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PDF W9712G6JB Data sheet ( Hoja de datos )
| Número de pieza | W9712G6JB | |
| Descripción | 2M X 4 BANKS X 16 BIT DDR2 SDRAM | |
| Fabricantes | Winbond | |
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W9712G6JB
2M × 4 BANKS × 16 BIT DDR2 SDRAM
Table of Contents-
1. GENERAL DESCRIPTION ...................................................................................................................4
2. FEATURES ...........................................................................................................................................4
3. KEY PARAMETERS .............................................................................................................................5
4. BALL CONFIGURATION ......................................................................................................................6
5. BALL DESCRIPTION............................................................................................................................7
6. BLOCK DIAGRAM ................................................................................................................................8
7. FUNCTIONAL DESCRIPTION..............................................................................................................9
7.1 Power-up and Initialization Sequence ...................................................................................................9
7.2 Mode Register and Extended Mode Registers Operation ...................................................................10
7.2.1
Mode Register Set Command (MRS)...............................................................................10
7.2.2
Extend Mode Register Set Commands (EMRS) ..............................................................11
7.2.2.1
Extend Mode Register Set Command (1), EMR (1)................................................11
7.2.2.2
DLL Enable/Disable................................................................................................12
7.2.2.3
Extend Mode Register Set Command (2), EMR (2)................................................13
7.2.2.4
Extend Mode Register Set Command (3), EMR (3)................................................14
7.2.3
Off-Chip Driver (OCD) Impedance Adjustment ................................................................15
7.2.3.1
Extended Mode Register for OCD Impedance Adjustment ....................................16
7.2.3.2
OCD Impedance Adjust ..........................................................................................16
7.2.3.3
Drive Mode .............................................................................................................17
7.2.4
On-Die Termination (ODT)...............................................................................................18
7.2.5
ODT related timings .........................................................................................................18
7.2.5.1
MRS command to ODT update delay.....................................................................18
7.3 Command Function.............................................................................................................................20
7.3.1
Bank Activate Command..................................................................................................20
7.3.2
Read Command ...............................................................................................................20
7.3.3
Write Command ...............................................................................................................20
7.3.4
Burst Read with Auto-precharge Command.....................................................................21
7.3.5
Burst Write with Auto-precharge Command .....................................................................21
7.3.6
Precharge All Command ..................................................................................................21
7.3.7
Self Refresh Entry Command ..........................................................................................21
7.3.8
Self Refresh Exit Command .............................................................................................21
7.3.9
Refresh Command ...........................................................................................................22
7.3.10
No-Operation Command ..................................................................................................23
7.3.11
Device Deselect Command..............................................................................................23
7.4 Read and Write access modes ...........................................................................................................23
7.4.1
Posted CAS ....................................................................................................................23
7.4.1.1
Examples of posted CAS operation......................................................................23
Publication Release Date: Mar. 15, 2010
- 1 - Revision A01
Datasheet pdf - http://www.DataSheet4U.net/
1 page  
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W9712G6JB
3. KEY PARAMETERS
SYM.
SPEED GRADE
Bin(CL-tRCD-tRP)
Part Number Extension
@CL = 7
@CL = 6
tCK(avg) Average clock period
@CL = 5
@CL = 4
@CL = 3
tRCD
tRP
tRC
tRAS
IDD0
IDD1
IDD4R
IDD4W
IDD5B
IDD6
IDD7
Active to Read/Write Command Delay Time
Precharge to Active Command Period
Active to Ref/Active Command Period
Active to Precharge Command Period
Operating current
Operation current (Single bank)
Operating burst read current
Operating burst write current
Burst refresh current
Self refresh current
Operating bank interleave read current
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Min.
Min.
Min.
Max.
Max.
Max.
Max.
Max.
Max.
Max.
DDR2-1066
7-7-7
-18
1.875 nS
7.5 nS
2.5 nS
7.5 nS
3 nS
7.5 nS
3.75 nS
7.5 nS
−
−
13.125 nS
13.125 nS
53.125 nS
40 nS
80 mA
95 mA
165 mA
160 mA
95 mA
3 mA
195 mA
DDR2-800
5-5-5/6-6-6
-25/25I/25A
−
−
2.5 nS
8 nS
2.5 nS
8 nS
3.75 nS
8 nS
5 nS
8 nS
12.5 nS
12.5 nS
52.5 nS
40 nS
75 mA
90 mA
140 mA
135 mA
85 mA
3 mA
170 mA
DDR2-667
5-5-5
-3
−
−
−
−
3 nS
8 nS
3.75 nS
8 nS
5 nS
8 nS
15 nS
15 nS
55 nS
40 nS
70 mA
85 mA
130 mA
125 mA
80 mA
3 mA
160 mA
-5-
Publication Release Date: Mar. 15, 2010
Revision A01
Datasheet pdf - http://www.DataSheet4U.net/
5 Page 
www.DataSheet.co.kr
W9712G6JB
SDRAM. Burst address sequence type is defined by A3, CAS Latency is defined by A[6:4]. The DDR2
does not support half clock latency mode. A7 is used for test mode. A8 is used for DLL reset. A7 must
be set to LOW for normal MRS operation. Write recovery time WR is defined by A[11:9]. Refer to the
table for specific codes.
Note:
1. WR (write recovery for Auto-precharge) min is determined by tCK(avg) max and WR max is determined by tCK(avg) min.
WR[cycles] = RU{ tWR[nS] / tCK(avg)[nS] }, where RU stands for round up. The mode register must be programmed to this
value. This is also used with tRP to determine tDAL.
Figure 2—Mode Register Set (MRS)
7.2.2 Extend Mode Register Set Commands (EMRS)
7.2.2.1 Extend Mode Register Set Command (1), EMR (1)
( CS = "L", RAS = "L", CAS = "L", WE = "L", BA0 = "H", BA1 = "L", A0 to A11 = Register data)
The extended mode register (1) stores the data for enabling or disabling the DLL, output driver
strength, additive latency, ODT, DQS disable, OCD program. The default value of the extended
mode register (1) is not defined, therefore the extended mode register (1) must be programmed during
initialization for proper operation. The DDR2 SDRAM should be in all bank precharge with CKE
already high prior to writing into the extended mode register (1). The mode register set command
cycle time (tMRD) must be satisfied to complete the write operation to the extended mode register (1).
Extended mode register (1) contents can be changed using the same command and clock cycle
requirements during normal operation as long as all banks are in the precharge state. A0 is used for
DLL enable or disable. A1 is used for enabling a reduced strength output driver. A[5:3] determines the
additive latency, A[9:7] are used for OCD control, A10 is used for DQS disable. A2 and A6 are used
for ODT setting.
- 11 -
Publication Release Date: Mar. 15, 2010
Revision A01
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