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SD05C PDF даташит

Спецификация SD05C изготовлена ​​​​«Littelfuse» и имеет функцию, называемую «450W Discrete Bidirectional TVS Diode».

Детали детали

Номер произв SD05C
Описание 450W Discrete Bidirectional TVS Diode
Производители Littelfuse
логотип Littelfuse логотип 

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SD05C Даташит, Описание, Даташиты
TVS Diode Arrays (SPA® Devices)
General Purpose ESD Protection - SD05C Series
SD05C Series 450W Discrete Bidirectional TVS Diode
RoHS Pb GREEN
Pinout and Functional Block Diagram
1
Description
The bidirectional SD05C TVS diode is designed to replace
multilayer varistors (MLVs) in electronic equipment for low
speed and DC applications. It will protect any sensitive
equipment from damage due to electrostatic discharge
(ESD) and other transient events.
The SD05C can safely absorb repetitive ESD strikes
at ±30kV (contact discharge, IEC 61000-4-2) without
performance degradation and safely dissipate 30A of
8/20μs induced surge current (IEC61000-4-5) with very low
clamping voltages.
Features
• ESD, IEC61000-4-2,
±30kV contact, ±30kV air
• EFT, IEC61000-4-4, 50A
(5/50ns)
• Lightning, IEC61000-4-5,
30A (tP=8/20μs)
• Low clamping voltage
• Low leakage current
• Small SOD323 package
fits 0805 footprints
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2
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
Applications
• Switches / Buttons
• Test Equipment /
Instrumentation
• Point-of-Sale Terminals
• Medical Equipment
• Notebooks / Desktops /
Servers
• Computer Peripherals
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
1
Revision: December 19, 2012
SD05C Series
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SD05C Даташит, Описание, Даташиты
TVS Diode Arrays (SPA® Devices)
General Purpose ESD Protection - SD05C Series
Absolute Maximum Ratings
Symbol
Parameter
Value
Units
IPP Peak Current (tp=8/20μs)
30 A
PPk
Peak Pulse Power (tp=8/20μs)
450
W
TOP Operating Temperature
-40 to 85
°C
TSTOR
Storage Temperature
-60 to 150
°C
Notes:
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Thermal Information
Parameter
Storage Temperature Range
Maximum Junction Temperature
Maximum Lead Temperature (Soldering 20-40s)
Rating
-65 to 150
150
260
Units
°C
°C
°C
Electrical Characteristics (TOP=25ºC)
Parameter
Reverse Voltage Drop
Reverse Standoff Voltage
Leakage Current
Clamp Voltage1
Dynamic Resistance
ESD Withstand Voltage1
Symbol
VR
VRWM
ILEAK
VC
RDYN
VESD
Test Conditions
IR=1mA
IR≤1μA
VR=5V
IPP=1A, tp=8/20µs, Fwd
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IPP=2A, tp=8/20µs, Fwd
IPP=10A, tP=8/20μs, Fwd
IPP=24A, tP=8/20μs, Fwd
(VC2 - VC1) / (IPP2 - IPP1)
IEC61000-4-2 (Contact Discharge)
IEC61000-4-2 (Air Discharge)
Min
6
±30
±30
Diode Capacitance1
CD Reverse Bias=0V, f=1MHz
Note:
1Parameter is guaranteed by design and/or device characterization.
Typ
9.7
10.3
13.5
18.0
0.6
Max
5.0
1.0
200
Units
V
V
μA
V
V
V
V
kV
kV
pF
Capacitance vs. Reverse Bias
300.0
250.0
Non-Repetitive Peak Pulse Power vs. Pulse Time
10
200.0
150.0
100.0
50.0
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Bias Voltage (V)
1
0.1
0.01
0.1
1 10 100
Pulse Duration - tp (µs)
1000
SD05C Series
2
Revision: December 19, 2012
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
datasheet pdf - http://www.DataSheet4U.net/









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SD05C Даташит, Описание, Даташиты
TVS Diode Arrays (SPA® Devices)
General Purpose ESD Protection - SD05C Series
Power Derating Curve
110
100
90
80
70
60
50
40
30
20
10
0
0
25 50 75 100
Ambient Temperature - TA(oC)
125
150
Pulse Waveform
110%
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
0.0
5.0
10.0
15.0
Time (μs)
20.0
25.0
30.0
Soldering Parameters
Reflow Condition
Pb – Free assembly
- Temperature Min (Ts(min))
Pre Heat - Temperature Max (Ts(max))
- Time (min to max) (ts)
Average ramp up rate (Liquidus) Temp
(TL) to peak
TS(max) to TL - Ramp-up Rate
Reflow
-Temperature (TL) (Liquidus)
- Temperature (tL)
Peak Temperature (TP)
Time within 5°C of actual peak
Temperature (tp)
Ramp-down Rate
Time 25°C to peakTemperature (TP)
Do not exceed
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
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TP
TL
TS(max)
TS(min)
Ramp-up
Preheat
tS
25
time to peak temperature
tP
Critical Zone
TL to TP
tL
Ramp-down
Time
Product Characteristics
Lead Plating
Lead Material
Lead Coplanarity
Substitute Material
Body Material
Flammability
Matte Tin
Copper Alloy
0.0004 inches (0.102mm)
Silicon
Molded Epoxy
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
3
Revision: December 19, 2012
SD05C Series
datasheet pdf - http://www.DataSheet4U.net/










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