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PDF HD74HCT574 Data sheet ( Hoja de datos )
| Número de pieza | HD74HCT574 | |
| Descripción | Octal D-type Flip-Flops (with 3-state outputs) | |
| Fabricantes | Hitachi Semiconductor | |
| Logotipo |  |
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HD74HCT564/HD74HCT574
Octal D-type Flip-Flops (with 3-state outputs)
Description
These devices are positive edge triggered flip-flops. The difference between HD74HCT564 and
HD74HCT574 is only that the former has inverting outputs and the latter has non-inverting outputs.
Data at the D inputs, meeting the set-up and hold time requirements, are transferred to the Q or Q outputs
on positive going transitions of the clock (CK) input. When a high logic level is applied to the output
control (OC) input, all outputs go to a high impedance state, regardless of what signals are present at the
other inputs and the state of the storage elements.
Features
• LSTTL Output Logic Level Compatibility as well as CMOS Output Compatibility
• High Speed Operation: tpd (D to Q, Q) = 15 ns typ (CL = 50 pF)
• High Output Current: Fanout of 15 LSTTL Loads
• Wide Operating Voltage: VCC = 4.5 to 5.5 V
• Low Input Current: 1 µA max
• Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
Function Table
Output Control
L
L
L
H
Clock
L
X
Data
H
L
X
X
Outputs
HD74HCT564
L
H
Q0
Z
HD74HCT574
H
L
Q0
Z
1 page  
HD74HCT564/HD74HCT574
HD74HCT574
1D
2D
3D
4D
5D
6D
7D
8D
CLK
OC
D
CQ
C
D
CQ
C
D
CQ
C
D
CQ
C
D
CQ
C
D
CQ
C
D
CQ
C
D
CQ
C
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
Absolute Maximum Ratings
Item
Supply voltage range
Input voltage
Output voltage
DC current drain per pin
DC current drain per VCC, GND
DC input diode current
DC output diode current
Power dissipation per package
Storage temperature
Symbol
VCC
VIN
VOUT
I OUT
ICC, IGND
I IK
I OK
PT
Tstg
Rating
–0.5 to +7.0
–0.5 to VCC + 0.5
–0.5 to VCC + 0.5
±35
±75
±20
±20
500
–65 to +150
Unit
V
V
V
mA
mA
mA
mA
mW
°C
5
5 Page 
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL
NorthAmerica
Europe
Asia (Singapore)
Asia (Taiwan)
Asia (HongKong)
Japan
: http:semiconductor.hitachi.com/
: http://www.hitachi-eu.com/hel/ecg
: http://www.has.hitachi.com.sg/grp3/sicd/index.htm
: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
: http://www.hitachi.com.hk/eng/bo/grp3/index.htm
: http://www.hitachi.co.jp/Sicd/indx.htm
For further information write to:
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
Hitachi Europe GmbH
Electronic components Group
Dornacher Stra§e 3
D-85622 Feldkirchen, Munich
Germany
Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
Hitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 778322
Hitachi Asia Pte. Ltd.
Hitachi Asia (Hong Kong) Ltd.
16 Collyer Quay #20-00
Group III (Electronic Components)
Hitachi Tower
7/F., North Tower, World Finance Centre,
Singapore 049318
Harbour City, Canton Road, Tsim Sha Tsui,
Tel: 535-2100
Kowloon, Hong Kong
Fax: 535-1533
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Hitachi Asia Ltd.
Telex: 40815 HITEC HX
Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet HD74HCT574.PDF ] | |
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