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PDF NCN7200 Data sheet ( Hoja de datos )
| Número de pieza | NCN7200 | |
| Descripción | Gigabit Ethernet LAN Switch | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de NCN7200 (archivo pdf) en la parte inferior de esta página. Total 10 Páginas | ||
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NCN7200
Gigabit Ethernet LAN
Switch with 2:1 Mux/
DeMux and Power-down
Feature
The NCN7200 is pin−compatible to the PI3L720ZHE and comes in
a 42−pin WQFN package (3.5 mm x 9 mm x 0.5 mm Pitch). The
NCN7200 is an 8−channel, bidirectional switch with a power
shutdown feature that puts all outputs in a high−impedance state. The
switch is compatible with 10/100/1000 Base−T Ethernet standards.
The device has 3 additional lines for status indicator LEDs which are
switched together with the Ethernet pairs.
Features
• 2:1 Mux/ DeMux LAN Switch
• Three Extra Channels Facilitate LED Switching
• Fully Specified for Power Supply Range: 3 V to 3.6 V
• Powerdown Feature Conserves Energy
• ESD Protection
♦ 8 kV HBM (Human Body Model, I/O to GND)
♦ 10 kV Contact Discharge (IEC61000−4−2)
• Low Crosstalk: −70 dB
• Pin−to−Pin Replacement for PI3L720ZHE
• This is a Pb−Free Device
Typical Applications
• Routes signals for 10/100/1000 Mbps Ethernet
• Facilitates Docking System by Interfacing One Controller to Dual
Connectors
http://onsemi.com
MARKING
DIAGRAM
1
WQFN42
CASE 510AP
NCN7200
AWLYYWWG
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G = Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
www.Dat©aSSheemeitc4oUnd.uncetotr Components Industries, LLC, 2011
March, 2011 − Rev. 2
1
Publication Order Number:
NCN7200/D
1 page  
NCN7200
GIGABIT ETHERNET LAN SWITCH WITH 2:1 MUX/ DEMUX AND POWER DOWN FEATURE
(Min / Max values are at VDD = 3.3 V ±10%, TA = −40°C to +85°C. Typ values are at VDD = 3.3 V and TA = 25°C)
Symbol
Description
Test Conditions
Min Typ Max Unit
CONTROL LOGIC (SEL AND PD PINS) DC ELECTRICAL CHARACTERISTICS FOR 1000 BASE−T ETHERNET SWITCHING
VIH Input HIGH Voltage
Guaranteed HIGH level
2.0
VIL Input LOW Voltage
Guaranteed LOW level
−0.5
0.8
VIK Clamp Diode Voltage
VDD = Max, IIN = −18 mA
−0.7 −1.0
IIHSEL
Input HIGH Current (SEL)
VDD = Max, VIN = VDD
±0.1
IIHPD
Input High Current (PD)
VDD = Max, VIN = VDD
±1.2
IIL Input LOW Current
VDD = Max, VIN = GND
±0.1
IOFF Off−Leakage Current (SEL)
VDD = 0 V, VIN = 0 V to VDD
±0.1
DATA PATH (AX TO BX, CX PINS) DC ELECTRICAL CHARACTERISTICS FOR 1000 BASE−T ETHERNET SWITCHING
V
mA
RON
RFLAT(ON)
Switch On−Resistance (Note 3)
On−Resistance Flatness (Note 3)
VDD = Min, 1.5 V < VIN < VDD, ITN = −40 mA
VDD = Min, VIN @ 1.5 V and VDD, ITN =
−40 mA
2.0 6.0
0.3
W
DRON
On−Resistance match from center VDD = Min, 1.5 V < VIN < VDD, ITN = −40 mA
ports to any other port (Note 3)
0.5 1.0
ION On Leakage Current (AX)
VDD = 3.6 V, VAX = 0 V or VDD, VOUT = Float −0.1
IOFF Off Leakage Current (AX/BX/CX) VDD = 3.6 V, VIN = 0 V or VDD, VOUT = VDD or −0.1
0V
+0.1
+0.1
mA
mA
DATA PATH (LEDAX TO LEDBX, LEDCX PINS) DC ELECTRICAL CHARACTERISTICS FOR 1000 BASE−T ETHERNET
SWITCHING
RON
RFLAT(ON)
Switch On−Resistance (Note 3)
On−Resistance Flatness (Note 3)
VDD = Min, 1.5 V < VIN < VDD, ITN = −40 mA
VDD = Min, VIN @ 1.5 V and VDD, ITN =
−40 mA
7.0 16
0.3
W
DRON
On−Resistance match from center VDD = Min, 1.5 V < VIN < VDD, ITN = −40 mA
ports to any other port (Note 3)
0.8 1.25
ION On Leakage Current (LEDAX)
IOFF Off Leakage Current
(LEDAX/LEDBX/LEDCX)
VDD = 3.6 V, VAX = 0 V or VDD, VOUT = Float
VDD = 3.6 V, VIN = 0 V or VDD, VOUT = VDD or
0V
−0.1
−0.1
+0.1
+0.1
mA
mA
CONTROL LOGIC (SEL AND PD PINS) DC ELECTRICAL CHARACTERISTICS FOR 10/100 BASE−T ETHERNET SWITCHING
VIH Input HIGH Voltage
Guaranteed HIGH level (Control Pins)
2.0
V
VIL Input LOW Voltage
Guaranteed LOW level (Control Pins)
−0.5
0.8
VIK Clamp Diode Voltage
VDD = Max, IN = −18 mA
−0.7 −1.0
IIHSEL
Input HIGH Current (SEL)
VDD = Max, VIN = VDD
±0.1 mA
IIHPD
Input HIGH Current (PD)
VDD = Max, VIN = VDD
±1.2
IIL Input LOW Current
VDD = Max, VIN = GND
±0.1
IOFF Off−Leakage Current (SEL)
VDD = 0 V, VIN = 0 V to VDD
±0.1
2. Active power represents normal data communication. Standby power is when the device is enabled for operation but there is no LAN traffic
(cable not connected). Power down current is the minimum power state used when not connected and mobile.
3. Measured by the voltage drop between A and B pins at indicated current through the switch. ON resistance is determined by the lower
of the voltages on the two (A & B) pins.
4. Guaranteed by design and/or characterization.
5. The bus switch contributes no propagational delay other than the RC delay of the ON resistance of the switch and the load capacitance.
The time constant for the switch alone is of the order of 0.25 ns for 10 pF load. Since this time constant is much smaller than the rise/fall
times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch when used in
a system is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side.
http://onsemi.com
5
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| PDF Descargar | [ Datasheet NCN7200.PDF ] | |
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