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PDF NCN3411 Data sheet ( Hoja de datos )

Número de pieza NCN3411
Descripción 4-Differential Channel 1:2 Mux/Demux Switch
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NCN3411
4-Differential Channel 1:2
Mux/Demux Switch for
PCI Express Gen3
The NCN3411 is a 4Channel differential SPDT switch designed to
route PCI Express Gen3 signals. When used in a PCI Express
application, the switch can handle up to two PCIe lanes. Due to the
ultralow ONstate capacitance (2 pF typ) and resistance (7.5 W typ),
these switches are ideal for switching high frequency data signals up to
a signal bit rate of 8 Gbps. This switch pinout is designed to be used in
BTX form factor desktop PCs and is available in a spacesaving 3.5 x
9 x 0.75 mm WQFN42 package.
Features
VDD Power Supply from 1.5 V to 2.0 V
4 Differential Channels 2:1 MUX/DEMUX
Compatible with PCIe 3.0
Data Rate: Supports 8 Gbps
Low Crosstalk 30 dB @ 4 GHz
Low BittoBit Skew: 5 ps
Low RON Resistance: 13 W max
Low CON Capacitance: 2 pF
Low Supply Current: 200 mA
Off Isolation: 20 dB @ 4 GHz
Space Saving Small WQFN42 Package
This is a PbFree Device
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Typical Applications
Notebook Computer
Desktop computer
Server/Storage Area Network
PCI Express
Controller
A0 +/
A1 +/
A2 +/NCN3411
A3 +/
B0 +/
B1 +/
B2 +/
B3 +/
C0 +/
C1 +/
C2 +/
C3 +/
Figure 1. Application Schematic
http://onsemi.com
MARKING
DIAGRAM
1
WQFN42
CASE 510AP
NCN3411
AWLYYWWG
XXXXX = Specific Device Code
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G = PbFree Package
ORDERING INFORMATION
Device
Package
Shipping
NCN3411MTTWG WQFN42 2000 / Tape & Reel
(PbFree)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
September, 2011 Rev. 0
1
Publication Order Number:
NCN3411/D
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NCN3411 pdf
NCN3411
MAXIMUM RATINGS
Parameter
Symbol
Rating
Units
Power Supply Voltage
Input/Output Voltage Range of the Switch (AN, BN, CN)
Selection Pin Voltages
Continuous Current Through One Switch
Maximum Junction Temperature (Note 1)
Operating Ambient Temperature
Storage Temperature Range
Thermal Resistance, JunctiontoAir
Latchup Current (Note 2)
Human Body Model (HBM) ESD Rating (Note 3)
VDD
VIS
VSEL
Icc
TJ
TA
Tstg
RqJA
ILU
ESD HBM
0.5 to 2.5
0.5 to VDD
0.5 to VDD
±120
150
40 to +85
65 to +150
75
±100
7000
VDC
VDC
VDC
mA
°C
°C
°C
°C/W
mA
V
Machine Model (MM) ESD Rating (Note 3)
ESD MM
400
V
Moisture Sensitivity (Note 4)
MSL
Level 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Power dissipation must be considered to ensure maximum junction temperature (TJ) is not exceeded.
2. Latch up Current Maximum Rating: ±100 mA per JEDEC standard: JESD78.
3. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) ±7.0 kV per JEDEC standard: JESD22A114 for all pins.
Machine Model (MM) ±400 V per JEDEC standard: JESD22A115 for all pins.
4. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: JSTD020A.
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