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PDF NCV33164 Data sheet ( Hoja de datos )
| Número de pieza | NCV33164 | |
| Descripción | Micropower Undervoltage Sensing Circuits | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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MC34164, MC33164,
NCV33164
Micropower Undervoltage
Sensing Circuits
The MC34164 series are undervoltage sensing circuits specifically
designed for use as reset controllers in portable microprocessor based
systems where extended battery life is required. These devices offer
the designer an economical solution for low voltage detection with a
single external resistor. The MC34164 series features a bandgap
reference, a comparator with precise thresholds and built−in hysteresis
to prevent erratic reset operation, an open collector reset output
capable of sinking in excess of 6.0 mA, and guaranteed operation
down to 1.0 V input with extremely low standby current. The MC
devices are packaged in 3−pin TO−92 (TO−226AA), micro size
TSOP−5, 8−pin SOIC−8 and Micro8™ surface mount packages. The
NCV device is packaged in SOIC−8.
Applications include direct monitoring of the 3.0 V or 5.0 V
MPU/logic power supply used in appliance, automotive, consumer,
and industrial equipment.
Features
• Temperature Compensated Reference
• Monitors 3.0 V (MC34164−3) or 5.0 V (MC34164−5) Power Supplies
• Precise Comparator Thresholds Guaranteed Over Temperature
• Comparator Hysteresis Prevents Erratic Reset
• Reset Output Capable of Sinking in Excess of 6.0 mA
• Internal Clamp Diode for Discharging Delay Capacitor
• Guaranteed Reset Operation With 1.0 V Input
• Extremely Low Standby Current: As Low as 9.0 mA
• Economical TO−92 (TO−226AA), TSOP−5, SOIC−8 and Micro8
Surface Mount Packages
• NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
• Pb−Free Packages are Available
Input
Reset
http://onsemi.com
123 1 2 3
STRAIGHT LEAD
BULK PACK
BENT LEAD
TAPE & REEL
AMMO PACK
TO−92 (TO−226AA)
P SUFFIX
CASE 29
5
1
TSOP−5
SN SUFFIX
CASE 483
8
1
SOIC−8
D SUFFIX
CASE 751
8
1
Micro8
DM SUFFIX
CASE 846A
PIN CONNECTIONS
Reset 1
Input 2
N.C. 3
Ground 4
8 N.C.
7 N.C.
6 N.C.
5 N.C.
(Top View)
TSOP−5
Pin 1. Ground
2. Input
3. Reset
4. NC
5. NC
TO−92
Pin 1. Reset
2. Input
3. Ground
1.2 Vref
GND
Figure 1. Representative Block Diagram
This device contains 28 active transistors.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
=
Sink Only
Positive True Logic
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 8 of this data sheet.
© Semiconductor Components Industries, LLC, 2009
April, 2009 − Rev. 18
www.DataSheet.in
1
Publication Order Number:
MC34164/D
1 page  
MC34164, MC33164, NCV33164
4.0
Vin = 2.4 V
3.0
2.0 TA = 25°C
TA = 70°C
TA = 0°C
TA = 25°C
TA = 0°C
1.0
TA = 70°C
0
0 4.0 8.0 12 16
VSink, SINK CURRENT (mA)
Figure 10. MC3X164−3 Reset Output
Saturation versus Sink Current
20
4.0
Vin, Reset = 4 V
3.0
TA = 25°C
TA = 70°C
TA = 0°C
TA = 25°C
2.0
TA = 0°C
1.0
TA = 70°C
0
0 4.0 8.0 12 16
ISink, SINK CURRENT (mA)
Figure 11. MC3X164−5 Reset Output
Saturation versus Sink Current
20
32
24
Vin = 0 V
TA = 25°C
16
8.0
0
0 0.4 0.8 1.2 1.6
VF , FORWARD VOLTAGE (V)
Figure 12. Clamp Diode Forward Current
versus Voltage
Reset
90%
5.0 V
Vin
4.0 V
Vin
5.0V
10 4.0V
%
Ref
Vin = 5.0 V to 4.0 V
RL = 43 k
TA = 25°C
43k
Reset
5.0 ms/DIV
Figure 13. Reset Delay Time
(MC3X164−5 Shown)
www.DataSheet.in
Power
Supply
Input
Reset
R
Reset
CDLY
Microprocessor
Circuit
1.2 Vref
GND
ǒ ǓtDLY = RCDLY In
1
1 − Vth(MPU)
Vin
A time delayed reset can be accomplished with the addition of CDLY. For systems with extremely fast power
supply rise times (< 500 ns) it is recommended that the RCDLY time constant be greater than 5.0 ms. Vth(MPU) is
the microprocessor reset input threshold.
Figure 14. Low Voltage Microprocessor Reset
http://onsemi.com
5
5 Page 
MC34164, MC33164, NCV33164
PACKAGE DIMENSIONS
−X−
A
SOIC−8
D SUFFIX
CASE 751−07
ISSUE AJ
B
−Y−
−Z−
H
85
S 0.25 (0.010) M Y M
1
4
K
G
D
C
SEATING
PLANE
N X 45 _
0.10 (0.004)
M
J
0.25 (0.010) M Z Y S X S
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 4.80 5.00 0.189 0.197
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.053 0.069
D 0.33 0.51 0.013 0.020
G 1.27 BSC 0.050 BSC
H 0.10 0.25 0.004 0.010
J 0.19 0.25 0.007 0.010
K 0.40 1.27 0.016 0.050
M 0_ 8_ 0_ 8_
N 0.25 0.50 0.010 0.020
S 5.80 6.20 0.228 0.244
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
ǒ ǓSCALE 6:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.DataSheet.in
http://onsemi.com
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet NCV33164.PDF ] | |
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