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AN-0001 Datasheet Download - ANADIGICS

Номер произв AN-0001
Описание Surface Mount Assembly and Handling
Производители ANADIGICS
логотип ANADIGICS логотип 


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AN-0001 Даташит, Описание, Даташиты
Assembly of LPCC Packages
Surface Mount Assembly and Handling of
1.0 Overview
ANADIGICS power amplifiers are typically packaged in a Leadless Plastic Chip Carrier (LPCC) package.
These LPCC packages have two types of pads, mounting pads and a thermal pad, both of which must be
correctly soldered for proper electrical contact to the PCB. The appropriate steps should be taken during
PCB design and assembly to guarantee optimum performance from the power amplifiers. This
application note outlines the steps necessary for the handling and assembly of ANADIGICS power
2.0 Requirements
2.1 PCB Design Guidelines:
1. PCB land and solder masking recommendations are shown in Figure 1.
A = Clearance from PCB thermal pad to solder mask opening, 0.0635 mm minimum
B = Clearance from edge of PCB thermal pad to PCB land, 0.2 mm minimum
C = Clearance from PCB land edge to solder mask opening to be as tight as
possible to ensure that some solder mask remains between PCB pads
D = PCB land length = LPCC solder pad length + 0.1mm
E = PCB land width = LPCC solder pad width
Figure 1. PCB Land and Solder Mask Recommendations.

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AN-0001 Даташит, Описание, Даташиты
2. Plated-Through Holes or vias should not be used in the mounting pads for the IC
circuit connections.
3. Thermal vias should be used on the PCB thermal pad (middle ground pad) to improve
thermal conductivity from the device to a copper ground plane area on the reverse side of
the printed circuit board. The number of vias depends on the package thermal
requirements, as determined by thermal simulation or actual testing.
4. Increasing the number of vias through the printed circuit board will improve the thermal
conductivity to the reverse side ground plane and external heat sink. In general, adding
more metal through the PC board under the IC will improve operational heat transfer, but
will require careful attention to uniform heating of the board during assembly.
5. For best thermal performance, provision should be made to provide a thermal path from
the reverse side ground plane to an external heat sink.
2.2 Package Handling
1. ESD precautions must be observed at all times when handling these packages.
2. Packages should be used in accordance with their MSL (Moisture Sensitivity Level) rating
found on the device datasheet.
3. MSL-3 packages should be used 168 hours after they have been removed from the
sealed moisture barrier bag. After 168 hours, packages should be baked for 24 hours at
125 °C before usage or resealing in a sealed moisture barrier bag.
4. MSL-2 packages have a lifespan of 12 months after they have been removed from a
sealed moisture barrier bag, after which they must be baked as above before usage.
5. MSL-1 packages have an infinite lifespan after initial baking in the factory.
3.0 Assembly Process
3.1 Stencil Design & Solder Paste Application
1. Stainless steel stencils are recommended for solder paste application.
2. A stencil thickness of 0.125 – 0.150 mm (5 – 6 mils) is recommended for screening.
3. For the PCB thermal pad, solder paste should be printed on the PCB by designing a
stencil with an array of smaller openings that sum to 50% of the LPCC thermal pad area
as shown in Figure 2.
4. The aperture opening for the signal pads should be between 50-80% of the LPCC pad
area as shown in Figure 3.
5. Optionally, for better solder paste release, the aperture walls should be trapezoidal and
the corners rounded.
6. The fine pitch of the IC leads requires accurate alignment of the stencil and the printed
circuit board. The stencil and printed circuit assembly should be aligned to within + 1 mil
prior to application of the solder paste.
7. No-clean flux is recommended since flux from underneath the thermal pad will be difficult
to clean if water-soluble flux is used.
3.2 Soldering Options & Package Placement
1. Hand soldering of these devices is not recommended even for prototypes.
2. Infrared or Convection mass reflow soldering is the preferred method of LPCC
2 05/2003

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AN-0001 Даташит, Описание, Даташиты
Figure 2. Solder Paste Application on Paddle:
Solder paste should be applied through an array of squares (or circles)
which totals 50% of the total area of the paddle
Minimum 50%
62 % coverage
Figure 3. Solder Paste Application on Pins.
Maximum 80%

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