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PDF NTS2101P Data sheet ( Hoja de datos )
| Número de pieza | NTS2101P | |
| Descripción | Power MOSFET ( Transistor ) | |
| Fabricantes | ON Semiconductor | |
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NTS2101P
Power MOSFET
−8.0 V, −1.4 A, Single P−Channel, SC−70
Features
• Leading Trench Technology for Low RDS(on) Extending Battery Life
• −1.8 V Rated for Low Voltage Gate Drive
• SC−70 Surface Mount for Small Footprint (2 x 2 mm)
• Pb−Free Package is Available
Applications
• High Side Load Switch
• Charging Circuit
• Single Cell Battery Applications such as Cell Phones,
Digital Cameras, PDAs, etc.
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Units
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Steady TA = 25°C
State
TA = 70°C
t ≤ 5 s TA = 25°C
Steady TA = 25°C
State
VDSS
VGS
ID
PD
−8.0
±8.0
−1.4
−1.1
−1.5
0.29
V
V
A
A
W
t≤5s
0.33 W
Pulsed Drain Current
tp = 10 ms
Operating Junction and Storage Temperature
Source Current (Body Diode), Continuous
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
IDM
TJ,
TSTG
IS
TL
−3.0
−55 to
150
−0.46
260
A
°C
A
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Units
Junction−to−Ambient – Steady State (Note 1) RqJA
430 °C/W
Junction−to−Ambient − t ≤ 5 s (Note 1)
RqJA
375
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
www.D1a.taSuhrefaect4eU−m.cooumnted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
http://onsemi.com
V(BR)DSS
−8.0 V
RDS(on) Typ
65 mW @ −4.5 V
78 mW @ −2.5 V
117 mW @ −1.8 V
ID Max
−1.4 A
P−Channel MOSFET
S
G
D
3
1
2
SC−70/SOT−323
CASE 419
STYLE 8
MARKING DIAGRAM &
PIN ASSIGNMENT
Drain
3
TS M G
G
12
Gate Source
TS = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping†
NTS2101PT1 SOT−323 3000/Tape & Reel
NTS2101PT1G
SOT−323
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 1
1
Publication Order Number:
NTS2101P/D
1 page  
NTS2101P
PACKAGE DIMENSIONS
D
e1
3
HE
1
E
2
b
e
0.05 (0.002)
A1
A
SC−70 (SOT−323)
CASE 419−04
ISSUE M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
MILLIMETERS
INCHES
DIM MIN NOM MAX
MIN NOM MAX
A 0.80
0.90
1.00
0.032 0.035 0.040
A1 0.00
0.05
0.10
0.000 0.002 0.004
A2 0.7 REF
0.028 REF
b 0.30 0.35 0.40 0.012 0.014 0.016
c 0.10 0.18 0.25 0.004 0.007 0.010
D 1.80
2.10
2.20
0.071 0.083 0.087
E 1.15
1.24
1.35
0.045 0.049 0.053
e 1.20 1.30 1.40
e1 0.65 BSC
0.047 0.051 0.055
0.026 BSC
L 0.425 REF
0.017 REF
A2
c
H E 2.00
2.10
2.40
0.079 0.083 0.095
STYLE 8:
PIN 1. GATE
L
2. SOURCE
3. DRAIN
SOLDERING FOOTPRINT*
0.65
0.025
0.65
0.025
1.9
0.075
0.9
0.035
0.7
0.028
ǒ ǓSCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer
www.DatapuSrchheaseet4orUus.ceoSmCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
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http://onsemi.com
5
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
NTS2101P/D
5 Page | ||
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