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NBXDBB015 PDF даташит

Спецификация NBXDBB015 изготовлена ​​​​«ON Semiconductor» и имеет функцию, называемую «Clock Oscillator».

Детали детали

Номер произв NBXDBB015
Описание Clock Oscillator
Производители ON Semiconductor
логотип ON Semiconductor логотип 

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NBXDBB015 Даташит, Описание, Даташиты
NBXDBA015, NBXDBB015
3.3 V, 200.0 MHz/206.9 MHz
Dual Frequency LVPECL
Clock Oscillator
The NBXDBA015/NBXDBB015 dual frequency crystal oscillator
(XO) is designed to meet today’s requirements for 3.3 V LVPECL
clock generation applications. The device uses a high Q fundamental
crystal and Phase Lock Loop (PLL) multiplier to provide selectable
200.0 MHz or 206.9 MHz, ultra low jitter and phase noise LVPECL
differential output.
This device is a member of ON Semiconductor’s PureEdget clock
family that provides accurate and precision clock solutions.
Available in 5 mm x 7 mm SMD (CLCC) package on 16 mm tape
and reel in quantities of 1,000. Frequency stability options available as
either 50 PPM NBXDBA015 or 20 PPM NBXDBB015*.
Features
LVPECL Differential Output
Uses High Q Fundamental Mode Crystal and PLL Multiplier
Ultra Low Jitter and Phase Noise 0.4 ps (12 kHz 20 MHz)
Selectable Output Frequency 200.0 MHz (default)/206.9 MHz
Hermetically Sealed Ceramic SMD Package
RoHS Compliant
Operating Range 3.3 V ±10%
Total Frequency Stability ±20 PPM* or ±5O PPM
Applications
HighEnd Servers
Basestations
General Purpose Clock Generation and Margining
www.DataSheet4U.com
VDD
6
Crystal
PLL
Clock
Multiplier
CLK CLK
54
http://onsemi.com
6 PIN CLCC
LN SUFFIX
CASE 848AB
MARKING DIAGRAMS
NBXDBA015
200.0/206.9
AWLYYWW
NBXDBB015
200.0/206.9
AWLYYWW
NBXDBA015
NBXDBB015
200.0/206.9
A
WL
YY
WW
= NBXDBA015 (±50 PPM)
= NBXDBB015 (±20 PPM)*
= Output Frequency (MHz)
= Assembly Location
= Wafer Lot
= Year
= Work Week
ORDERING INFORMATION
Device
Package Shipping
NBXDBB015LN1TAG* CLCC6
1000/
(PbFree) Tape & Reel
NBXDBA015LN1TAG CLCC6
1000/
(PbFree) Tape & Reel
NBXDBA015LNHTAG CLCC6
100/
(PbFree) Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
* Please contact sales office for availability
1 23
OE
FSEL
GND
Figure 1. Simplified Logic Diagram
© Semiconductor Components Industries, LLC, 2009
March, 2009 Rev. 3
1
Publication Order Number:
NBXDBA015/D









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NBXDBB015 Даташит, Описание, Даташиты
NBXDBA015, NBXDBB015
OE 1
FSEL 2
6 VDD
5 CLK
GND 3
4 CLK
Figure 2. Pin Connections (Top View)
Table 1. PIN DESCRIPTION
Pin No.
Symbol
I/O
1 OE LVTTL/LVCMOS
Control Input
2
FSEL
Control Input
3
GND
Power Supply
4 CLK LVPECL Output
5 CLK LVPECL Output
6 VDD Power Supply
Description
Output Enable Pin. When left floating pin defaults to logic HIGH and output is active.
See OE pin description Table 2.
Output Frequency Select Pin. Pin will default LOW when left open. See Output Fre-
quency Select Table 3.
Ground 0 V.
NonInverted Clock Output. Typically loaded with 50 W receiver termination resistor to
VTT = VDD 2 V.
Inverted Clock Output. Typically loaded with 50 W receiver termination resistor to
VTT = VDD 2 V.
Positive power supply voltage. Voltage should not exceed 3.3 V ±10%.
Table 2. OUTPUT ENABLE TRISTATE FUNCTION
OE Pin
Output Pins
Open
Active
High Level
Active
Low Level
High Z
Table 3. OUTPUT FREQUENCY SELECT
FSEL Pin
Output Frequency (MHz)
Open
(pin will float Low)
200
High Level
206.9
Low Level
200
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Table 4. ATTRIBUTES
Characteristic
Value
Input Default State Resistor
170 kW
ESD Protection
Human Body Model
Machine Model
2 kV
200 V
Meets or Exceeds JEDEC Standard EIA/JESD78 IC Latchup Test
1. For additional Moisture Sensitivity information, refer to Application Note AND8003/D.
Table 5. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Units
VDD Positive Power Supply
Iout LVPECL Output Current
GND = 0 V
Continuous
Surge
4.6 V
25 mA
50
TA Operating Temperature Range
40 to +85
°C
Tstg Storage Temperature Range
55 to +120
°C
Tsol Wave Solder
See Figure 6
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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NBXDBB015 Даташит, Описание, Даташиты
NBXDBA015, NBXDBB015
Table 6. DC CHARACTERISTICS (VDD = 3.3 V ± 10%, GND = 0 V, TA = 40°C to +85°C)
Symbol
Characteristic
Conditions
Min.
IDD Power Supply Current (Note 2)
VIH OE Input HIGH Voltage
2000
VIL OE Input LOW Voltage
GND 300
IIH Input HIGH Current
OE
FSEL
100
100
Typ.
82
Max.
100
VDD
800
+100
+100
Units
mA
mV
mV
mA
IIL Input LOW Current
OE
FSEL
100
100
+100
+100
mA
VIH FSEL Input HIGH Voltage
2000
VDD
mV
VIL FSEL Input LOW Voltage
0 800 mV
VOH Output HIGH Voltage (Note 2)
VDD = 3.3 V
VDD1195
2105
VDD945
2355
mV
VOL Output LOW Voltage (Note 2)
VDD = 3.3 V
VDD1945
1355
VDD1600
1700
mV
VOUTPP
Output Voltage Amplitude (Note 2)
700 mV
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 Ifpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Measurement taken with outputs terminated with 50 ohm to VDD2 V. See Figure 5.
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http://onsemi.com
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