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PDF HIP2101 Data sheet ( Hoja de datos )
| Número de pieza | HIP2101 | |
| Descripción | 100V/2A Peak/ Low Cost/ High Frequency Half Bridge Driver | |
| Fabricantes | Intersil Corporation | |
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Data Sheet
July 2004
HIP2101
FN9025.7
100V/2A Peak, Low Cost, High Frequency
Half Bridge Driver
The HIP2101 is a high frequency, 100V Half Bridge
N-Channel power MOSFET driver IC. It is equivalent to the
HIP2100 with the added advantage of full TTL/CMOS
compatible logic input pins. The low-side and high-side gate
drivers are independently controlled and matched to 13ns.
This gives users total control over dead-time for specific
power circuit topologies. Undervoltage protection on both
the low-side and high-side supplies force the outputs low. An
on-chip diode eliminates the discrete diode required with
other driver ICs. A new level-shifter topology yields the low-
power benefits of pulsed operation with the safety of DC
operation. Unlike some competitors, the high-side output
returns to its correct state after a momentary undervoltage of
the high-side supply.
Ordering Information
TEMP.
PART NUMBER RANGE (°C)
PACKAGE
PKG.
DWG. #
HIP2101IB
-40 to 85 8 Ld SOIC
M8.15
HIP2101IBZ (Note 1) -40 to 85 8 Ld SOIC (Pb-free) M8.15
HIP2101EIB
-40 to 85 8 Ld EPSOIC
M8.15C
HIP2101EIBZ
(Note 1)
-40 to 85 8 Ld EPSOIC
(Pb-free)
M8.15C
HIP2101IR
-40 to 85 16 Ld QFN
L16.5x5
HIP2101IRZ (Note 1) -40 to 85 16 Ld QFN
(Pb-free)
L16.5x5
HIP2101IR4
-40 to 85 12 Ld DFN
L12.4x4A
HIP2101IR4Z
(Note 1)
-40 to 85 12 Ld DFN (Pb-free) L12.4x4A
NOTES:
1. Intersil Pb-free products employ special Pb-free material sets;
molding compounds/die attach materials and 100% matte tin
plate termination finish, which is compatible with both SnPb and
Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or
exceed the Pb-free requirements of IPC/JEDEC J Std-020B.
2. Add “T” suffix for Tape and Reel packing option.
Features
• Drives N-Channel MOSFET Half Bridge
• SOIC, EPSOIC, QFN and DFN Package Options
• SOIC, EPSOIC and DFN Packages Compliant with 100V
Conductor Spacing Guidelines of IPC-2221
• Pb-free Product Available
• Bootstrap Supply Max Voltage to 114VDC
• On-Chip 1Ω Bootstrap Diode
• Fast Propagation Times for Multi-MHz Circuits
• Drives 1000pF Load with Rise and Fall Times Typ. 10ns
• TTL/CMOS Input Thresholds Increase Flexibility
• Independent Inputs for Non-Half Bridge Topologies
• No Start-Up Problems
• Outputs Unaffected by Supply Glitches, HS Ringing Below
Ground, or HS Slewing at High dv/dt
• Low Power Consumption
• Wide Supply Range
• Supply Undervoltage Protection
• 3Ω Output Driver Resistance
Applications
• Telecom Half Bridge Power Supplies
• Avionics DC-DC Converters
• Two-Switch Forward Converters
• Active Clamp Forward Converters
1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2004. All Rights Reserved.
All other trademarks mentioned are the property of their respective owners.
1 page  
HIP2101
Electrical Specifications VDD = VHB = 12V, VSS = VHS = 0V, No Load on LO or HO, Unless Otherwise Specified (Continued)
PARAMETERS
SYMBOL
TEST CONDITIONS
TJ = 25°C
TJ = -40°C TO
125°C
MIN TYP MAX MIN MAX UNITS
BOOT STRAP DIODE
Low-Current Forward Voltage
High-Current Forward Voltage
Dynamic Resistance
LO GATE DRIVER
VDL
VDH
RD
IVDD-HB = 100µA
IVDD-HB = 100mA
IVDD-HB = 100mA
- 0.45 0.70 - 0.7 V
- 0.7 0.92 - 1 V
- 0.8 1
- 1.5 Ω
Low Level Output Voltage
High Level Output Voltage
Peak Pullup Current
Peak Pulldown Current
HO GATE DRIVER
VOLL
VOHL
IOHL
IOLL
ILO = 100mA
ILO = -100mA, VOHL = VDD-VLO
VLO = 0V
VLO = 12V
- 0.25 0.3 - 0.4 V
- 0.25 0.3 - 0.4 V
-2- - - A
-2- - - A
Low Level Output Voltage
High Level Output Voltage
Peak Pullup Current
Peak Pulldown Current
VOLH
VOHH
IOHH
IOLH
IHO = 100mA
IHO = -100mA, VOHH = VHB-VHO
VHO = 0V
VHO = 12V
- 0.25 0.3 - 0.4 V
- 0.25 0.3 - 0.4 V
-2- - - A
-2- - - A
Switching Specifications VDD = VHB = 12V, VSS = VHS = 0V, No Load on LO or HO, Unless Otherwise Specified
PARAMETERS
SYMBOL
TEST
CONDITIONS
TJ = 25°C
MIN TYP MAX
TJ = -40°C
TO 125°C
MIN MAX UNITS
Lower Turn-Off Propagation Delay (LI Falling to LO Falling)
Upper Turn-Off Propagation Delay (HI Falling to HO Falling)
Lower Turn-On Propagation Delay (LI Rising to LO Rising)
Upper Turn-On Propagation Delay (HI Rising to HO Rising)
Delay Matching: Lower Turn-On and Upper Turn-Off
Delay Matching: Lower Turn-Off and Upper Turn-On
Either Output Rise/Fall Time
Either Output Rise/Fall Time (3V to 9V)
Either Output Rise Time Driving DMOS
Either Output Fall Time Driving DMOS
Minimum Input Pulse Width that Changes the Output
Bootstrap Diode Turn-On or Turn-Off Time
tLPHL
tHPHL
tLPLH
tHPLH
tMON
tMOFF
tRC,tFC
tR,tF
tRD
tFD
tPW
tBS
CL = 1000pF
CL = 0.1µF
CL = IRFR120
CL = IRFR120
- 25 43 - 56 ns
- 25 43 - 56 ns
- 25 43 - 56 ns
- 25 43 - 56 ns
- 2 13 - 16 ns
- 2 13 - 16 ns
- 10 - - - ns
- 0.5 0.6 - 0.8 us
- 20 - - - ns
- 10 - - - ns
- - - - 50 ns
- 10 - - - ns
5
5 Page 
HIP2101
Small Outline Plastic Packages (SOIC)
N
INDEX
AREA
E
-B-
H
0.25(0.010) M B M
123
-A-
D
SEATING PLANE
A
L
h x 45o
-C-
e A1
B
0.25(0.010) M C A M B S
µα
0.10(0.004)
C
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
M8.15 (JEDEC MS-012-AA ISSUE C)
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN MAX MIN MAX NOTES
A
0.0532 0.0688 1.35
1.75
-
A1
0.0040 0.0098 0.10
0.25
-
B
0.013 0.020 0.33
0.51
9
C
0.0075 0.0098 0.19
0.25
-
D
0.1890 0.1968 4.80
5.00
3
E
0.1497 0.1574 3.80
4.00
4
e 0.050 BSC 1.27 BSC -
H
0.2284 0.2440 5.80
6.20
-
h
0.0099 0.0196 0.25
0.50
5
L
0.016 0.050 0.40
1.27
6
N8
87
α 0o 8o 0o 8o -
Rev. 0 12/93
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet HIP2101.PDF ] | |
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