73M2901CE PDF даташит
Спецификация 73M2901CE изготовлена «Teridian Semiconductor» и имеет функцию, называемую «V.22bis Single Chip Modem». |
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Детали детали
Номер произв | 73M2901CE |
Описание | V.22bis Single Chip Modem |
Производители | Teridian Semiconductor |
логотип |
27 Pages
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Simplifying System Integration™
DS_2901CE_031
DESCRIPTION
The 73M2901CE low speed modem integrates a
data pump, controller, and analog front end in a
3.3 V device with a powerful "AT" command host
interface. The modem reduces external
component count/cost by incorporating many
features like parallel phone detect, Line-In-Use
and Ring detection in software without requiring
additional components.
The device is a "one chip fits all” solution for
applications including set-top boxes, point-of-sale
terminals, automatic teller machines, utility
meters, vending machines and smart card
readers.
Another distinctive feature of this device is pin
compatibility with Teridian’s flagship embedded
hard modems, the 73M2901CL, and the
73M1903 soft modem AFE. This offers
customers a cost effective method to design for
both hard or soft modem solutions in the same
system as a risk-free cost reduction path.
Complete support, modem reference designs
and error correction software are part of the
solution offered by Teridian. Our in-house
application engineering team is here to help
meet your international certification needs.
www.DataSheet4U.com
73M2901CE
V.22bis Single Chip Modem
DATA SHEET
January 2010
FEATURES
• True one chip solution for embedded systems
• As low as 9.5 mA operating with standby and
power down mode available
• Power supply operation from 3.6 V to 2.7 V
• Data modes and speeds:
V.22bis – 2400 bps
V.22/Bell212 – 1200 bps
V.21/Bell103 – 300 bps
V.23 – 1200/75 bps (with PAVI turnaround)
Bell202 – 1200 bps
Bell202/V23 1200 bps FDX 4-wire operation
• V.22/Bell 212A/V.22bis synchronous modes
• International Call Progress support:
FCC part 68, CTR21, JATE, etc.
• DTMF generation and detection
• Worldwide Caller ID capability
U.S. Type I and II support
• EIA 777A compliant
• SIA-2000 compliant
• SMS messaging support
• On chip hybrid driver
• Blacklisting capability
• Line-In-Use and Parallel Pick-Up (911) detection
with voltage or low cost energy detection method
• Incoming ring energy detection through CID
path; no optocoupler circuitry required
• Manufacturing Self Test capability
• Backward compatible with 73M2901CL
• Packaging: 32 lead QFN, 32-pin TQFP
Rev. 3.4
© 2010 Teridian Semiconductor Corporation
1
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73M2901CE Data Sheet
DS_w2w90w1.DCatEaS_he0e3t41U.com
Table of Contents
1 Hardware Description.................................................................................................................... 4
1.1 Power Supply ....................................................................................................................... 4
1.2 Low Power Mode .................................................................................................................. 4
1.3 Analog Line / Hybrid Interface ............................................................................................... 4
1.4 Interrupt Pins ........................................................................................................................ 4
1.5 Crystal Oscillator................................................................................................................... 5
1.5.1 Specifying a Crystal..................................................................................................... 5
1.6 Reset.................................................................................................................................... 5
1.7 Asynchronous and Synchronous Serial Data Interface .......................................................... 5
2 Pinout............................................................................................................................................. 6
3 Pin Descriptions ............................................................................................................................ 7
3.1 Power Pins ........................................................................................................................... 7
3.2 Analog Interface Pins............................................................................................................ 7
3.3 Digital Interface Pins ............................................................................................................. 7
3.4 External Interrupt Pins .......................................................................................................... 8
3.5 Oscillator Pins....................................................................................................................... 8
4 Electrical Specifications................................................................................................................ 9
4.1 Absolute Maximum Ratings................................................................................................... 9
4.2 Recommended Operating Conditions.................................................................................... 9
4.3 Receiver ............................................................................................................................... 9
4.4 Transmitter ......................................................................................................................... 10
4.5 Maximum Transmit Level .................................................................................................... 10
4.6 DC Characteristics, Vcc = 3.3 V .......................................................................................... 11
4.6.1 DC Supply Current, VDD = 2.7 V (Battery EOL)......................................................... 11
4.6.2 DC Supply Current , VDD = 3.0 V .............................................................................. 11
4.6.3 DC Supply Current VDD = 3.3 V................................................................................ 12
4.6.4 DC Supply Current VDD = 3.6 V................................................................................ 12
5 Firmware Description .................................................................................................................. 13
5.1 Firmware Overview ............................................................................................................. 13
5.2 Firmware Features.............................................................................................................. 13
6 Design Considerations................................................................................................................ 14
6.1 Layout Considerations ........................................................................................................ 14
6.2 73M2901CE Design Compatibility....................................................................................... 15
6.3 Telephone Line Interface .................................................................................................... 15
6.4 Functional Considerations................................................................................................... 16
6.4.1 SMS and V.23 Half Duplex ........................................................................................ 16
6.4.2 Leased Line Mode..................................................................................................... 16
6.4.3 73M2901CE Energy Ring Detection .......................................................................... 17
6.4.4 Caller ID Mode Changes ........................................................................................... 18
6.4.5 Selectable Answer Tone Frequency Detection........................................................... 18
6.4.6 73M2901CE S99 Country Code Support ................................................................... 18
7 Reference Designs ...................................................................................................................... 21
7.1 Low Cost Design Using DSP Ring and Status Monitoring.................................................... 21
7.2 Reference Design Using Traditional Hardware Line Monitoring ........................................... 22
8 Modem Performance Characteristics ......................................................................................... 23
8.1 BER versus SNR ................................................................................................................ 23
8.2 BER versus Receive Level.................................................................................................. 23
9 Package Mechanical Drawing ..................................................................................................... 24
9.1 32-Pin QFN ........................................................................................................................ 24
9.2 32-Pin TQFP....................................................................................................................... 25
10 Ordering Information................................................................................................................... 26
11 Related Documentation............................................................................................................... 26
12 Contact Information..................................................................................................................... 26
Revision History .................................................................................................................................. 27
2 Rev. 3.4
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DS_2901CE_031
73M2901CEwwDwa.DtaataSShheeete4Ut .com
Figures
Figure 1: 32-Pin QFN Pinout ................................................................................................................ 6
Figure 2: 32-Pin TQFP Pinout.................................................................................................................. 6
Figure 3: Low Cost Design Using DSP Ring and Status Monitoring........................................................ 21
Figure 4: 73M2901CE Worldwide Demo Board: Daughter Board Schematic .......................................... 22
Figure 5: BER versus SNR .................................................................................................................... 23
Figure 6: BER versus Receive Level ...................................................................................................... 23
Figure 7: 32-Pin QFN Drawing............................................................................................................... 24
Figure 8: 32-Pin TQFP Drawing ............................................................................................................. 25
Tables
Table 1: 73M2901CE QFN and TQFP Pinout........................................................................................... 6
Table 2: Leased Line Initialization Commands ....................................................................................... 16
Table 3: Approximate Thresholds for Energy Ring Detection.................................................................. 17
Table 4: 73M2901CE Order Numbers and Packaging Marks.................................................................. 26
Rev. 3.4
3
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Номер в каталоге | Описание | Производители |
73M2901CE | V.22bis Single Chip Modem | Teridian Semiconductor |
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73M2901CLIGV | V.22 BIS SINGLE CHIP MODEM | ETC |
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