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W989D6CB PDF даташит

Спецификация W989D6CB изготовлена ​​​​«Winbond» и имеет функцию, называемую «(W989D2CB / W989D6CB) 512Mb Mobile LPSDR».

Детали детали

Номер произв W989D6CB
Описание (W989D2CB / W989D6CB) 512Mb Mobile LPSDR
Производители Winbond
логотип Winbond логотип 

67 Pages
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W989D6CB Даташит, Описание, Даташиты
www.DataSheet.co.kr
W989D6CB / W989D2CB
512Mb Mobile LPSDR
TABLE OF CONTENTS
1. GENERAL DESCRIPTION .......................................................................................................... 3
2. FEATURES.................................................................................................................................. 3
3. PIN CONFIGURATION................................................................................................................ 4
3.1 Ball Assignment: LPSDR X 16 ............................................................................................................4
3.2 Ball Assignment: LPSDR X 32 ............................................................................................................4
4. PIN DESCRIPTION...................................................................................................................... 5
4.1 Signal Description ...............................................................................................................................5
4.2 Addressing Table ................................................................................................................................5
5. BLOCK DIAGRAM ...................................................................................................................... 6
6. ELECTRICAL CHARACTERISTICS ........................................................................................... 7
6.1 Absolute Maximum Ratings ................................................................................................................7
6.2 Operating Conditions ..........................................................................................................................7
6.3 Capacitance ........................................................................................................................................7
6.4 DC Characteristics ..............................................................................................................................8
6.5 Automatic Temperature Compensated Self Refresh Current Feature ..............................................10
6.6 AC Characteristics And AC Operating Conditions ............................................................................11
6.6.1 AC Characteristics.................................................................................................................................... 11
6.6.2 AC Test Condition .................................................................................................................................... 12
6.6.3 AC Latency Characteristics...................................................................................................................... 13
7. FUNCTION DESCRIPTION ....................................................................................................... 14
7.1 Command Function...........................................................................................................................14
7.1.1Table 1. Truth Table .................................................................................................................................. 14
7.1.2 Functional Truth Table ............................................................................................................................. 15
7.1.3 Function Truth Table for CKE .................................................................................................................. 18
7.1.4 Bank Activate Command.......................................................................................................................... 19
7.1.5 Bank Precharge Command...................................................................................................................... 19
7.1.6 Precharge All Command .......................................................................................................................... 19
7.1.7 Write Command ....................................................................................................................................... 19
7.1.8 Write with Auto Precharge Command...................................................................................................... 19
7.1.9 Read Command ....................................................................................................................................... 19
7.1.10 Read with Auto Precharge Command.................................................................................................... 19
7.1.11 Extended Mode Register Set Command ............................................................................................... 19
7.1.12 Mode Register Set Command................................................................................................................ 20
7.1.13 No-Operation Command ........................................................................................................................ 20
7.1.14 Burst Stop Command............................................................................................................................. 20
7.1.15 Device Deselect Command.................................................................................................................... 20
7.1.16 Auto Refresh Command......................................................................................................................... 20
7.1.17 Self Refresh Entry Command ................................................................................................................ 20
7.1.18 Self Refresh Exit Command................................................................................................................... 20
7.1.19 Clock Suspend Mode Entry/Power Down Mode Entry Command......................................................... 20
7.1.20 Clock Suspend Mode Exit / Power Down Mode Exit Command............................................................ 20
7.1.21 Data Write/Output Enable, Data Mask/Output Disable Command ........................................................ 21
8.OPERATION............................................................................................................................... 21
8.1 Read Operation.................................................................................................................................21
8.2 Write Operation .................................................................................................................................21
8.3 Precharge .........................................................................................................................................22
8.3.1 Auto Precharge ........................................................................................................................................ 22
8.3.2 READ with auto precharge interrupted by a READ (with or without auto precharge) ............................. 22
8.3.3 READ with auto precharge interrupted by a WRITE (with or without auto precharge)............................ 23
8.3.4 WRITE with auto precharge interrupted by a READ (with or without auto precharge)............................ 24
8.3.5 WRITE with auto precharge interrupted by a WRITE (with or without auto precharge) .......................... 25
-1-
Publication Release Date: Sep, 22, 2011
Revision A01-005
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W989D6CB Даташит, Описание, Даташиты
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W989D6CB / W989D2CB
512Mb Mobile LPSDR
8.4 Burst Termination..............................................................................................................................26
8.5 Mode Register Operation ..................................................................................................................27
8.5.1 Burst Length field (A2~A0) ....................................................................................................................... 27
8.5.2 Addressing Mode Select (A3) .................................................................................................................. 27
8.5.3 Addressing Sequence for Sequential Mode............................................................................................. 28
8.5.4 Addressing Sequence for Interleave Mode.............................................................................................. 28
8.5.5 Addressing Sequence Example (Burst Length = 8 and Input Address is 13).......................................... 29
8.5.6 Read Cycle CAS Latency = 3................................................................................................................ 29
8.5.7 CAS Latency field (A6~A4) ................................................................................................................... 30
8.5.8 Mode Register Definition.......................................................................................................................... 30
8.6 Extended Mode Register Description................................................................................................31
8.7 Simplified State Diagram...................................................................................................................32
9. CONTROL TIMING WAVEFORMS ........................................................................................... 33
9.1 Command Input Timing.....................................................................................................................33
9.2 Read Timing......................................................................................................................................34
9.3 Control Timing of Input Data (x16) ....................................................................................................35
9.4 Control Timing of Output Data (x16) .................................................................................................36
9.5 Control Timing of Input Data (x32) ....................................................................................................37
9.6 Control Timing of Output Data (x32) .................................................................................................38
9.7 Mode register Set (MRS) Cycle ........................................................................................................39
9.8 Extended Mode register Set (EMRS) Cycle......................................................................................40
10. OPERATING TIMING EXAMPLE ............................................................................................ 41
10.1 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3).......................................................41
10.2 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3, Auto Precharge)............................42
10.3 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3).......................................................43
10.4 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3, Auto Precharge)............................44
10.5 Interleaved Bank Write (Burst Length = 8) ......................................................................................45
10.6 Interleaved Bank Write (Burst Length = 8, Auto Precharge) ...........................................................46
10.7 Page Mode Read (Burst Length = 4, CAS Latency = 3) ...............................................................47
10.8 Page Mode Read / Write (Burst Length = 8, CAS Latency = 3)....................................................48
10.9 Auto Precharge Read (Burst Length = 4, CAS Latency = 3).........................................................49
10.10 Auto Precharge Write (Burst Length = 4) ......................................................................................50
10.11 Auto Refresh Cycle .......................................................................................................................51
10.12 Self Refresh Cycle ........................................................................................................................52
10.13 Power Down Mode........................................................................................................................53
10.14 Burst Read and Single Write (Burst Length = 4, CAS Latency = 3)............................................54
10.15 Deep Power Down Mode Entry.....................................................................................................55
10.16 Deep Power Down Mode Exit .......................................................................................................56
10.17 Auto Precharge Timing (Read Cycle) ...........................................................................................57
10.18 Auto Precharge Timing (Write Cycle)............................................................................................58
10.19 Timing Chart of Read to Write Cycle.............................................................................................59
10.20 Timing Chart for Write to Read Cycle ...........................................................................................59
10.21 Timing Chart for Burst Stop Cycle (Burst Stop Command)...........................................................60
10.22 Timing Chart for Burst Stop Cycle (Precharge Command) ...........................................................60
10.23 CKE/DQM Input Timing (Write Cycle)...........................................................................................61
10.24 CKE/DQM Input Timing (Read Cycle)...........................................................................................62
11. PACKAGE DIMENSION.......................................................................................................... 63
11.1 : LPSDR X 16..................................................................................................................................63
11.2 : LPSDR X 32..................................................................................................................................64
12.ORDERING INFORMATION .................................................................................................... 65
13. REVISION HISTORY ............................................................................................................... 66
-2-
Publication Release Date: Sep, 22, 2011
Revision A01-005
Datasheet pdf - http://www.DataSheet4U.net/









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W989D6CB Даташит, Описание, Даташиты
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W989D6CB / W989D2CB
512Mb Mobile LPSDR
1. GENERAL DESCRIPTION
The Winbond 512Mb Low Power SDRAM is a low power synchronous memory containing 536,870,912 memory cells
fabricated with Winbond high performance process technology.
It is designed to consume less power than the ordinary SDRAM with low power features essential for applications which
use batteries. It is available in two organizations: 4,194,304-words × 4 banks × 32 bits or 8,388,608 words × 4 banks × 16
bits. The device operates in a fully synchronous mode, and the output data are synchronized to positive edges of the
system clock and is capable of delivering data at clock rate up to 166MHz. The device supports special low power functions
such as Partial Array Self Refresh (PASR) and Automatic Temperature Compensated Self Refresh (ATCSR).
The Low Power SDRAM is suitable for 2.5G / 3G cellular phone, PDA, digital still camera, mobile game consoles and other
handheld applications where large memory density and low power consumption are required. The device operates from
1.8V power supply, and supports the 1.8V LVCMOS bus interface.
2. FEATURES
Power supply VDD = 1.7V~1.95V
VDDQ = 1.7V~1.95V
Frequency : 166MHz(-6),133MHz(-75)
Programmable Partial Array Self Refresh
Power Down Mode
Deep Power Down Mode (DPD)
Programmable output buffer driver strength
Automatic Temperature Compensated Self Refresh
CAS Latency: 2 and 3
Burst Length: 1, 2, 4, 8, and full page
Refresh: 8K refresh cycle / 64ms
Interface: LVCMOS
Support package :
54 balls VFBGA (x16)
90 balls VFBGA (x32)
Operating Temperature Range
Extended (-25°C ~ +85°C)
Industrial (-40°C ~ +85°C)
-3-
Publication Release Date: Sep, 22, 2011
Revision A01-005
Datasheet pdf - http://www.DataSheet4U.net/










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Номер в каталогеОписаниеПроизводители
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Winbond

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