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HCD-XGV11AV PDF даташит

Спецификация HCD-XGV11AV изготовлена ​​​​«Sony» и имеет функцию, называемую «COMPONENT Hi-Fi STEREO SYSTEM SERVICE MANUAL».

Детали детали

Номер произв HCD-XGV11AV
Описание COMPONENT Hi-Fi STEREO SYSTEM SERVICE MANUAL
Производители Sony
логотип Sony логотип 

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HCD-XGV11AV Даташит, Описание, Даташиты
HCD-XGV11AV
SERVICE MANUAL
Ver 1.0 2003.05
E Model
• HCD-XGV11AV is the Amplifier,
CD player, tape deck and tuner
section in LBT-XGV11AV.
CD
Section
TAPE
Section
Model Name Using Similar Mechanism
CD Mechanism Type
Base Unit Name
Optical Pick-up Name
Model Name Using Similar Mechanism
Tape Mechanism Type
HCD-XGV6/XGV8/XGV10AV
CDM37B-30BD62
BU-30BD62
A-MAX.3
NEW
CWM43RR23
SPECIFICATIONS
Amplifier section
Front speaker:
The following measured at AC 120, 220, 240 V 50 Hz
DIN power output (rated):
150 + 150 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
200 + 200 watts
(6 ohms at 1 kHz, 10% THD)
Center speaker:
DIN power output (rated):
35 watts
(8 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
50 watts
(8 ohms at 1 kHz, 10% THD)
Surround speaker:
DIN power output (rated):
35 + 35 watts
(8 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
50 + 50 watts
(8 ohms at 1 kHz, 10% THD)
Inputs
PHONO IN (phono jacks):
sensitivity 3 mV,
impedance 47 kilohms
MIC-1/MIC-2 (phone jacks): sensitivity 1 mV,
impedance 10 kilohms
GAME INPUT AUDIO (phono jacks):
sensitivity 250 mV,
impedance 47 kilohms
GAME INPUT VIDEO (phono jack):
1Vp-p, 75 ohms
MD (VIDEO) IN (phono jacks):
sensitivity 450 mV
(250 mV), impedance
47 kilohms
DVD INPUT
FRONT, REAR, CENTER, WOOFER (phono jacks):
sensitivity 450 mV,
impedance 47 kilohms
DVD VIDEO INPUT (phono jack):
1Vp-p, 75 ohms
Outputs
PHONES (stereo phone jack):
MD (VIDEO) OUT (phono jacks):
VIDEO OUT (phono jack):
SUB WOOFER OUT (phono jack):
FRONT SPEAKER:
CENTER SPEAKER:
accepts headphones of
8 ohms or more
voltage 250 mV,
impedance 1 kilohm
max. output level 1Vp-p,
load impedance 75 ohms
voltage 1 V,
impedance 1 kilohm
accepts impedance of 6 to
16 ohms
accepts impedance of 8 to
16 ohms
— Continued on next page —
COMPONENT Hi-Fi STEREO SYSTEM
9-877-430-01
2003E02-1
© 2003.05
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation









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HCD-XGV11AV Даташит, Описание, Даташиты
HCD-XGV11AV
SURROUND SPEAKER:
accepts impedance of 8 to 16 ohms
CD player section
System
Laser
Frequency response
Signal-to-noise ratio
Dynamic range
Video color system format
Compact disc digital audio system
Semiconductor laser
(λ=795 nm)
Emission duration: continuous
2 Hz – 20 kHz (±0.5 dB)
More than 90 dB
More than 90 dB
NTSC, PAL
Tape deck section
Recording system
Frequency response
4-track 2-channel, stereo
40 – 13,000 Hz (±3 dB),
using Sony TYPE I cassettes
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range:
87.5 – 108.0 MHz
(50 kHz step)
Antenna
FM lead antenna
Antenna terminals
75 ohms unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range:
Antenna
Antenna terminals
Intermediate frequency
530 – 1,710 kHz
(with the tuning interval set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval set at 9 kHz)
AM loop antenna
External antenna terminal
450 kHz
General
Power requirements
Power consumption
Dimensions (w/h/d)
Mass
120 V, 220 V or
230 – 240 V AC, 50/60 Hz
Adjustable with voltage selector
230 watts
Approx. 355 x 425 x 451 mm
Approx. 15.4 kg
Design and specifications are subject to change without notice.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
2









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HCD-XGV11AV Даташит, Описание, Даташиты
HCD-XGV11AV
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
TABLE OF CONTENTS
1. SERVICING NOTE ·························································· 4
2. GENERAL ·········································································· 5
3. DISASSEMBLY ································································ 7
4. TEST MODE ···································································· 16
5. MECHANICAL ADJUSTMENTS ····························· 18
6. ELECTRICAL ADJUSTMENTS ······························· 18
7. DIAGRAMS
7-1. Circuit Board Location ······················································ 22
7-2. Block Diagram – CD Servo Section – ······························· 24
Block Diagram – Tuner/Tape Deck Section – ··················· 25
Block Diagram – Main Section – ······································ 26
Block Diagram
– Display/Key Control/Power Supply Section – ·········· 27
7-3. Printed Wiring Board – BD Section – ······························· 28
7-4. Schematic Diagram – BD Section – ·································· 29
7-5. Printed Wiring Board – Video Section – ··························· 30
7-6. Schematic Diagram – Video Section – ······························ 31
7-7. Printed Wiring Board – Motor LED Section – ·················· 32
7-8. Schematic Diagram –Motor LED Section – ······················ 32
7-9. Schematic Diagram – Main (1/4) Section – ······················ 33
7-10. Schematic Diagram – Main (2/4) Section – ······················ 34
7-11. Schematic Diagram – Main (3/4) Section – ······················ 35
7-12. Schematic Diagram – Main (4/4) Section – ······················ 36
7-13.Printed Wiring Board – Main Section – ····························· 37
7-14. Printed Wiring Board – CD-L, CD-R Section – ················ 38
7-15. Schematic Diagram – CD-L, CD-R Section – ··················· 39
7-16. Printed Wiring Board – TC-A, TC-B Section – ················ 40
7-17. Schematic Diagram – TC-A, TC-B Section – ··················· 41
7-18.Printed Wiring Board – Panel VR, Key Section – ············· 42
7-19. Schematic Diagram – Panel VR, Key Section – ················ 43
7-20.Printed Wiring Board – Panel FL Section – ······················· 44
7-21. Schematic Diagram – Panel FL Section – ························· 45
7-22. Printed Wiring Board – Power Amp Section – ·················· 46
7-23. Schematic Diagram – Power Amp Section – ····················· 47
7-24. Printed Wiring Board – Sub Amp Section – ····················· 48
7-25. Schematic Diagram – Sub Amp Section – ························· 49
7-26. Printed Wiring Board – Prologic Section – ······················· 50
7-27. Schematic Diagram – Prologic Section – ·························· 51
7-28. Printed Wiring Board – Mic Section – ······························ 52
7-29. Schematic Diagram – Mic Section – ································· 52
7-30. Printed Wiring Board – Power Supply Section – ·············· 53
7-31. Schematic Diagram – Power Supply Section – ················· 53
7-32. IC Pin Function Description ············································· 54
7-33. IC Block Diagram ····························································· 60
8. EXPLODED VIEWS
8-1. Case,Back Panel Section ··················································· 63
8-2. Front Panel Section-1 ························································ 64
8-3. Front Panel Section-2 ························································ 65
8-4. Chassis Section ·································································· 66
8-5. CD Mechanism Deck Section (CDM-30BD62) ················ 67
8-6. Base Unit Section (BU-30BD62) ······································ 68
9. ELECTRICAL PARTS LIST ······································· 69
3










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Номер в каталогеОписаниеПроизводители
HCD-XGV11AVCOMPONENT Hi-Fi STEREO SYSTEM SERVICE MANUALSony
Sony

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