NOIS1SM1000A PDF даташит
Спецификация NOIS1SM1000A изготовлена «ON Semiconductor» и имеет функцию, называемую «1M Pixel Radiation Hard CMOS Image Sensor». |
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Детали детали
Номер произв | NOIS1SM1000A |
Описание | 1M Pixel Radiation Hard CMOS Image Sensor |
Производители | ON Semiconductor |
логотип |
30 Pages
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NOIS1SM1000S,
NOIS1SM1000A
STAR1000 1M Pixel
Radiation Hard CMOS
Image Sensor
Features
• 1024 x 1024 Active Pixels
• 15 mm x 15 mm Pixel Size
• 1 inch − 35 mm Optical Format
• High Radiation Tolerance
• High Sensitivity
• Low Noise
• Monochrome and Color
• 11 Frames per Second (fps) at Full Resolution
• On-chip 10-bit Analog-to-Digital Converter (ADC)
• Region of Interest (ROI) Readout
• Windowed and Subsampled Readout
• Rolling Shutter
• On-chip Fixed Pattern Noise (FPN) Correction
• Ceramic JLCC-84 Package
• BK7G18 Glass with N2 Filled Cavity
• 400 mW Power Dissipation
• These Devices are Pb−Free and are RoHS Compliant
http://onsemi.com
Applications
Standard market Applications
• Nuclear Inspection
Space Applications
• Space Science
• Star Trackers
• Sun Sensors
Figure 1. STAR1000 in 84−Pin Ceramic
JLCC Package
JLDCC84
CASE 114AK
Description
The STAR1000 is a CMOS image sensor with 1024 by 1024 pixels on a 15 mm x 15 mm pitch. It features on-chip Fixed
Pattern Noise (FPN) correction, a programmable gain amplifier, and a 10-bit Analog-to-Digital Converter (ADC).
All circuits are designed using the radiation tolerant design techniques to allow high tolerance against Radiation effects.
Registers which contain the X- and Y- addresses of the read out pixels can be directly accessed by the external controller.
This architecture provides for flexible operation and allows different operation modes such as (multiple) windowing,
subsampling, and so on.
The STAR1000 is assembled using a BK7G18 glass lid with a Nitrogen-filled cavity which increases the temperature
operating range. The STAR1000 flight model has additional screening to space qualified standards.
ORDERING INFORMATION
Marketing Part Number
Description
NOIS1SM1000A-HHC
Mono with BK7G18 Glass, Engineering Model
NOIS1SM1000S-HHC
Mono with BK7G18 Glass, Flight Model
NOIS1SM1000A-HWC
Mono windowless, Engineering Model
NOIS1SM1000S-HWC
Mono windowless, Flight Model
NOIS1SC1000A-HHC
Color with BK7G18 Glass, Engineering Model
Status
Production
Risk Production
Engineering
Package
84 pin JLCC
case 114AK
© Semiconductor Components Industries, LLC, 2013
October, 2013 − Rev. 11
1
Publication Order Number:
NOIS1SM1000A/D
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NOIS1SM1000S, NOIS1SM1000A
CONTENTS
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Ordering Code Decoder . . . . . . . . . . . . . . . . . . . . . . .
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Applicable Documents . . . . . . . . . . . . . . . . . . . . . . . . .
Terms, Definitions Abbreviations, Symbols & Units
Test Procedure Overview . . . . . . . . . . . . . . . . . . . . . .
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
1
1
2
3
4
5
5
6
9
Mechanical Specifications . . . . . . . . . . . . . . . . . . . . . . 19
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Timing and Control Signals . . . . . . . . . . . . . . . . . . . . 27
Appendix A: Typical Spectral Response Data . . . . . . 30
Appendix B: Typical Pixel Profile Data . . . . . . . . . . . 31
Appendix C: Observed Effects During Annealing
After Total Dose Irradiation . . . . . . . . . . . . . . . . . . . . 32
Appendix D: Acronyms . . . . . . . . . . . . . . . . . . . . . . . . 33
Appendix E: Glossary . . . . . . . . . . . . . . . . . . . . . . . . . 34
http://onsemi.com
2
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NOIS1SM1000S, NOIS1SM1000A
ORDERING CODE DECODER
Marking
The marking shall consist of a lead identification and traceability information.
Lead Identification
An index to pin 1 shall be located on the top of the package as shown in section Package Dimensions on page 21. The pin
numbering is counter clock-wise, when looking at the top-side of the component.
Traceability Information Tests
Each component shall be marked such that complete traceability can be maintained.
The component shall bear a number that is constituted as follows:
Orderable Part Number
Package Mark: Line 1
Package Mark: Line 2
NOIS1SM1000A-HHC
NOIS1SM1000A
-HHC NNNN
NOIS1SM1000S-HHC
NOIS1SM1000S
-HHC NNNN
NOIS1SM1000A-HWC
NOIS1SM1000A
-HWC NNNN
NOIS1SC1000A-HHC*
NOIS1SC1000A
-HHC NNNN
where NNNN- serialized number controlled manually by ON Semiconductor, BELGIUM
where AWLYYWW represents the lot assembly date
*The NOIS1SC1000A−HHC is in engineering sample.
Package Mark: Line 3
AWLYYWW
AWLYYWW
AWLYYWW
AWLYYWW
MARKING DIAGRAM
12
11
32
33
814
75 53
74 52
XXXXX = Specific Device Code
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
NNNN = Serial Number
http://onsemi.com
3
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Номер в каталоге | Описание | Производители |
NOIS1SM1000A | 1M Pixel Radiation Hard CMOS Image Sensor | ON Semiconductor |
NOIS1SM1000S | 1M Pixel Radiation Hard CMOS Image Sensor | ON Semiconductor |
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