PDF NE5550979A Data sheet ( Hoja de datos )

Número de pieza	NE5550979A
Descripción	Silicon Power LDMOS FET
Fabricantes	Renesas
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No Preview Available ! NE5550979A Silicon Power LDMOS FET Data Sheet R09DS0031EJ0300 Rev.3.00 Mar 12, 2013 FEATURES • High Output Power : Pout = 39.5 dBm TYP. (VDS = 7.5 V, IDset = 200 mA, f = 460 MHz, Pin = 25 dBm) • High power added efficiency : ηadd = 66% TYP. (VDS = 7.5 V, IDset = 200 mA, f = 460 MHz, Pin = 25 dBm) • High Linear gain : GL = 22 dB TYP. (VDS = 7.5 V, IDset = 200 mA, f = 460 MHz, Pin = 10 dBm) • High ESD tolerance : ESD tolerance > 8 kV (IEC61000-4-2, Contact discharge) • Suitable for VHF to UHF-BAND Class-AB power amplifier. APPLICATIONS • 150 MHz Band Radio System • 460 MHz Band Radio System • 900 MHz Band Radio System ORDERING INFORMATION Part Number NE5550979A Order Number NE5550979A-A Package 79A (Pb Free) Marking W6 Supplying Form • 12 mm wide embossed taping • Gate pin faces the perforation side of the tape NE5550979A-T1 NE5550979A-T1-A • 12 mm wide embossed taping • Gate pin faces the perforation side of the tape • Qty 1 kpcs/reel NE5550979A-T1A NE5550979A-T1A-A • 12 mm wide embossed taping • Gate pin faces the perforation side of the tape • Qty 5 kpcs/reel Remark To order evaluation samples, please contact your nearby sales office. Part number for sample order: NE5550979A ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Operation in excess of any one of these parameters may result in permanent damage. Parameter Drain to Source Voltage Gate to Source Voltage Drain Current Total Power Dissipation Note Channel Temperature Storage Temperature Note: Value at TC = 25°C Symbol VDS VGS IDS Ptot Tch Tstg Ratings 30 6.0 3.0 25 150 −55 to +150 Unit V V A W °C °C CAUTION Observe precautions when handling because these devices are sensitive to electrostatic discharge. The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field. R09DS0031EJ0300 Rev.3.00 Mar 12, 2013 Page 1 of 11 Free Datasheet http://www.datasheet4u.com/ 1 page NE5550979A <R> TEST CIRCUIT SCHEMATIC FOR 157 MHz VGS VDS IN 50 Ω C10 C11 L11 C12 R1 C1 L1 C1 FET NE5550979A C20 C21 L20 C22 OUT C24 50 Ω C23 <R> COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS Symbol C1 C10 C11 C12 C20 C21 C22 C23 C24 R1 L1 L11 L20 PCB SMA Connecter Value 1μF 100 pF 4.7 pF 39 pF 2.0 pF 22 pF 68 pF 12 pF 100 pF 4.7 kΩ 123 nH 27 nH 35 nH − − Type GRM31CR72A105KA01B GRM1882C1H101JA01 ATC100A4R7CT ATC100A390JT ATC100A2R0CT ATC100A220JT ATC100A680JT ATC100A120JT ATC100A101JT 1/10 W Chip Resistor SSM_RG1608PB472 φ 0.5 mm, φ D = 3 mm, 10 Turns LLQ2012-F27N φ 0.5 mm, φ D = 2.4 mm, 5 Turns R1766, t = 0.4 mm, εr = 4.5, size = 30 × 48 mm WAKA 01K0790-20 Maker Murata Murata American Technical Ceramics American Technical Ceramics American Technical Ceramics American Technical Ceramics American Technical Ceramics American Technical Ceramics American Technical Ceramics SSM Ohesangyou TOKO Ohesangyou Panasonic WAKA R09DS0031EJ0300 Rev.3.00 Mar 12, 2013 Page 5 of 11 Free Datasheet http://www.datasheet4u.com/ 5 Page NE5550979A RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Partial Heating Soldering Conditions Peak temperature (package surface temperature) : 260°C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below Peak temperature (molten solder temperature) : 260°C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120°C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below Condition Symbol IR260 WS260 HS350 CAUTION Do not use different soldering methods together (except for partial heating). R09DS0031EJ0300 Rev.3.00 Mar 12, 2013 Page 11 of 11 Free Datasheet http://www.datasheet4u.com/ 11 Page

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