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PDF HFA1305 Data sheet ( Hoja de datos )
| Número de pieza | HFA1305 | |
| Descripción | Triple/ 560MHz/ Low Power/ Video Operational Amplifier | |
| Fabricantes | Intersil Corporation | |
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Data Sheet
HFA1305
April 1999
File Number 4727
Triple, 560MHz, Low Power, Video
Operational Amplifier
The HFA1305 is a triple, high speed, low power current
feedback amplifier built with Intersil’s proprietary
complementary bipolar UHF-1 process.
These amplifiers deliver up to 560MHz bandwidth and
1700V/µs slew rate, on only 58mW of quiescent power. They
are specifically designed to meet the performance, power,
and cost requirements of high volume video applications.
The excellent gain flatness and differential gain/phase
performance make these amplifiers well suited for
component or composite video applications. Video
performance is maintained even when driving a double
terminated cable (RL = 150Ω), and degrades only slightly
when driving two double terminated cables (RL = 75Ω). RGB
applications will benefit from the high slew rates, and high
full power bandwidth.
The HFA1305 is a pin compatible, low power, high
performance upgrade for the popular Intersil HA5013, and
for the AD8073 and CLC5623, in ±5V applications.
Ordering Information
TEMP.
PART NUMBER RANGE (oC)
PACKAGE
PKG.
NO.
HFA1305IB
-40 to 85 14 Ld SOIC
M14.15
HA5025EVAL
High Speed Op Amp DIP Evaluation Board
Features
• Low Supply Current . . . . . . . . . . . . . . . . . 5.8mA/Op Amp
• High Input Impedance . . . . . . . . . . . . . . . . . . . . . . . 1MΩ
• Wide -3dB Bandwidth (AV = +2) . . . . . . . . . . . . . . 560MHz
• Very Fast Slew Rate . . . . . . . . . . . . . . . . . . . . . . 1700V/µs
• Gain Flatness (to 50MHz) . . . . . . . . . . . . . . . . . . . . ±0.03dB
• Differential Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.02%
• Differential Phase . . . . . . . . . . . . . . . . . . . . 0.03 Degrees
• All Hostile Crosstalk (5MHz). . . . . . . . . . . . . . . . . . -60dB
• Pin Compatible Upgrade to HA5013, AD8073 and
CLC5623 in ±5V Supply Applications
Applications
• Flash A/D Drivers
• Professional Video Processing
• Video Digitizing Boards/Systems
• Computer Video Plug-In Boards
• RGB Preamps
• Medical Imaging
• Hand Held and Miniaturized RF Equipment
• Battery Powered Communications
• High Speed Oscilloscopes and Analyzers
Pinout
HFA1305
(SOIC)
TOP VIEW
NC 1
NC 2
NC 3
V+ 4
+IN 1 5
-
-IN 1 6
OUT 1 7
14 OUT 3
- 13 -IN 3
12 +IN 3
11 V-
10 +IN 2
- 9 -IN 2
8 OUT 2
1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
1 page  
HFA1305
Application Information
Optimum Feedback Resistor
Although a current feedback amplifier’s bandwidth
dependency on closed loop gain isn’t as severe as that of a
voltage feedback amplifier, there can be an appreciable
decrease in bandwidth at higher gains. This decrease may
be minimized by taking advantage of the current feedback
amplifier’s unique relationship between bandwidth and RF.
All current feedback amplifiers require a feedback resistor,
even for unity gain applications, and RF, in conjunction with
the internal compensation capacitor, sets the dominant pole
of the frequency response. Thus, the amplifier’s bandwidth is
inversely proportional to RF. The HFA1305 design is
optimized for RF = 510Ω (SOIC) at a gain of +2. Decreasing
RF decreases stability, resulting in excessive peaking and
overshoot (Note: Capacitive feedback causes the same
problems due to the feedback impedance decrease at higher
frequencies). However, at higher gains the amplifier is more
stable so RF can be decreased in a trade-off of stability for
bandwidth.
The table below lists recommended RF values for various
gains, and the expected bandwidth. For good
channel-to-channel gain matching, it is recommended that
all resistors (termination as well as gain setting) be ±1%
tolerance or better.
TABLE 1. OPTIMUM FEEDBACK RESISTOR
GAIN
(ACL)
-1
RF (Ω)
SOIC
360
BANDWIDTH (MHz)
SOIC
420
+1 464 (+RS = 649)
+2 510
375
560
+5 200
330
+10 180
140
Non-Inverting Input Source Impedance
For best operation, the DC source impedance seen by the
non-inverting input should be ≥ 50Ω. This is especially
important in inverting gain configurations where the
non-inverting input would normally be connected directly to
GND.
Pulse Undershoot
The HFA1305 utilizes a quasi-complementary output stage
to achieve high output current while minimizing quiescent
supply current. In this approach, a composite device
replaces the traditional PNP pulldown transistor. The
composite device switches modes after crossing 0V,
resulting in added distortion for signals swinging below
ground, and an increased undershoot on the negative
portion of the output waveform (see Figure 6 and Figure 9).
This undershoot isn’t present for small bipolar signals, or
large positive signals (see Figures 4, 7, 10 and Figures 5, 8).
PC Board Layout
The frequency response of this amplifier depends greatly on
the amount of care taken in designing the PC board. The
use of low inductance components such as chip
resistors and chip capacitors is strongly recommended,
while a solid ground plane is a must!
Attention should be given to decoupling the power supplies.
A large value (10µF) tantalum in parallel with a small value
(0.1µF) chip capacitor works well in most cases.
Terminated microstrip signal lines are recommended at the
input and output of the device. Capacitance, parasitic or
planned, connected to the output must be minimized, or
isolated as discussed in the next section.
Care must also be taken to minimize the capacitance to
ground seen by the amplifier’s inverting input (-IN). The
larger this capacitance, the worse the gain peaking, resulting
in pulse overshoot and eventual instability. To reduce this
capacitance the designer should remove the ground plane
under traces connected to -IN, and keep connections to -IN
as short as possible.
An example of a good high frequency layout is the
Evaluation Board shown in Figure 3.
Driving Capacitive Loads
Capacitive loads, such as an A/D input, or an improperly
terminated transmission line will degrade the amplifier’s
phase margin resulting in frequency response peaking and
possible oscillations. In most cases, the oscillation can be
avoided by placing a resistor (RS) in series with the output
prior to the capacitance.
Figure 1 details starting points for the selection of this
resistor. The points on the curve indicate the RS and CL
combinations for the optimum bandwidth, stability, and
settling time, but experimental fine tuning is recommended.
Picking a point above or to the right of the curve yields an
overdamped response, while points below or left of the curve
indicate areas of underdamped performance.
RS and CL form a low pass network at the output, thus
limiting system bandwidth well below the amplifier bandwidth
of 560MHz. By decreasing RS as CL increases (as illustrated
in the curve), the maximum bandwidth is obtained without
sacrificing stability. In spite of this, bandwidth still decreases
as the load capacitance increases.
5
5 Page 
HFA1305
Small Outline Plastic Packages (SOIC)
N
INDEX
AREA
E
-B-
H
0.25(0.010) M B M
123
-A-
D
SEATING PLANE
A
L
h x 45o
-C-
e A1
B
0.25(0.010) M C A M B S
α
0.10(0.004)
C
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
M14.15 (JEDEC MS-012-AB ISSUE C)
14 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN MAX MIN MAX NOTES
A
0.0532 0.0688 1.35
1.75
-
A1 0.0040 0.0098 0.10 0.25
-
B 0.013 0.020 0.33 0.51
9
C
0.0075 0.0098 0.19
0.25
-
D
0.3367 0.3444 8.55
8.75
3
E
0.1497 0.1574 3.80
4.00
4
e 0.050 BSC 1.27 BSC -
H
0.2284 0.2440 5.80
6.20
-
h
0.0099 0.0196 0.25
0.50
5
L 0.016 0.050 0.40 1.27
6
N 14
14 7
α 0o 8o 0o 8o -
Rev. 0 12/93
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet HFA1305.PDF ] | |
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