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W9464G6JH PDF даташит

Спецификация W9464G6JH изготовлена ​​​​«Winbond» и имеет функцию, называемую «1M X 4 BANKS X 16 BITS DDR SDRAM».

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Номер произв W9464G6JH
Описание 1M X 4 BANKS X 16 BITS DDR SDRAM
Производители Winbond
логотип Winbond логотип 

52 Pages
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W9464G6JH Даташит, Описание, Даташиты
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W9464G6JH
1M 4 BANKS 16 BITS DDR SDRAM
Table of Contents-
1. GENERAL DESCRIPTION ......................................................................................................... 4
2. FEATURES ................................................................................................................................. 4
3. KEY PARAMETERS ................................................................................................................... 5
4. PIN CONFIGURATION ............................................................................................................... 6
5. PIN DESCRIPTION..................................................................................................................... 7
6. BLOCK DIAGRAM ...................................................................................................................... 8
7. FUNCTIONAL DESCRIPTION.................................................................................................... 9
7.1 Power Up Sequence....................................................................................................... 9
7.2 Command Function ...................................................................................................... 10
7.2.1
Bank Activate Command ........................................................................... 10
7.2.2
Bank Precharge Command........................................................................ 10
7.2.3
Precharge All Command............................................................................ 10
7.2.4
Write Command ......................................................................................... 10
7.2.5
Write with Auto-precharge Command........................................................ 10
7.2.6
Read Command ......................................................................................... 10
7.2.7
Read with Auto-precharge Command ....................................................... 10
7.2.8
Mode Register Set Command.................................................................... 11
7.2.9
Extended Mode Register Set Command ................................................... 11
7.2.10 No-Operation Command............................................................................ 11
7.2.11 Burst Read Stop Command ....................................................................... 11
7.2.12 Device Deselect Command ....................................................................... 11
7.2.13 Auto Refresh Command ............................................................................ 11
7.2.14 Self Refresh Entry Command .................................................................... 12
7.2.15 Self Refresh Exit Command....................................................................... 12
7.2.16 Data Write Enable /Disable Command ...................................................... 12
7.3 Read Operation............................................................................................................. 12
7.4 Write Operation............................................................................................................. 13
7.5 Precharge ..................................................................................................................... 13
7.6 Burst Termination.......................................................................................................... 13
7.7 Refresh Operation......................................................................................................... 13
7.8 Power Down Mode ....................................................................................................... 14
7.9 Input Clock Frequency Change during Precharge Power Down Mode........................ 14
7.10 Mode Register Operation.............................................................................................. 14
Publication Release Date: Oct. 20, 2011
- 1 - Revision A02
Datasheet pdf - http://www.DataSheet4U.net/









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W9464G6JH Даташит, Описание, Даташиты
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W9464G6JH
7.10.1
7.10.2
7.10.3
7.10.4
7.10.5
7.10.6
7.10.7
Burst Length field (A2 to A0)...................................................................... 14
Addressing Mode Select (A3) .................................................................... 15
CAS Latency field (A6 to A4) ..................................................................... 16
DLL Reset bit (A8) ..................................................................................... 16
Mode Register /Extended Mode register change bits (BA0, BA1)............. 16
Extended Mode Register field.................................................................... 16
Reserved field ............................................................................................ 16
8. OPERATION MODE ................................................................................................................. 17
8.1 Simplified Truth Table................................................................................................... 17
8.2 Function Truth Table..................................................................................................... 18
8.3 Function Truth Table for CKE ....................................................................................... 21
8.4 Simplified Stated Diagram ............................................................................................ 22
9. ELECTRICAL CHARACTERISTICS......................................................................................... 23
9.1 Absolute Maximum Ratings .......................................................................................... 23
9.2 Recommended DC Operating Conditions .................................................................... 23
9.3 Capacitance .................................................................................................................. 24
9.4 Leakage and Output Buffer Characteristics.................................................................. 24
9.5 DC Characteristics ........................................................................................................ 25
9.6 AC Characteristics and Operating Condition................................................................ 26
9.7 AC Test Conditions....................................................................................................... 27
10. SYSTEM CHARACTERISTICS FOR DDR SDRAM................................................................. 29
10.1 Table 1: Input Slew Rate for DQ, DQS, and DM .......................................................... 29
10.2 Table 2: Input Setup & Hold Time Derating for Slew Rate ........................................... 29
10.3 Table 3: Input/Output Setup & Hold Time Derating for Slew Rate ............................... 29
10.4 Table 4: Input/Output Setup & Hold Derating for Rise/Fall Delta Slew Rate................ 29
10.5 Table 5: Output Slew Rate Characteristics (X16 Devices only) ................................... 29
10.6 Table 6: Output Slew Rate Matching Ratio Characteristics ......................................... 30
10.7 Table 7: AC Overshoot/Undershoot Specification for Address and Control Pins......... 30
10.8 Table 8: Overshoot/Undershoot Specification for Data, Strobe, and Mask Pins.......... 31
10.9 System Notes:............................................................................................................... 32
11. TIMING WAVEFORMS ............................................................................................................. 34
11.1 Command Input Timing ................................................................................................ 34
11.2 Timing of the CLK Signals ............................................................................................ 34
11.3 Read Timing (Burst Length = 4) ................................................................................... 35
11.4 Write Timing (Burst Length = 4).................................................................................... 36
11.5 DM, DATA MASK (W9464G6JH) ................................................................................. 37
11.6 Mode Register Set (MRS) Timing................................................................................. 38
Publication Release Date: Oct. 20, 2011
- 2 - Revision A02
Datasheet pdf - http://www.DataSheet4U.net/









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W9464G6JH Даташит, Описание, Даташиты
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W9464G6JH
11.7 Extend Mode Register Set (EMRS) Timing .................................................................. 39
11.8 Auto-precharge Timing (Read Cycle, CL = 2) .............................................................. 40
11.9 Auto-precharge Timing (Read cycle, CL = 2), continued ............................................. 41
11.10 Auto-precharge Timing (Write Cycle) .......................................................................... 42
11.11 Read Interrupted by Read (CL = 2, BL = 2, 4, 8) ........................................................ 43
11.12 Burst Read Stop (BL = 8) ............................................................................................ 43
11.13 Read Interrupted by Write & BST (BL = 8).................................................................. 44
11.14 Read Interrupted by Precharge (BL = 8) ..................................................................... 44
11.15 Write Interrupted by Write (BL = 2, 4, 8) ..................................................................... 45
11.16 Write Interrupted by Read (CL = 2, BL = 8) ................................................................ 45
11.17 Write Interrupted by Read (CL = 3, BL = 4) ................................................................ 46
11.18 Write Interrupted by Precharge (BL = 8) ..................................................................... 46
11.19 2 Bank Interleave Read Operation (CL = 2, BL = 2) ................................................... 47
11.20 2 Bank Interleave Read Operation (CL = 2, BL = 4) ................................................... 47
11.21 4 Bank Interleave Read Operation (CL = 2, BL = 2) ................................................... 48
11.22 4 Bank Interleave Read Operation (CL = 2, BL = 4) ................................................... 48
11.23 Auto Refresh Cycle ..................................................................................................... 49
11.24 Precharge/Activate Power Down Mode Entry and Exit Timing ................................... 49
11.25 Input Clock Frequency Change during Precharge Power Down Mode Timing .......... 49
11.26 Self Refresh Entry and Exit Timing ............................................................................. 50
12. Package Specification............................................................................................................... 51
12.1 66L TSOP 400 mil ..................................................................................................... 51
13. REVISION HISTORY ................................................................................................................ 52
-3-
Publication Release Date: Oct. 20, 2011
Revision A02
Datasheet pdf - http://www.DataSheet4U.net/










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