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PDF NVF2955 Data sheet ( Hoja de datos )
| Número de pieza | NVF2955 | |
| Descripción | Power MOSFET ( Transistor ) | |
| Fabricantes | ON Semiconductor | |
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NTF2955, NVF2955,
NVF2955P
Power MOSFET
−60 V, −2.6 A, Single P−Channel SOT−223
Features
• Design for low RDS(on)
• Withstands High Energy in Avalanche and Commutation Modes
• AEC−Q101 Qualified − NVF2955, NVF2955P
• These Devices are Pb−Free and are RoHS Compliant
Applications
• Power Supplies
• PWM Motor Control
• Converters
• Power Management
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol
Drain−to−Source Voltage
VDSS
Gate−to−Source Voltage
VGS
Continuous Drain
Current (Note 1)
Steady
State
TA = 25°C
TA = 85°C
ID
Power Dissipation
(Note 1)
Steady TA = 25°C
State
PD
Value
−60
±20
−2.6
−2.0
2.3
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
Steady
State
TA = 25°C
TA = 85°C
TA = 25°C
ID
PD
−1.7
−1.3
1.0
Unit
V
V
A
W
A
W
Pulsed Drain Current
tp = 10 ms
Operating Junction and Storage Temperature
Single Pulse Drain−to−Source Avalanche
Energy (VDD = 25 V, VG = 10 V, IPK = 6.7 A,
L = 10 mH, RG = 25 W)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 seconds)
IDM
TJ,
TSTG
EAS
−17
−55 to
175
225
A
°C
mJ
TL 260 °C
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Unit
Junction−to−Tab (Drain) − Steady State (Note 2) RqJC
14
Junction−to−Ambient − Steady State (Note 1)
RqJA
65 °C/W
Junction−to−Ambient − Steady State (Note 2)
RqJA
150
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 1 in. pad size (Cu. area = 1.127
in2 [1 oz] including traces)
2. When surface mounted to an FR4 board using the minimum recommended
pad size (Cu. area = 0.341 in2)
© Semiconductor Components Industries, LLC, 2013
May, 2013 − Rev. 6
1
http://onsemi.com
V(BR)DSS
−60 V
RDS(on) TYP
145 mW @ −10 V
P−Channel
D
ID MAX
−2.6 A
G
S
MARKING DIAGRAMS AND
PIN ASSIGNMENT
4 Drain
4
123
SOT−223
CASE 318E
STYLE 3
1
Gate
AYW
2955G
G
2
Drain
4 Drain
3
Source
AYW
2955PG
G
1
Gate
2
Drain
3
Source
A = Assembly Location
Y = Year
W = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NTF2955T1G
SOT−223 1000 /Tape & Reel
(Pb−Free)
NVF2955T1G
SOT−223 1000/ Tape & Reel
(Pb−Free)
NVF2955PT1G SOT−223 1000/ Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
NTF2955/D
http://www.Datasheet4U.com
1 page  
NTF2955, NVF2955, NVF2955P
PACKAGE DIMENSIONS
D
b1
4
HE
12 3
e1
e
0.08 (0003)
A1
E
b
A
SOT−223 (TO−261)
CASE 318E−04
ISSUE N
q
L
C
L1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
MILLIMETERS
DIM MIN
NOM MAX
A 1.50 1.63 1.75
A1 0.02
0.06
0.10
b 0.60 0.75 0.89
b1 2.90
3.06
3.20
c 0.24 0.29 0.35
D 6.30 6.50 6.70
E 3.30 3.50 3.70
e 2.20 2.30 2.40
e1 0.85
0.94
1.05
L 0.20 −−− −−−
L1 1.50
1.75
2.00
H E 6.70
7.00
7.30
q 0°
− 10°
STYLE 3:
PIN 1. GATE
2. DRAIN
3. SOURCE
4. DRAIN
MIN
0.060
0.001
0.024
0.115
0.009
0.249
0.130
0.087
0.033
0.008
0.060
0.264
0°
INCHES
NOM
0.064
0.002
0.030
0.121
0.012
0.256
0.138
0.091
0.037
−−−
0.069
0.276
−
MAX
0.068
0.004
0.035
0.126
0.014
0.263
0.145
0.094
0.041
−−−
0.078
0.287
10°
SOLDERING FOOTPRINT*
3.8
0.15
2.0
0.079
2.3
0.091
2.3
0.091
6.3
0.248
2.0
0.079
1.5
0.059
ǒ ǓSCALE 6:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semi conductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a numb er of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
http://onsemi.com
5
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NTF2955/D
5 Page | ||
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| PDF Descargar | [ Datasheet NVF2955.PDF ] | |
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