NCP45560 Datasheet PDF - ON Semiconductor
| Part Number | NCP45560 | |
| Description | Advanced Load Management | |
| Manufacturers | ON Semiconductor | |
| Logo |  |
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NCP45560
ecoSWITCHt
Advanced Load Management
Controlled Load Switch with Low RON
The NCP45560 load switch provides a component and
area-reducing solution for efficient power domain switching with
inrush current limit via soft−start. In addition to integrated control
functionality with ultra low on−resistance, this device offers system
safeguards and monitoring via fault protection and power good
signaling. This cost effective solution is ideal for power management
and hot-swap applications requiring low power consumption in a
small footprint.
Features
• Advanced Controller with Charge Pump
• Integrated N-Channel MOSFET with Ultra Low RON
• Input Voltage Range 0.5 V to 13.5 V
• Soft-Start via Controlled Slew Rate
• Adjustable Slew Rate Control
• Power Good Signal
• Thermal Shutdown
• Undervoltage Lockout
• Short-Circuit Protection
• Extremely Low Standby Current
• Load Bleed (Quick Discharge)
• This is a Pb−Free Device
Typical Applications
• Portable Electronics and Systems
• Notebook and Tablet Computers
• Telecom, Networking, Medical, and Industrial Equipment
• Set−Top Boxes, Servers, and Gateways
• Hot−Swap Devices and Peripheral Ports
VCC
EN PG
VIN
Bandgap
&
Biases
Control
Logic
Thermal,
Undervoltage
&
Short−Circuit
Protection
Charge
Pump
Delay and
Slew Rate
Control
SR
GND
BLEED
Figure 1. Block Diagram
VOUT
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RON TYP
2.4 mW
2.6 mW
3.2 mW
VCC
3.3 V
3.3 V
3.3 V
VIN
1.8 V
5.0 V
12 V
IMAX
24 A
1
DFN12, 3x3
CASE 506CD
MARKING DIAGRAM
NCP45
560−x
ALYWG
G
x = H for NCP45560−H
= L for NCP45560−L
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
PIN CONFIGURATION
VIN 1
EN 2
VCC 3
GND 4
SR 5
PG 6
13: VIN
(Top View)
12 VOUT
11 VOUT
10 VOUT
9 VOUT
8 VOUT
7 BLEED
ORDERING INFORMATION
See detailed ordering and shipping information on page 7 of
this data sheet.
© Semiconductor Components Industries, LLC, 2013
May, 2013 − Rev. 0
1
Publication Order Number:
NCP45560/D
Free Datasheet http://www.datasheet4u.com/
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NCP45560
APPLICATIONS INFORMATION
Enable Control
The NCP45560 has two part numbers, NCP45560−H and
NCP45560−L, that only differ in the polarity of the enable
control.
The NCP45560−H device allows for enabling the
MOSFET in an active−high configuration. When the VCC
supply pin has an adequate voltage applied and the EN pin
is at a logic high level, the MOSFET will be enabled.
Similarly, when the EN pin is at a logic low level, the
MOSFET will be disabled. An internal pull down resistor to
ground on the EN pin ensures that the MOSFET will be
disabled when not being driven.
The NCP45560−L device allows for enabling the
MOSFET in an active−low configuration. When the VCC
supply pin has an adequate voltage applied and the EN pin
is at a logic low level, the MOSFET will be enabled.
Similarly, when the EN pin is at a logic high level, the
MOSFET will be disabled. An internal pull up resistor to
VCC on the EN pin ensures that the MOSFET will be
disabled when not being driven.
Power Sequencing
The NCP45560 devices will function with any power
sequence, but the output turn−on delay performance may
vary from what is specified. To achieve the specified
performance, there are two recommended power sequences:
1. VCC → VIN → VEN
2. VIN → VCC → VEN
Load Bleed (Quick Discharge)
The NCP45560 devices have an internal bleed resistor,
RBLEED, which is used to bleed the charge off of the load to
ground after the MOSFET has been disabled. In series with
the bleed resistor is a bleed switch that is enabled whenever
the MOSFET is disabled. The MOSFET and the bleed
switch are never concurrently active.
It is required that the BLEED pin be connected to VOUT
either directly (as shown in Figure 4) or through an external
resistor, REXT (as shown in Figure 3). REXT should not
exceed 1 kW and can be used to increase the total bleed
resistance.
Care must be taken to ensure that the power dissipated
across RBLEED is kept at a safe level. REXT can be used to
decrease the amount of power dissipated across RBLEED.
Power Good
The NCP45560 devices have a power good output (PG)
that can be used to indicate when the gate of the MOSFET
is fully charged. The PG pin is an active−high, open−drain
output that requires an external pull up resistor, RPG, greater
than or equal to 1 kW to an external voltage source, VTERM,
compatible with input levels of other devices connected to
this pin (as shown in Figures 3 and 4).
The power good output can be used as the enable signal for
other active−high devices in the system (as shown in
Figure 5). This allows for guaranteed by design power
sequencing and reduces the number of enable signals needed
from the system controller. If the power good feature is not
used in the application, the PG pin should be tied to GND.
Slew Rate Control
The NCP45560 devices are equipped with controlled
output slew rate which provides soft start functionality. This
limits the inrush current caused by capacitor charging and
enables these devices to be used in hot swap applications.
The slew rate can be decreased with an external capacitor
added between the SR pin and ground (as shown in Figures 3
and 4). With an external capacitor present, the slew rate can
be determined by the following equation:
Slew
Rate
+
KSR
CSR
[Vńs]
(eq. 1)
where KSR is the specified slew rate control constant, found
in Table 4, and CSR is the slew rate control capacitor added
between the SR pin and ground. The slew rate of the device
will always be the lower of the default slew rate and the
adjusted slew rate. Therefore, if the CSR is not large enough
to decrease the slew rate more than the specified default
value, the slew rate of the device will be the default value.
The SR pin can be left floating if the slew rate does not need
to be decreased.
Short−Circuit Protection
The NCP45560 devices are equipped with short−circuit
protection that is used to help protect the part and the system
from a sudden high−current event, such as the output, VOUT,
being shorted to ground. This circuitry is only active when
the gate of the MOSFET is fully charged.
Once active, the circuitry monitors the difference in the
voltage on the VIN pin and the voltage on the BLEED pin.
In order for the VOUT voltage to be monitored through the
BLEED pin, it is required that the BLEED pin be connected
to VOUT either directly (as shown in Figure 4) or through a
resistor, REXT (as shown in Figure 3), which should not
exceed 1 kW. With the BLEED pin connected to VOUT, the
short−circuit protection is able to monitor the voltage drop
across the MOSFET.
If the voltage drop across the MOSFET is greater than or
equal to the short−circuit protection threshold voltage, the
MOSFET is immediately turned off and the load bleed is
activated. The part remains latched in this off state until EN
is toggled or VCC supply voltage is cycled, at which point the
MOSFET will be turned on in a controlled fashion with the
normal output turn−on delay and slew rate. The current
through the MOSFET that will cause a short−circuit event
can be calculated by dividing the short−circuit protection
threshold by the expected on−resistance of the MOSFET.
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