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SE97B PDF даташит

Спецификация SE97B изготовлена ​​​​«NXP Semiconductors» и имеет функцию, называемую «DDR memory module temp sensor».

Детали детали

Номер произв SE97B
Описание DDR memory module temp sensor
Производители NXP Semiconductors
логотип NXP Semiconductors логотип 

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SE97B Даташит, Описание, Даташиты
SE97B
www.DataSheet4U.com
DDR memory module temp sensor with integrated SPD
Rev. 01 — 27 January 2010
Product data sheet
1. General description
Meets JEDEC Specification 42.4 TSE2002B1, 3 Jun 2009. The NXP Semiconductors
SE97B measures temperature from 40 °C to +125 °C with JEDEC Grade B ±1 °C
maximum accuracy between +75 °C and +95 °C critical zone and also provide 256 bytes
of EEPROM memory communicating via the I2C-bus/SMBus. It is typically mounted on a
DDR3 Dual In-Line Memory Module (DIMM) measuring the DRAM temperature in
accordance with the new JEDEC (JC-42.4) Mobile Platform Memory Module Temperature
Sensor Component specification and also replacing the Serial Presence Detect (SPD)
which is used to store memory module and vendor information.
The SE97B thermal sensor and EEPROM operates over the VDD range of 3.0 V to 3.6 V.
The TS consists of a ΔΣ Analog to Digital Converter (ADC) that monitors and updates its
own temperature readings 10 times per second, converts the reading to a digital data, and
latches them into the data temperature register. User-programmable registers, the
specification of upper/lower alarm and critical temperature trip points, EVENT output
control, and temperature shutdown, provide flexibility for DIMM temperature-sensing
applications.
When the temperature changes beyond the specified boundary limits, the SE97B outputs
an EVENT signal using an open-drain output that can be pulled up between 0.9 V and
3.6 V. The user has the option of setting the EVENT output signal polarity as either an
active LOW or active HIGH comparator output for thermostat operation, or as a
temperature event interrupt output for microprocessor-based systems. The EVENT output
can also be configured as only a critical temperature output.
The EEPROM is designed specifically for DRAM DIMMs SPD. The lower 128 bytes
(address 00h to 7Fh) can be Permanent Write Protected (PWP) or Reversible Write
Protected (RWP) by software. This allows DRAM vendor and product information to be
stored and write protected. The upper 128 bytes (address 80h to FFh) are not write
protected and can be used for general purpose data storage.
The SE97B has a single die for both the temp sensor and EEPROM for higher reliability
and supports the industry-standard 2-wire I2C-bus/SMBus serial interface. The SMBus
TIMEOUT function is supported to prevent system lock-ups. Manufacturer and Device ID
registers provide the ability to confirm the identity of the device. Three address pins allow
up to eight devices to be controlled on a single bus.
The SE98B is available as the SE97B thermal sensor only.









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SE97B Даташит, Описание, Даташиты
NXP Semiconductors
SE97Bwww.DataSheet4U.com
DDR memory module temp sensor with integrated SPD
Table 1. Comparison of SE97 versus SE97B features
Feature
SE97
SE97B
JEDEC specification
old JEDEC specification
new JEDEC specification
Bit 8 ‘1’ Thermal Sensor shutdown
Bit 8 ‘0’ Thermal Sensor active
no SMBus Timeout
SMBus Timeout 25 ms to 35 ms
SMBus Timeout 25 ms to 35 ms
I2C-bus maximum frequency
400 kHz
I2C SCL and SDA VIL/VIH voltage levels
Capabilities bit 6 SMBus Timeout
VIL(max) = 0.3 × VDD; VIH(min) = 0.7 × VDD
set to 0
set to 1
EVENT pin operation
frozen
de-assert
Capabilities bit 7 EVENT pin
set to 0
set to 1
A0 pin is 10 V tolerant
yes
Capabilities bit 5 VHV
set to 0
set to 1
I2C spike suppression
50 ns
I2C input hysteresis
SE97 Device ID register
- 0.05 × VDD
1010 0010
Revision ID register
0000 0001
0000 0011
Temperature Sensor accuracy
Grade B
Improved Grade B
Power-On Reset (POR)
0.6 V
1.8 V
Temperature Sensor voltage range
3.0 V to 3.6 V
EEPROM Write voltage range
3.0 V to 3.6 V
EEPROM Read voltage range
1.7 V to 3.6 V
3.0 V to 3.6 V
2 mm × 3 mm × 0.8 mm package
assembly plant Hong Kong
assembly plant Bangkok
(thicker die and leadframe)
2. Features
2.1 General features
„ JEDEC (JC-42.4) DIMM temperature sensor plus 256-byte serial EEPROM for Serial
Presence Detect (SPD)
„ SDA open-drain output design for best operation in distributed multi-point applications
„ Shutdown current: 0.1 μA (typ.) and 5.0 μA (max.)
„ Power-on reset: 1.8 V (typ.)
„ 2-wire interface: I2C-bus/SMBus compatible, 0 Hz to 400 kHz
„ SMBus Alert Response Address and TIMEOUT 25 ms to 35 ms (programmable)
„ ESD protection exceeds 2500 V HBM per JESD22-A114, 250 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101
„ Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
„ Available in HWSON8 package
2.2 Temperature sensor features
„ 11-bit ADC Temperature-to-Digital converter with 0.125 °C resolution
„ Voltage range: 3.0 V to 3.6 V
„ Operating current: 250 μA (typ.) and 400 μA (max.)
SE97B_1
Product data sheet
Rev. 01 — 27 January 2010
© NXP B.V. 2010. All rights reserved.
2 of 53









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SE97B Даташит, Описание, Даташиты
NXP Semiconductors
SE97Bwww.DataSheet4U.com
DDR memory module temp sensor with integrated SPD
„ Programmable hysteresis threshold: off, 0 °C, 1.5 °C, 3 °C, 6 °C
„ Over/under/critical temperature EVENT output
„ B-grade accuracy:
‹ ±0.5 °C/±1 °C (typ./max.) +75 °C to +95 °C
‹ ±1.0 °C/±2 °C (typ./max.) +40 °C to +125 °C
‹ ±2.0 °C/±3 °C (typ./max.) → −40 °C to +125 °C
2.3 Serial EEPROM features
„ Read and write voltage range: 3.0 V to 3.6 V
„ Operating current:
‹ Write 0.6 mA (typ.) for 3.5 ms (typ.)
‹ Read 100 μA (typ.)
„ Organized as 1 block of 256 bytes (256 × 8)
„ 100,000 write/erase cycles and 10 years of data retention
„ Permanent and Reversible Software Write Protect
„ Software Write Protection for the lower 128 bytes
3. Applications
„ DDR2 and DDR3 memory modules
„ Laptops, personal computers and servers
„ Enterprise networking
„ Hard disk drives and other PC peripherals
4. Ordering information
Table 2. Ordering information
Type number Topside
mark
Package
Name
SE97BTP[1] 97B
HWSON8
Description
plastic thermal enhanced very very thin small outline package;
no leads; 8 terminals; body 2 × 3 × 0.8 mm
Version
SOT1069-2
[1] Industry standard 2 mm × 3 mm × 0.8 mm package to JEDEC WCE-3, PSON8 in 8 mm × 4 mm pitch tape 4 k quantity reels.
SE97B_1
Product data sheet
Rev. 01 — 27 January 2010
© NXP B.V. 2010. All rights reserved.
3 of 53










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