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Datasheet CIM05J471 Equivalent ( PDF ) |
| N.º | Número de pieza | Descripción | Fabricantes | Category |
| 1 | CIM05J471 | Chip Bead Chip Bead (CIB/CIM Series)
CIB, CIM Series are used for EMI suppression filters.These beads suppress EMI noise by increased impedance, especially by increased resistance at noise frequency. CIB series is composed of mono-layer internal conductor that allows low impedance and low DC resistance. CIM S |  Samsung | data |
| 2 | CIM05J471 | Chip Bead Chip Bead ; CIB/CIM Series
For EMI Suppression
Feature
Smallest beads suitable for surface mounting Perfect shape for automatic mounting, with no directionality. Excellent solderability and high heat resistance for either flow or reflow soldering. Monolithic inorganic material construction for hig | Samsung | data |
CIM Datasheet ( Hoja de datos ) - resultados coincidentes |
| N.º | Número de pieza | Descripción | Fabricantes | Catagory |
| 1 | CIM | Crystals
CIM Crystals
• •
Former
Product
Low-Jitter, Precision Clocks, VCXO’s and TCVCXO’s
MtronPTI reserves the right to make changes to the product(s) and service(s) described herein without notice. No liability is assumed as a result of their use or application.
Please s  MTRONPTI data | | |
| 2 | CIM-130M7 | CIM-xxxx
Mounting center
(4) (4)
Light emission center
2.05
R 1. 1
1.15
1.15
1.025 1.05 0.275 2.8 2.2
1 1. R
2.75
1.05
2.4 8
2.4
Light receiving center
2.9 0.375
100
0.6 3.325 3.325 P0.95±0.1 7=6.65 0.1
Mounting center
80
60
Ie(mW/sr)
40
20
0
50
150
250 IFP(mA)
35  ETC data | | |
| 3 | CIM-51M7 | CIM-xxxx
Mounting center
(4) (4)
Light emission center
2.05
R 1. 1
1.15
1.15
1.025 1.05 0.275 2.8 2.2
1 1. R
2.75
1.05
2.4 8
2.4
Light receiving center
2.9 0.375
100
0.6 3.325 3.325 P0.95±0.1 7=6.65 0.1
Mounting center
80
60
Ie(mW/sr)
40
20
0
50
150
250 IFP(mA)
35 ETC data | | |
| 4 | CIM03J121 | Chip Bead Chip Bead ; CIB/CIM Series
For EMI Suppression
Feature
Smallest beads suitable for surface mounting Perfect shape for automatic mounting, with no directionality. Excellent solderability and high heat resistance for either flow or reflow soldering. Monolithic inorganic material construction for hig Samsung data | | |
| 5 | CIM03J241 | Chip Bead Chip Bead ; CIB/CIM Series
For EMI Suppression
Feature
Smallest beads suitable for surface mounting Perfect shape for automatic mounting, with no directionality. Excellent solderability and high heat resistance for either flow or reflow soldering. Monolithic inorganic material construction for hig Samsung data | | |
| 6 | CIM03N300 | Chip Bead Chip Bead ; CIB/CIM Series
For EMI Suppression
Feature
Smallest beads suitable for surface mounting Perfect shape for automatic mounting, with no directionality. Excellent solderability and high heat resistance for either flow or reflow soldering. Monolithic inorganic material construction for hig Samsung data | | |
| 7 | CIM03N800 | Chip Bead Chip Bead ; CIB/CIM Series
For EMI Suppression
Feature
Smallest beads suitable for surface mounting Perfect shape for automatic mounting, with no directionality. Excellent solderability and high heat resistance for either flow or reflow soldering. Monolithic inorganic material construction for hig Samsung data | |
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