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PDF NTJS3157N Data sheet ( Hoja de datos )

Número de pieza NTJS3157N
Descripción Trench Power MOSFET
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NTJS3157N
Trench Power MOSFET
20 V, 4.0 A, Single NChannel, SC88
Features
Leading Trench Technology for Low RDS(ON) Extending Battery Life
Fast Switching for Increased Circuit Efficiency
SC88 Small Outline (2 x 2 mm) for Maximum Circuit Board
Utilization, Same as SC706
PbFree Packages are Available
Applications
DCDC Conversion
Low Side Load Switch
Cell Phones, Computing, Digital Cameras, MP3s and PDAs
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value
DraintoSource Voltage
GatetoSource Voltage
Continuous Drain
Current (Note 1)
Steady
State
Power Dissipation
(Note 1)
t5s
Steady
State
TA = 25 °C
TA = 85 °C
TA = 25 °C
TA = 25 °C
VDSS
VGS
ID
PD
20
±8.0
3.2
2.3
4.0
1.0
Pulsed Drain Current
tp = 10 ms
Operating Junction and Storage Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
IDM
TTSJT,G
IS
TL
10
55 to
150
1.6
260
Unit
V
V
A
W
A
°C
A
°C
THERMAL RESISTANCE RATINGS (Note 1)
Parameter
Symbol Max Unit
JunctiontoAmbient – Steady State
RqJA
125 °C/W
JunctiontoAmbient t 5 s
RqJA
80
JunctiontoLead – Steady State
RqJL
45
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
www.DataSheet4U.com
V(BR)DSS
20 V
http://onsemi.com
RDS(on) Typ
45 mW @ 4.5 V
55 mW @ 2.5 V
70 mW @ 1.8 V
ID Max
4.0 A
SC88 (SOT363)
D1
6D
D2
5D
G3
4S
Top View
1
SOT363
CASE 419B
STYLE 28
MARKING DIAGRAM &
PIN ASSIGNMENT
DDS
6
T92 M G
G
1
DDG
T92 = Device Code
M = Date Code
G = PbFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
February, 2006 Rev. 2
1
Publication Order Number:
NTJS3157N/D

1 page




NTJS3157N pdf
NTJS3157N
ORDERING INFORMATION
Device
Package
Shipping
NTJS3157NT1
SC88
3000 Tape & Reel
NTJS3157NT1G
SC88
(PbFree)
3000 Tape & Reel
NTJS3157NT2
NTJS3157NT2G
SC88
SC88
(PbFree)
3000 Tape & Reel
3000 Tape & Rweewl w.DataSheet4U.com
NTJS3157NT4
SC88
10,000 Tape & Reel
NTJS3157NT4G
SC88
(PbFree)
10,000 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
5

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