NCV47711 PDF даташит
Спецификация NCV47711 изготовлена «ON Semiconductor» и имеет функцию, называемую «5V to 20V Adjustable LDO». |
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Детали детали
Номер произв | NCV47711 |
Описание | 5V to 20V Adjustable LDO |
Производители | ON Semiconductor |
логотип |
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NCV47711
5 V to 20 V Adjustable LDO
with Adjustable Current
Limit and 3.3 V Logic
Compatible Enable Input
The NCV47711 is a 350 mA output current integrated low dropout
regulator designed for use in harsh automotive environments. It
includes wide operating temperature and input voltage ranges. The
device is offered with adjustable voltage versions available in 3%
output voltage accuracy. It has a high peak input voltage tolerance and
reverse input voltage protection. It also provides overcurrent
protection, overtemperature protection and enable for control of the
state of the output voltage. The integrated current sense feature
provides diagnosis and system protection functionality. The current
limit of the device is adjustable by resistor connected to CSO pin.
Voltage on CSO pin is proportional to output current.
Features
• Adjustable Voltage Version (from 5 V to 20 V) ± 3% Output Voltage
• Enable Input (3.3 V Logic Compatible Thresholds)
• Adjustable Current Limit (from 10 mA to 350 mA) with 10%
accuracy
• Protection Features:
♦ Current Limitation
♦ Thermal Shutdown
♦ Reverse Input Voltage
www.DataSheet.co.kr
• This is a Pb−Free Device
Typical Applications
• Audio and Infotainment System
• Instrument Cluster
• Navigation
• Satellite Radio
http://onsemi.com
MARKING
DIAGRAM
8
1
SOIC−8
Exposed Pad
PD SUFFIX
CASE 751AC
8
47711
ALYW
G
1
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb−Free Package
PIN CONNECTIONS
ADJ 1
GND
EN
8
Vout
NC
NC
CSO
Vin
SOIC−8 EP
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
C in
1 mF
Vin Vout
NCV47711 ADJ
EN CSO
GND
Cb* R1
C out
R2
22 mF
C CSO
1 mF
R CSO
*Required if usage of low ESR output capacitor Cout is demand, see
Regulator Stability Considerations section.
Figure 1. Application Schematic
© Semiconductor Components Industries, LLC, 2012
April, 2012 − Rev. 0
1
Publication Order Number:
NCV47711/D
Datasheet pdf - http://www.DataSheet4U.net/
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NCV47711
Vin
VOLTAGE
REFERENCE
VREF1
VREF2
PASS DEVICE
AND
ICSO = Iout / 100
CURRENT MIRROR
EN ENABLE
SATURATION
PROTECTION
THERMAL
SHUTDOWN
SP
TSD
VREF2
+ 2.55 V
-
Vout
CSO
GND
SP
+
-
TSD
VREF1
1.275 V
Figure 2. Simplified Block Diagram
PIN FUNCTION DESCRIPTION
www.DataSheet.co.kr
Pin No.
Pin Name
Description
1 ADJ Adjustable Voltage Setting Input. See Application Section for more details.
2
GND
Power Supply Ground.
3 EN Enable Input; low level disables the IC.
4
CSO
Current Sense Output, Current Limit setting and Output Current value information.
See Application Section for more details.
5 Vin Positive Power Supply Input.
6 NC Not Connected
7 NC Not Connected
8
EPAD
Vout
EPAD
Regulated Output Voltage.
Connect to ground potential or leave unconnected.
ADJ
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2
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NCV47711
ABSOLUTE MAXIMUM RATINGS (Note 1)
Rating
Symbol
Min
Max Unit
Input Voltage
Vin −42
45 V
Enable Input Voltage
VEN −0.3
7.0 V
Adjustable Input Voltage
VADJ
−0.3
10 V
CSO Voltage
VCSO
−0.3
7.0 V
Output Voltage
Vout −1
40 V
Junction Temperature
TJ −40 150 °C
Storage Temperature
TSTG
−55
150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
ESD CAPABILITY (Note 2)
Rating
Symbol
ESD Capability, Human Body Model
ESDHBM
ESD Capability, Machine Model
ESDMM
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Min
−2
−200
Max Unit
2 kV
200 V
LEAD SOLDERING TEMPERATURE AND MSL (Note 3)
Rating
Symbol
Min
Max
Moisture Sensitivity Level
MSL
2
Lead Temperature Soldering
Reflow (SMD Styles Only), Pb−Free Versions
www.DataSheet.co.kr
TSLD
− 265 peak
3. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
Unit
−
°C
THERMAL CHARACTERISTICS (Note 4)
Rating
Symbol
Value
Unit
Thermal Characteristics (single layer PCB)
Thermal Resistance, Junction−to−Air (Note 5)
Thermal Reference, Junction−to−Lead (Note 5)
RRψθJJAL
°C/W
70
19
Thermal Characteristics (4 layers PCB)
Thermal Resistance, Junction−to−Air (Note 5)
Thermal Reference, Junction−to−Lead (Note 5)
RθJA
RψJL
°C/W
29
12
4. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
5. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate. Single layer − according to JEDEC51.3,
4 layers − according to JEDEC51.7.
RECOMMENDED OPERATING RANGES (Note 6)
Rating
Symbol
Min
Input Voltage (Note 7)
Vin 5.5
Output Current Limit (Note 8)
ILIM 10
Junction Temperature
TJ −40
6. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
7. Minimum Vin = 5.5 V or (Vout_nom + 0.5 V), whichever is higher.
8. Corresponding RCSO is in range from 25 kW down to 728 W.
Max Unit
40 V
350 mA
150 °C
http://onsemi.com
3
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