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PDF SDM109HHA-R32MF Data sheet ( Hoja de datos )
| Número de pieza | SDM109HHA-R32MF | |
| Descripción | DIP POWER CHOKE COIL | |
| Fabricantes | Superworld | |
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DIP POWER CHOKE COIL
SDM109HHA SERIES
1. PART NO. EXPRESSION :
SDM109HHA-1R0MF
(a) (b)
(c) (d)(e)
(a) Series code
(b) Dimension code
(c) Inductance code : 1R0 = 1.00uH
(d) Tolerance code : M = ±20%
(e) F : RoHS Compliant
2. CONFIGURATION & DIMENSIONS :
AF
F
R32e
YY.WW
ØW
H
11.0
PCB Pattern
Unit:m/m
Series
AB
CDE
F ØW L
GH
SDM109HHA-R32MF 10.5 Max. 10.5 Max. 10.0 Max. 3.4±0.5 5.3±0.5 5.3±0.5 1.4±0.1 7.5±0.5 0.5±0.2 1.7 Typ.
SDM109HHA-R47MF 10.5 Max. 10.5 Max. 10.0 Max. 3.4±0.5 5.3±0.5 5.3±0.5 1.3±0.1 7.5±0.5 0.5±0.2 1.6 Typ.
SDM109HHA-R80MF 10.5 Max. 10.5 Max. 10.0 Max. 3.4±0.5 5.3±0.5 5.3±0.5 1.2±0.1 7.5±0.5 0.5±0.2 1.5 Typ.
SDM109HHA-1R0MF 10.5 Max. 10.5 Max. 10.0 Max. 3.4±0.5 5.3±0.5 5.3±0.5 1.1±0.1 7.5±0.5 0.5±0.2 1.4 Typ.
3. SCHEMATIC :
4. MATERIALS :
(a) Core : e Iron Core
(b) Wire : Enamelled Copper Wire
(c) Solder : Sn99.95%-Cu0.05%
NOTE : Specifications subject to change without notice. Please check our website for latest information.
SUPERWORLD ELECTRONICS
(S)
PTE
11.06.2010
LTD
PG. 1
Datasheet pdf - http://www.DataSheet4U.net/
1 page  
www.DataSheet.co.kr
DIP POWER CHOKE COIL
SDM109HHA SERIES
9. SOLDERING AND MOUNTING :
9-1. Recommended PC Board Pattern
F
H
11.0
Series
Unit:m/m
EFL H
SDM109HHA-R32MF 5.3±0.5 5.3±0.5 7.5±0.5 1.7 Typ.
SDM109HHA-R47MF 5.3±0.5 5.3±0.5 7.5±0.5 1.6 Typ.
SDM109HHA-R80MF 5.3±0.5 5.3±0.5 7.5±0.5 1.5 Typ.
SDM109HHA-1R0MF 5.3±0.5 5.3±0.5 7.5±0.5 1.4 Typ.
9-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
9-2.1 Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
9-2.2 Soldering Iron (Figure 2) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150°C.
b) 280°C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 3 secs.
Preheating Soldering
20~40s max.
TP(260°C/10s max.)
Natural
cooling
217
200
150
60~180s
480s max.
60~150s
TIME(sec.)
Figure 1. Re-flow Soldering
Preheating Soldering
350
300
150
Natural
cooling
Over 1min.
Gradual
Cooling
Within 3secs.
Figure 2. Iron Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
11.06.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
Datasheet pdf - http://www.DataSheet4U.net/
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet SDM109HHA-R32MF.PDF ] | |
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