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PDF NCP5623C Data sheet ( Hoja de datos )
| Número de pieza | NCP5623C | |
| Descripción | Triple Output I2C Controlled RGB LED Driver | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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NCP5623C
Triple Output I2C Controlled
RGB LED Driver
The NCP5623C mixed analog circuit is a triple output LED driver
dedicated to the RGB illumination or backlight LCD display.
The built−in DC/DC converter is based on a high efficient charge
pump structure with operating mode 1x and 2x. It provides a 94% peak
efficiency. The tiny package makes the device suitable for room
limited portable applications.
Features
• 2.7 to 5.5 V Input Voltage Range
• RGB Function Fully Supported
• Programmable Integrated Gradual Dimming
• 90 mA Output Current Capability
• 94% Peak Efficiency
• Built−in Short Circuit Protection
• Provides Three Independent LED Drives
• Support I2C Protocol
• Embedded OVP / Open Load Protection
• This is a Pb−Free Device
Typical Applications
• Multicolor Illuminations
• Portable Back Light
• Digital Cellular Phone Camera Photo Flash
• LCD and Key Board Simultaneous Drive
+Vcc
MCU
I2C Port
GND
+Vbat
1 mF/6.3 V
C1
GND
11
SDA
SCL
7
9
6
GND R1 8
62 k
GND
C3
220 nF
1 12
C1P
Vbat
SDA
SCL
C1N 10
Vout
LED3 3
LED2 4
AGND
IREF
LED1 5
GND 2
C2
1 mF/10 V
GND
D3
D2
D1
NCP5623C
U1
GND
Figure 1. Typical Multiple White LED Driver
http://onsemi.com
LLGA12
MU SUFFIX
CASE 513AA
1
PIN ASSIGNMENT
2 C1P C1N 11
GND
LED3
1
Vbat
VOUT
LED2
SCL
LED1
AGND
EXPAD
IREF
SDA
6 (Top View) 7
MARKING DIAGRAM
1
GUMG
G
GU = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NCP5623CMUTBG LLGA12 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
July, 2011 − Rev. 1
1
Publication Order Number:
NCP5623C/D
1 page  
NCP5623C
POWER SUPPLY SECTION:
(Typical values are referenced to TA = +25°C, Min & Max values are referenced −40°C to +85°C ambient temperature, unless otherwise
noted), operating conditions 2.85 V < Vbat < 5.5 V, unless otherwise noted.
Pin Symbol
Rating
Min Typ Max Unit
11 Vbat Power Supply
10 Iout Continuous DC current in the load, PWM = 100%
@ Vf = 3.4 V, Vbat = 3.0 V
@ Vf = 3.4 V, 3.3 V < Vbat < 5.5 V
2.7
55
75
5.5 V
mA
10 Isch Continuous Output Short Circuit Current
2.85 V < Vbat < 4.2 V
45 90 mA
10
Vout
Output Voltage Compliance (OVP)
4.4 5.7 V
10 Tstart DC/DC Start time (Cout = 1 mF)
3.0 V < Vbat = nominal < 5.5 V
from last CNTL positive pulse delay to full load operation
150 ms
10 Istdb Stand By Current
3.0 V ≤ Vbat ≤ 4.2 V, Iout = 0 mA
0.8 1.0 mA
10 Iop Operating Current,
@Iout = 0 mA, 3.0 V ≤ Vbat ≤ 4.2 V
350 mA
3,4,5
ITOL RGB Output Current Tolerance
@Vbat = 3.6 V, ILED = 10 mA
−25°C < Ta < 85°C
±3 %
3,4,5
IMATCH
Fpwr
RGB Output Current LED Matching
@Vbat = 3.6 V, ILED = 5.0 mA
Charge Pump Operating Frequency
−40°C < Ta < 85°C
±0.5 %
0.8 1 1.2 MHz
EPWR
Efficiency @ Vbat = 3.6 V
− LED1 to LED3 = 5 mA, Vf = 2.8 V (Total = 15 mA)
− LED1 to LED3 = 20 mA, Vf = 3.2 V (Total = 60 mA)
%
94.2
92.3
http://onsemi.com
5
5 Page 
NCP5623C
PACKAGE DIMENSIONS
LLGA12
CASE 513AA−01
ISSUE O
D AB
PIN ONE
REFERENCE
2X
0.10
2X
C
ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ
0.10 C
TOP VIEW
E
0.10 C
A
12X 0.08 C
SEATING
PLANE
A1
11X L
SIDE VIEW
D2
L1
26
K
1
e/2 12
e 9X
E2
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.50 0.60
A1 0.00 0.05
b 0.15 0.25
D 2.00 BSC
D2 0.80 1.00
E 2.00 BSC
E2 0.55 0.65
e 0.40 BSC
K 0.25 −−−
L 0.30 0.50
L1 0.40 0.60
SOLDERING FOOTPRINT*
0.66
2.06
2.30
1
12X
0.23
0.40
PITCH
0.93 0.91
11 7
BOTTOM VIEW
12X
b
0.10 C A B
0.05 C NOTE 3
11X
0.56
0.63
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
11
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NCP5623C/D
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet NCP5623C.PDF ] | |
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