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PDF NTMS4404N Data sheet ( Hoja de datos )

Número de pieza NTMS4404N
Descripción Power MOSFET ( Transistor )
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No Preview Available ! NTMS4404N Hoja de datos, Descripción, Manual

NTMS4404N
Power MOSFET
30 V, 12 A, Single N−Channel, SO−8
Features
High Density Power MOSFET with Ultra Low RDS(on) for Higher
Efficiency
Miniature SO−8 Surface Mount Package Saving Board Space
IDSS Specified at Elevated Temperature
Diode Exhibits High Speed, Soft Recovery
Applications
Power Management for Battery Power Products
Portable Products
Computers, Printers, PCMCIA Cards
Cell Phones, Cordless Telephones
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Steady
State
tp v10 s
TA = 25°C
TA = 70°C
TA = 25°C
Steady State
tp v10 s
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
Steady
State
TA = 25°C
TA = 70°C
TA = 25°C
VDSS
VGS
ID
PD
ID
PD
30
$20
9.6
7.6
12
1.56
2.5
7.0
5.6
0.83
V
V
A
W
A
W
Pulsed Drain Current tp = 10 ms, DC = 2 %
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain−to−Source Avalanche
Energy (VDD = 20 V, VGS = 5 V, IPK = 7.25 A,
L = 19 mH, RG = 25 W)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
IDM
TJ,
TSTG
IS
EAS
TL
50
−55 to
150
6.0
500
A
°C
A
mJ
260 °C
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Unit
Junction−to−Ambient – Steady State (Note 1)
RqJA
80 °C/W
Junction−to−Ambient – t = 1 0 s (Note 1)
RqJA
50
Junction−to−Ambient – Steady State (Note 2)
RqJA
150
1. Surface−mounted on FR4 board using 1 in sq. pad size
(Cu area = 1.127 in sq. [1 oz] including traces)
2. Surface−mounted on FR4 board using the minimum recommended pad
size (Cu area = 0.412 in sq.)
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http://onsemi.com
V(BR)DSS
30 V
RDS(on) TYP
9.7 mW @ 10 V
15.5 mW @ 4.5 V
ID MAX
12 A
N−Channel
D
G
S
1
SO−8
CASE 751
STYLE 12
MARKING DIAGRAM/
PIN ASSIGNMENT
1
Source
8
Drain
Source
Drain
Source
Gate
Drain
Drain
Top View
E4404N = Device Code
L = Assembly Location
Y = Year
WW = Work Week
ORDERING INFORMATION
Device
Package
Shipping
NTMS4404NR2 SO−8
2500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2003
November, 2003 − Rev. 1
1
Publication Order Number:
NTMS4404N/D

1 page




NTMS4404N pdf
1000
DUTY CYCLE
100 D = 0.5
0.2
10
0.1
0.05
0.02
0.01
1
SINGLE PULSE
0.1
1E−05
1E−04
NTMS4404N
MOUNTED TO MINIMUM RECOMMENDED FOOTPRINT
www.DataSheet4U.com
P(pk)
t1
t2
DUTY CYCLE, D = t1/t2
RθJA(t) = r(t) RθJA
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) − TA = P(pk) RθJA(t)
1E−03
1E−02
1E−01
t, TIME (seconds)
1E+00
1E+01
1E+02
1E+03
Figure 12. Thermal Response − Various Duty Cycles
http://onsemi.com
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