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PDF NTTFS4823N Data sheet ( Hoja de datos )

Número de pieza NTTFS4823N
Descripción Power MOSFET ( Transistor )
Fabricantes ON Semiconductor 
Logotipo ON Semiconductor Logotipo



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No Preview Available ! NTTFS4823N Hoja de datos, Descripción, Manual

NTTFS4823N
Power MOSFET
30 V, 50 A, Single NChannel, m8FL
Features
Small Footprint (3.3 x 3.3 mm) for Compact Design
Low RDS(on) to Minimize Conduction Losses
Low Capacitance to Minimize Driver Losses
This is a PbFree Device
Applications
DCDC Converters
High Side Switching
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
DraintoSource Voltage
GatetoSource Voltage
Continuous Drain
Current RqJA (Note 1)
Power Dissipation RqJA
(Note 1)
TA = 25°C
TA = 85°C
TA = 25°C
VDSS
VGS
ID
PD
30
±20
12.6
9.1
2.1
V
V
A
W
Continuous Drain
C(Nuortreen1t)RqJA 10 s
TA = 25°C
TA = 85°C
ID
17.5 A
12.6
Power Dissipation
RqJA 10 s (Note 1)
Continuous Drain
Current RqJA (Note 2)
Steady
State
TA = 25°C
TC = 25°C
TC = 85°C
Power Dissipation
RqJA (Note 2)
TC = 25°C
Continuous Drain
Current RqJC (Note 1)
TC = 25°C
TC = 85°C
Power Dissipation
RqJC (Note 1)
TC = 25°C
Pulsed Drain Current
TA = 25°C, tp = 10 ms
Current Limited by Pkg.
TA = 25°C
Operating Junction and Storage Temperature
Source Current (Body Diode)
Drain to Source DV/DT
PD
ID
PD
ID
PD
IDM
IDmaxPkg
TJ,
Tstg
IS
dV/dt
4.0
7.1
5.1
0.66
50
36
32.9
150
90
55 to
+150
33
6
W
A
W
A
W
A
A
°C
A
V/ns
Single Pulse DraintoSource Avalanche Energy
(TJ = 25°C, VDD = 50 V, VGS = 10 V,
IL = 25 Apk, L = 0.1 mH, RG = 25 W)
www.DaL(t1ae/Sa8hdefTreoetmm4Upce.acrsaoetmufroer
for
10
Soldering
s)
Purposes
EAS
TL
31 mJ
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu.
2. Surfacemounted on FR4 board using the minimum recommended pad size.
http://onsemi.com
V(BR)DSS
30 V
RDS(on) MAX
10.5 mW @ 10 V
17.5 mW @ 4.5 V
ID MAX
50 A
NChannel MOSFET
D (58)
G (4)
S (1,2,3)
1
WDFN8
(m8FL)
CASE 511AB
FLAT LEAD
MARKING DIAGRAM
1
SD
S 4823 D
S AYWWG D
GGD
4823
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= PbFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping
NTTFS4823NTAG WDFN8 1500/Tape & Reel
(PbFree)
NTTFS4823NTWG WDFN8 5000/Tape & Reel
(PbFree)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2009
June, 2009 Rev. 2
1
Publication Order Number:
NTTFS4823N/D

1 page




NTTFS4823N pdf
NTTFS4823N
TYPICAL CHARACTERISTICS
1600
1400
1200
VGS = 0 V
TJ = 25°C
1000
800
Ciss
600
400 Coss
200
0 Crss
0
5
10 15 20 25 30
GATETOSOURCE OR DRAINTOSOURCE VOLTAGE (V)
Figure 7. Capacitance Variation
1000
100
VDD = 15 V
ID = 15 A
VGS = 10 V
10
td(off)
tf
tr
td(on)
12
QT
10
8
6
4 Qgs
Qgd
VGS
2 ID = 20 A
0 TJ = 25°C
0 2 4 6 8 10 12 14 16
Qg, TOTAL GATE CHARGE (nC)
Figure 8. GatetoSource and
DraintoSource Voltage vs. Total Charge
20
VGS = 0 V
TJ = 25°C
15
10
5
1
1 10 100
RG, GATE RESISTANCE (W)
Figure 9. Resistive Switching Time Variation
vs. Gate Resistance
1000
100
10 ms
10 100 ms
1 ms
1 VGS = 20 V
Single Pulse
TC = 25°C
0.1
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RDS(on) Limit
Thermal Limit
0.01 Package Limit
0.1 1
10 ms
dc
10 100
VDS, DRAINTOSOURCE VOLTAGE (V)
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
0
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
VSD, SOURCETODRAIN VOLTAGE (V)
Figure 10. Diode Forward Voltage vs. Current
40
ID = 25 A
30
20
10
0
25 50 75 100 125 150
TJ, STARTING JUNCTION TEMPERATURE(°C)
Figure 12. Maximum Avalanche Energy vs.
Starting Junction Temperature
http://onsemi.com
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