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PDF HI-8594 Data sheet ( Hoja de datos )
| Número de pieza | HI-8594 | |
| Descripción | (HI-8592 - HI-8594) Single-Rail ARINC 429 Differential Line Driver | |
| Fabricantes | Holt Integrated Circuit | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de HI-8594 (archivo pdf) en la parte inferior de esta página. Total 13 Páginas | ||
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www.DataSheet.co.kr
October, 2010
HI-8592, HI-8593, HI-8594
Single-Rail ARINC 429 Differential Line Driver
GENERAL DESCRIPTION
PIN CONFIGURATION (TOP VIEW)
The HI-8592 bus interface product is a silicon gate
CMOS device designed as a line driver in accordance
with the ARINC 429 bus specifications. The part in-
cludes a negative voltage converter allowing it to oper-
ate from a single +5V supply using only two external ca-
pacitors. The part also features high-impedance outputs
(tri-state) when both data inputs are taken high, allowing
multiple line drivers to be connected to a common bus.
The HI-8593 and HI-8594 are reduced pin count ver-
sions of HI-8592 which do not incorporate the negative
voltage converter. These devices are compatible with
Holt’s existing HI-8570 and HI-8571 respectively, with
the added advantage of the tri-state outputs. For even
smaller board footprint, versions are also available in
leadless, surface mount QFN-style packages.
Logic inputs feature built-in 2,000V minimum ESD input
protection as well as 5V or 3.3V logic level compatibility.
Products with 5 Ohm or 37.5 Ohm resistors in series
with each ARINC output are available to allow the use of
external resistors for lightning protection.
The HI-859x series of line drivers are intended for use
where logic signals must be converted to ARINC 429
levels such as when using an FPGA or the HI-3584
ARINC 429 Serial Transmitter/Dual Receiver.
The family of parts are available in Industrial -40oC to
+85oC, or Extended, -55oC to +125oC temperature rang-
es. Optional burn-in is available on the extended tem-
perature range.
V+ 1
SLP 2
TX0IN 3
TX1IN 4
GND 5
CAP+ 6
CAP- 7
14 AMPB
13 TXBOUT
12 AMPA
11 TXAOUT
10 V-
9 GND
8 V+
HI-8592PS
14-PIN PLASTIC SMALL OUTLINE (ESOIC) NB
SLP 1
8 V+
TX0IN 2
TX1IN 3
GND 4
7 TXBOUT
6 TXAOUT
5 V-
HI-8593PS
8-PIN PLASTIC SMALL OUTLINE (ESOIC) NB
SLP 1
8 V+
TX0IN 2
TX1IN 3
GND 4
7 AMPB
6 AMPA
5 V-
HI-8594PS
8-PIN PLASTIC SMALL OUTLINE (ESOIC) NB
(See page 9 for additional package pin configurations)
FEATURES
• Single +5V supply
• Negative voltage generated on-chip (HI-8592)
• Digitally selectable rise and fall times
• Tri-state Outputs
• Plastic 8 & 14-pin thermally enhanced SOIC
packages available
• 5 Ohm or 37.5 Ohm output resistance
• Industrial and Extended temperature ranges
• Burn-in available
Table 1. Function Table
TX1IN
0
0
0
1
1
1
TX0IN
0
1
1
0
0
1
SLP
X
0
1
0
1
X
TXAOUT
0V
-5V
-5V
5V
5V
Hi-Z
TXBOUT
0V
5V
5V
-5V
-5V
Hi-Z
SLOPE
N/A
10μs
1.5μs
10μs
1.5μs
N/A
DS8592 Rev. B
HOLT INTEGRATED CIRCUITS
www.holtic.com
1
10/10
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1 page  
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HI-8592, HI-8593, HI-8594
ELECTRICAL CHARACTERISTICS
Table 3. DC Electrical Characteristics
V+ = +5V, V- = -5V (HI-8593/4 only), TA = Operating Temperature Range (unless otherwise stated)
Parameters
Input Voltage (TX1IN, TX0IN, SLP)
High
Low
Input Current (TX1IN, TX0IN, SLP)
Source
Sink
ARINC Output Voltage (Differential)
one
zero
null
ARINC Output Voltage (Ref. to GND)
one or zero
null
Operating Supply Current
V+
GND
V-
ARINC Output Impedance
TXOUT pins
AMP pins
ARINC Output Tri-State Current
Symbol
VIH
VIL
IIH
IIL
VDIFF1
VDIFF0
VDIFFN
VDOUT
VNOUT
IDD
IGND
IEE
ZOUT
IOZ
Test Conditions
Min
2.1
-
VIN = 0V
VIN = 5V
-
-
no load; TXAOUT - TXBOUT
no load; TXAOUT - TXBOUT
no load; TXAOUT - TXBOUT
9
-11
-0.5
no load & magnitude at pin 4.5
no load
-0.25
SLP = V+
TX1IN & TX0IN = 0V: no load
TX1IN & TX0IN = 0V: no load
TX1IN & TX0IN = 0V: no load
-
-
-16
V- < VOUT < V+, TA = 125oC
TX0IN = TX1IN = V+
-1.0
Typ
-
-
-
-
10
-10
0
5.0
0
22
10
-10
37.5
5
0
Max Units
V+ V
0.5 V
0.1 μA
0.1 μA
11 V
-9 V
0.5 V
5.5 V
0.25 V
28 mA
16 mA
- mA
Ohms
Ohms
+1.0 μA
HOLT INTEGRATED CIRCUITS
5
Datasheet pdf - http://www.DataSheet4U.net/
5 Page 
www.DataSheet.co.kr
HI-8592, HI-8593, HI-8594
PACKAGE DIMENSIONS
14-PIN PLASTIC SMALL OUTLINE (ESOIC) - NB
(Narrow Body, Thermally Enhanced)
.341 ± .004
(8.65 ± .10)
.0085 ± .001
(.220 ± .029)
.236 ± .008
(6.00 ± .20)
Top View
.153 ± .003
(3.87 ± .06)
.100
(2.54)
typ
inches (millimeters)
Package TYPE: 14HNE
.270
(6.86)
typ
Bottom
View
.0165 ± .003
(.419 ± .089)
See Detail A
.055 ± .005
(1.397 ± .13)
Electrically isolated heat sink
pad on bottom of package.
Connect to any ground or
power plane for optimum
thermal dissipation.
(.10.5207)BSC
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
0o to 8o
.033 ± .017
(.838 ± .43)
.0025 ± .0015
(.0635 ± .04)
Detail A
8-PIN PLASTIC SMALL OUTLINE (ESOIC) - NB
(Narrow Body, Thermally Enhanced)
inches (millimeters)
Package Type: 8HNE
Top View
.194 ± .004
(4.92 ± .09)
.0085 ± .0015
(.216 ± .038)
Bottom
View
.140 ± .01
(3.56 ± .26)
.236 ± .008
(5.99 ± .21)
PIN 1
.154 ± .004
(3.90 ± .09)
.100 ± .01
(2.54 ± .25)
.0165 ± .003
(.419 ± .089)
(.10.5207)BSC
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
See Detail A
.055 ± .005
(1.397 ± .127)
0o to 8o
Electrically isolated heat sink
pad on bottom of package.
Connect to any ground or
power plane for optimum
thermal dissipation.
.033 ± .017
(.838 ± .432)
.0025 ± .002
(.064 ± .038)
Detail A
HOLT INTEGRATED CIRCUITS
11
Datasheet pdf - http://www.DataSheet4U.net/
11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet HI-8594.PDF ] | |
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