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PDF SC1218 Data sheet ( Hoja de datos )
| Número de pieza | SC1218 | |
| Descripción | High Speed Synchronous MOSFET Driver | |
| Fabricantes | Semtech | |
| Logotipo |  |
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POWER MANAGEMENT
Description
SC1218
High Speed
Synchronous MOSFET Driverwww.DataSheet4U.com
Features
The SC1218 is a high speed, robust, dual output driver to
drive high-side and low-side N-MOSFETs in synchronous
buck converters. Combined with Semtech’s multi-phase
PWM controller SC2649, one can build high performance,
versatile voltage regulators for next generation micropro-
cessors.
SC1218 is built upon a CMOS technology which provides
enough voltage capacity to handle computer applications.
In addition, the advanced timing circuitry is adopted to
filter out very narrow PWM pulses at the input of the driver.
The latched UVLO and enhanced adaptive shoot-through
protection further enhance the robustness of the SC1218.
With integrated bootstrap diode, the SC1218 is offered in
both SOIC-8 package and MLPQ-8 3x3mm package. These
features further reduce the thermal stress and BOM cost.
Advanced Digital Timing to Filter Out Very Narrow PWM
Pulses
+12V Gate Drive Voltage
Integrated Bootstrap Diode
High Peak Drive Current
Adaptive Non-overlapping Gate Drives Provide Shoot-
through Protection
Support Dynamic VID operation
Ultra-low Propagation Delay
Floating Top Gate Drive
Crowbar Function for Over Voltage Protection
High Frequency (up to 2 MHz) Operation Allows Use of
Small Inductors and Low Cost Ceramic Capacitors
Under Voltage Lockout
Low Quiescent Current
Enable Function for Both Gate OFF Shut Down
Lead-free Part and Fully WEEE and RoHS Compliant
Typical Application Circuit
Applications
Intel Next Generation Processor Power Supplies
AMD AthlonTM and AMD-K8TM Processor Power
Supplies
High Current Low Voltage DC-DC Converters
VIN
PWM
EN
Rv in
2R2
Cbst
1uF
Cv in
1uF
BST TG
CO DRN
EN PGND
VIN BG
SC1218
Mtop
Cin
Rdrn
(optional)
Mbot
Lout
VOUT
Cout
Revision: October 14, 2005
1
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1 page  
POWER MANAGEMENT
Pin Configuration
SOIC-8 Top View
BST 1 8 TG
CO 2 7 DRN
EN 3 6 PGND
VIN 4 5 BG
SC1218
www.DataSheet4U.com
MLPQ-8 3x3mm Top View
BST TG
87
CO 1
6 DRN
EN 2
5 PGND
34
VIN BG
EXPOSED PAD MUST BE SOLDERED TO
POWER GROUND PLANE
Pin Descriptions
SOIC-8 MLPQ-8 Pin Name
Pin Function
1
8
BST
Bootstrap supply pin for the top gate drive. Connect a 1uF ceramic capacitor between BST and
DRN pin to develop a floating bootstrap voltage for the high side driver.
2
1
CO
PWM input signal from external controller. An internal 40Kohm resistor is connected from this pin
to the PGND.
32
EN
When high, this pin enables the internal circuitry of the device. When low, TG and BG are forced
low.
4
3
VIN
Supply power for the bottom gate driver and the internal control circuitry. Connect to input power
rail of the converter and dcouple with a 1µF ceramic with lead length no more than 0.2" (5mm).
54
BG
Output gate drive for the bottom (synchronous) MOSFET. An internal 20Kohm resistor is
connected from this pin to PGND.
6 5 PGND Supply power ground return. Keep this pin close to the bottom MOSFET source during layout.
Connect this pin to the power phase node of the synchronous buck converter (source of top
MOSFET and drain of bottom MOSFET). The DRN pin provides a return path for top gate drive.
7 6 DRN Its voltage is deteced for adaptive shoot-through protection. This pin is subjected to a negative
spike of -8V relative to PGND without affecting the operation. An internal 20Kohm resistor is
connected from this pin to PGND.
87
TG Output gate drive for the top (switching) MOSFET.
Ordering Information
Device
SC1218STRT (1)(3)
Package
SOIC-8
Temp Range (TJ)
0° to 150°C
SC1218MLTRT (2)(3)
MLPQ-8
0° to 150°C
Note:
(1) Only available in tape and reel packaging. A reel contains 2500 devices.
(2) Only available in tape and reel packaging. A reel contains 3000 devices.
(3) Devices are lead-free and fully WEEE and RoHS compliant.
2005 Semtech Corp.
5
www.semtech.com
5 Page 
POWER MANAGEMENT
Outline Drawing - SOIC-8
SC1218
www.DataSheet4U.com
2X E/2
A
N
eD
E1 E
12
ccc C
2X N/2 TIPS
e/2
B
aaa C
SEATING
PLANE
C
D
A2 A
A1
bxN
bbb C A-B D
DIMENSIONS
DIM
INCHES
MIN NOM MAX
MILLIMETERS
MIN NOM MAX
A .053 - .069 1.35 - 1.75
A1 .004 - .010 0.10 - 0.25
A2 .049 - .065 1.25 - 1.65
b .012 - .020 0.31 - 0.51
c .007 - .010 0.17 - 0.25
D .189 .193 .197 4.80 4.90 5.00
E1 .150 .154 .157 3.80 3.90 4.00
E .236 BSC
6.00 BSC
e .050 BSC
1.27 BSC
h .010 - .020 0.25 - 0.50
L .016 .028 .041 0.40 0.72 1.04
L1 (.041)
(1.04)
N8
8
01 0° - 8° 0° - 8°
aaa .004
0.10
bbb .010
0.25
ccc .008
0.20
h
h
H
GAGE
PLANE
c
SIDE VIEW
0.25
SEE DETAIL A
L
(L1)
DETAIL A
01
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H-
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
4. REFERENCE JEDEC STD MS-012, VARIATION AA.
Land Pattern - SOIC-8
X
(C)
P
2005 Semtech Corp.
GZ
Y
DIM
C
G
P
X
Y
Z
DIMENSIONS
INCHES MILLIMETERS
(.205)
(5.20)
.118 3.00
.050 1.27
.024 0.60
.087 2.20
.291 7.40
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2. REFERENCE IPC-SM-782A, RLP NO. 300A.
11 www.semtech.com
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet SC1218.PDF ] | |
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