PDF NBXDBA009 Data sheet ( Hoja de datos )

Número de pieza	NBXDBA009
Descripción	Clock Oscillator
Fabricantes	ON Semiconductor
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No Preview Available ! NBXDBA009 3.3 V, 75 MHz / 150 MHz LVPECL Clock Oscillator The NBXDBA009 dual frequency crystal oscillator (XO) is designed to meet today’s requirements for 3.3 V LVPECL clock generation applications. The device uses a high Q fundamental crystal and Phase Lock Loop (PLL) multiplier to provide selectable 75 MHz or 150 MHz, ultra low jitter and phase noise LVPECL differential output. This device is a member of ON Semiconductor’s PureEdget clock family that provides accurate and precision clock solutions. Available in 5 mm x 7 mm SMD (CLCC) package on 16 mm tape and reel in quantities of 1000. Features • LVPECL Differential Output • Uses High Q Fundamental Mode Crystal and PLL Multiplier • Ultra Low Jitter and Phase Noise − 0.4 ps (12 kHz − 20 MHz) • Selectable Output Frequency − 75 MHz (default) / 150 MHz • Hermetically Sealed Ceramic SMD Package • RoHS Compliant • Operating Range 3.3 V ±10% • Total Frequency Stability − $50 PPM • This is a Pb−Free Device Applications • SAS Gen2 • Serial ATA www.DataSheetV4DUD.6com CLK CLK 54 Crystal PLL Clock Multiplier http://onsemi.com MARKING DIAGRAM 6 PIN CLCC LN SUFFIX CASE 848AB NBXDBA009 75/150 AWLYYWWG NBXDBA009 75/150 A WL YY WW G = NBXDBA009 (±50 PPM) = Output Frequency (MHz) = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package ORDERING INFORMATION Device Package Shipping† NBXDBA009LN1TAG CLCC−6 1000/ (Pb−Free) Tape & Reel NBXDBA009LNHTAG CLCC−6 100/ (Pb−Free) Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 1 23 OE FSEL GND Figure 1. Simplified Logic Diagram © Semiconductor Components Industries, LLC, 2009 March, 2009 − Rev. 1 1 Publication Order Number: NBXDBA009/D 1 page NBXDBA009 Table 8. RELIABILITY COMPLIANCE Parameter ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁShock ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁSolderability ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁVibration Solvent Resistance ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁThermal Shock ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁMoisture Level Sensitivity Standard Mechanical Mechanical Mechanical Mechanical Environment Environment Method MIL−STD−833, Method 2002, Condition B MIL−STD−833, Method 2003 MIL−STD−833, Method 2007, Condition A MIL−STD−202, Method 215 MIL−STD−833, Method 1011, Condition A MSL1 260°C per IPC/JEDEC J−STD−020D NBXDBA009 Driver Device CLK CLK Zo = 50 W Zo = 50 W 50 W 50 W D Receiver Device D VTT VTT = VDD − 2.0 V Figure 5. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) www.DataSheet4U.com Temperature (°C) 260 217 temp. 260°C 20 − 40 sec. max. peak 3°C/sec. max. 6°C/sec. max. ramp−up 175 150 pre−heat cooling reflow Time 60180 sec. 60150 sec. Figure 6. Recommended Reflow Soldering Profile http://onsemi.com 5 5 Page

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