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PDF HMC486 Data sheet ( Hoja de datos )
| Número de pieza | HMC486 | |
| Descripción | GaAs PHEMT MMIC 2 WATT POWER AMPLIFIER/ 7.0 - 9.0 GHz | |
| Fabricantes | Hittite Microwave Corporation | |
| Logotipo |  |
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v01.0106
HMC486
www.DataSheet4U.com
GaAs PHEMT MMIC 2 WATT
POWER AMPLIFIER, 7.0 - 9.0 GHz
1
Typical Applications
Features
The HMC486 is ideal for use as a power amplifier for:
Saturated Output Power: +34 dBm @ 24% PAE
• Point-to-Point Radios
Output IP3: +40 dBm
• Point-to-Multi-Point Radios
Gain: 26 dB
• Test Equipment & Sensors
DC Supply: +7.0 V @ 1300 mA
• Military End-Use
50 Ohm Matched Input/Output
• Space
2.51 mm x 2.51 mm x 0.1 mm
Functional Diagram
General Description
The HMC486 is a high dynamic range GaAs PHEMT
MMIC 2 Watt Power Amplifier which operates from 7
to 9 GHz. This amplifier die provides 26 dB of gain,
+34 dBm of saturated power and 24% PAE from a +7.0
V supply voltage. Output IP3 is +40 dBm typical. The
RF I/Os are DC blocked and matched to 50 Ohms for
ease of integration into Multi-Chip-Modules (MCMs).
All data is taken with the chip in a 50 ohm test fixture
connected via 0.025mm (1 mil) diameter wire bonds of
minimal length 0.31mm (12 mils).
1 - 130
Electrical Specifications, TA = +25° C, Vdd = +7V, Idd = 1300 mA*
Parameter
Min.
Typ.
Max.
Min.
Typ.
Frequency Range
7-8
8-9
Gain
22 25
23 26
Gain Variation Over Temperature
0.04
0.06
0.04
Input Return Loss
Output Return Loss
Output Power for 1 dB
Compression (P1dB)
Saturated Output Power (Psat)
Output Third Order Intercept (IP3)
11
8
30 33
33.5
40
30.5
12
6
33.5
34
38
Noise Figure
6.5 7
Supply Current (Idd)
1300
1300
* Adjust Vgg between -2 to 0V to achieve Idd= 1300 mA typical.
Max.
0.06
Units
GHz
dB
dB/ °C
dB
dB
dBm
dBm
dBm
dB
mA
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
1 page  
1
Outline Drawing
v01.0106
HMC486
www.DataSheet4U.com
GaAs PHEMT MMIC 2 WATT
POWER AMPLIFIER, 7.0 - 9.0 GHz
Die Packaging Information [1]
Standard
Alternate
GP-1
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004” SQUARE
4. BACKSIDE METALLIZATION: GOLD
5. BOND PAD METALLIZATION: GOLD
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
8. OVERALL DIE SIZE ± .002
1 - 134
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet HMC486.PDF ] | |
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