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PDF NTTFS5826NL Data sheet ( Hoja de datos )
| Número de pieza | NTTFS5826NL | |
| Descripción | Power MOSFET ( Transistor ) | |
| Fabricantes | ON Semiconductor | |
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NTTFS5826NL
Power MOSFET
60 V, 24 mW, Single N−Channel, m8FL
Features
• Small Footprint (3.3 x 3.3 mm) for Compact Designs
• Low QG(TOT) to Minimize Switching Losses
• Low Capacitance to Minimize Driver Losses
• These are Pb−Free Devices
Applications
• Motor Drivers
• DC−DC Converters
• Synchronous Rectification
• Power Management
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol Value
Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
C(Nuortreesnt1R, 2Y,J−amndb 3)
Tmb = 25°C
Tmb = 100°C
Power Dissipation
aRnYdJ−3m) b (Notes 1, 2,
Continuous Drain
Current
& 3)
RqJA
(Notes
1
Steady
State
Tmb = 25°C
Tmb = 100°C
TA = 25°C
TA = 100°C
Power Dissipation
RqJA (Notes 1 & 3)
TA = 25°C
TA = 100°C
Pulsed Drain Current TA = 25°C, tp = 10 ms
Operating Junction and Storage Temperature
VDSS
VGS
ID
PD
ID
PD
IDM
TJ, Tstg
60
"20
20
14
19
10
8
6
3.1
1.6
133
−55 to
175
V
V
A
W
A
W
A
°C
Source Current (Body Diode)
IS 20 A
Single Pulse Drain−to−Source Avalanche
Energy (TJ = 25°C, VDD = 50 V, VGS = 10 V,
IL(pk) = 14.4 A, L = 1.0 mH, RG = 25 W)
EAS 20 mJ
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
TL 260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol Value Unit
Junction−to−Mounting Board (top) − Steady
State (Notes 2, 3)
RYJ−mb
7.9 °C/W
Junction−to−Ambient − Steady State (Note 3)
RqJA
48
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Psi (Y) is used as required per JESD51−12 for packages in which
substantially less than 100% of the heat flows to single case surface.
3. Surface−mounted on FR4 board using a 650 mm2, 2 oz. Cu pad.
http://onsemi.com
V(BR)DSS
60 V
RDS(on) MAX
24 mW @ 10 V
32 mW @ 4.5 V
ID MAX
20 A
N−Channel
D
G
S
1
WDFN8
(m8FL)
CASE 511AB
MARKING DIAGRAM
1
SD
S 5826 D
S AYWWG D
GGD
5826
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NTTFS5826NLTAG WDFN8 1500/Tape & Reel
(Pb−Free)
NTTFS5826NLTWG WDFN8 5000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
November, 2011 − Rev. 2
1
Publication Order Number:
NTTFS5826NL/D
Free Datasheet http://www.datasheet4u.com/
1 page  
100
D = 0.5
10 D = 0.2
D = 0.1
D = 0.05
1 D = 0.02
D = 0.01
0.1
Single Pulse
0.01
0.000001
0.00001
0.0001
NTTFS5826NL
TYPICAL CHARACTERISTICS
0.001
0.01
0.1
1
PULSE TIME (sec)
Figure 13. Thermal Response
10 100 1000
http://onsemi.com
5
Free Datasheet http://www.datasheet4u.com/
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet NTTFS5826NL.PDF ] | |
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