-
profile surface-mount package, while package UAis a three-lead
ultramini SIP for through-hole mounting. Each package is lead
(Pb) free, with 100% matte-tin-plated leadframes.
VCC
A1101-DS, Rev. 16
Regulator
To all subcircuits
Amp
VOUT
Gain
Offset
Trim
Control
Functional Block Diagram
GND
1 page  
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
THERMAL CHARACTERISTICS: may require derating at maximum conditions; see application information
Characteristic
Package Thermal Resistance
Symbol
RθJA
Test Conditions
Package LH, 1-layer PCB with copper limited to solder pads
Package LH, 2-layer PCB with 0.463 in.2 of copper area each side
connected by thermal vias
Package UA, 1-layer PCB with copper limited to solder pads
Value Units
228 ºC/W
110 ºC/W
165 ºC/W
Power Derating Curve
TJ(max) = 165ºC; ICC = ICC(max)
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
Package LH, 2-layer PCB
(RθJA = 110 ºC/W)
10
9 Package UA, 1-layer PCB
8
7
6
(RθJA = 165 ºC/W)
Package LH, 1-layer PCB
5 (RθJA = 228 ºC/W)
4
3
2
VCC(max)
VCC(min)
20 40 60 80 100 120 140 160 180
Power DissipatioTnemvpeersrautusreA(mºCb)ient Temperature
1900
1800
1700
1600
1500
1400
1300
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
20
(RPθaJAck=a(Rg1Pθe6JaA5Uck=ºAaC1,g/11eW0-Ll)aºHCy,/eW2r-l)PayCeBr PCB
(RPθaJcAk=ag2e2L8HºC, 1/W-la)yer PCB
40 60 80 100 120 140 160 180
Temperature (°C)
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
5
5 Page 
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
For Reference Only – Not for Tooling Use
(Reference DWG-9049)
Dimensions in millimeters – NOT TO SCALE
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
45°
3.02
+0.08
–0.05
1.44 E
4.09
+0.08
–0.05
E
2.04
B
1.52 ±0.05
C
2 X 10°
E
Branded
Face
Mold Ejector
Pin Indent
45°
2.16 MAX
0.51 REF
12 3
A 0.79 REF
0.43
+0.05
–0.07
0.41
+0.03
–0.06
15.75 ±0.25
1.27 NOM
NNT
1
D Standard Branding Reference View
= Supplier emblem
N = Last three digits of device part number
T = Temperature code
A Dambar removal protrusion (6X)
B Gate and tie bar burr area
C Active Area Depth, 0.50 mm REF
D Branding scale and appearance at supplier discretion
E Hall element, not to scale
Figure 4: Package UA, 3-Pin SIP
(A1101, A1102, A1103, and A1104)
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
11
11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet A1103.PDF ] | |
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