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Datasheet CD3161CS Equivalent ( PDF ) |
| N.º | Número de pieza | Descripción | Fabricantes | Category |
| 1 | CD3161CS | Dual Low Noise Equalizer Pre-amp »ª¾§Ë«¼«µç·
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CD3161CS
1. ¸ÅÊöÓëÌصã
CD3161CS ÊÇÒ»¿é˫ͨµÀÇ°Ö÷Ŵóµç· ÄÚÖÃÎÈѹµç· ÔëÉùµÍ ÍâΧԪ¼þÉÙ ·â×°ÐÎʽ SIP8 ÎƲ¨ÒÖÖÆÐÔÁ¼ºÃ ÆäÌصãÈçÏÂ
2. ¹¦ÄÜ¿ |  China Hua Jing Electronics | data |
CD3 Datasheet ( Hoja de datos ) - resultados coincidentes |
| N.º | Número de pieza | Descripción | Fabricantes | Catagory |
| 1 | CD3001 | NPN Silicon Planar Epitaxial Transistor Continental Device India Limited
An IS/ISO 9002 and IECQ Certified Manufacturer
IS/ISO 9002 Lic# QSC/L- 000019.2
NPN SILICON PLANAR EPITAXIAL TRANSISTOR
CD13001 TO - 92 Plastic Package
ABSOLUTE MAXIMUM RATING (Ta =25ºC ) DESCRIPTION SYMBOL VCBO Collector Base Voltage V Collector Emitter Voltage  Continental transistor | | |
| 2 | CD3010 | Compact LED Dot Matrix Display Series A HALMA GROUP COMPANY
w
w
a D . w
S a t
e e h COMPACT LED DOT MATRIX DISPLAY (CD3010) SERIES
SPECIFICATION DATA
U 4 t
m o .c
FRONT VIEW
BACK VIEW
TOP VIEW
Description
Compact LED Dot Matrix Display (CD3010 series) provides option for serial or parallel connection. Configuration of the fl  AGC led | | |
| 3 | CD3010GO | Infrared remote control transmitter IC WINNING
¹ãÖÝÊа¬ìûµç×ӿƼ ÓÐÏÞ¹«Ë¾
CD3010GO
红外遥控发射电路
概述
CD3010GO 是一种红外遥控发射集成电路，主要用于电视机、磁带录像机、音响设备、多媒体 系统和个人计算机上。
功能特点
CMOS 工艺制造 低电压工作  ETC data | | |
| 4 | CD3016B | 1 WATT CAPABILITY WITH PROPER HEAT SINKING • 1N3016B THRU 1N3045B AVAILABLE IN JANHC PER MIL-PRF-19500/115 • 1 WATT CAPABILITY WITH PROPER HEAT SINKING • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW
CD3016B thru CD3045B
MAXI  Compensated Deuices Incorporated data | | |
| 5 | CD3017B | 1 WATT CAPABILITY WITH PROPER HEAT SINKING • 1N3016B THRU 1N3045B AVAILABLE IN JANHC PER MIL-PRF-19500/115 • 1 WATT CAPABILITY WITH PROPER HEAT SINKING • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW
CD3016B thru CD3045B
MAXI Compensated Deuices Incorporated data | | |
| 6 | CD3018B | 1 WATT CAPABILITY WITH PROPER HEAT SINKING • 1N3016B THRU 1N3045B AVAILABLE IN JANHC PER MIL-PRF-19500/115 • 1 WATT CAPABILITY WITH PROPER HEAT SINKING • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW
CD3016B thru CD3045B
MAXI Compensated Deuices Incorporated data | | |
| 7 | CD3019B | 1 WATT CAPABILITY WITH PROPER HEAT SINKING • 1N3016B THRU 1N3045B AVAILABLE IN JANHC PER MIL-PRF-19500/115 • 1 WATT CAPABILITY WITH PROPER HEAT SINKING • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW
CD3016B thru CD3045B
MAXI Compensated Deuices Incorporated data | |
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