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PDF HCT273 Data sheet ( Hoja de datos )
| Número de pieza | HCT273 | |
| Descripción | Octal D Flip-Flop with Common Clock and Reset with LSTTL-Compatible Inputs | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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MC74HCT273A
Octal D Flip-Flop with
Common Clock and Reset
with LSTTL-Compatible
Inputs
High–Performance Silicon–Gate CMOS
The MC74HCT273A may be used as a level converter for
interfacing TTL or NMOS outputs to High–Speed CMOS inputs.
The HCT273A is identical in pinout to the LS273.
This device consists of eight D flip–flops with common Clock and
Reset inputs. Each flip–flop is loaded with a low–to–high transition of
the Clock input. Reset is asynchronous and active low.
• Output Drive Capability: 10 LSTTL Loads
• TTL/NMOS Compatible Input Levels
• Outputs Directly Interface to CMOS, NMOS and TTL
• Operating Voltage Range: 4.5 to 5.5 V
• Low Input Current: 1.0 µA
• In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
• Chip Complexity: 284 FETs or 71 Equivalent Gates
LOGIC DIAGRAM
DATA
INPUTS
D0 3
D1 4
D2 7
D3 8
D4 13
D5 14
D6 17
D7 18
CLOCK 11
2 Q0
5 Q1
6 Q2
9 Q3
12 Q4
15 Q5
16 Q6
19 Q7
NONINVERTING
OUTPUTS
RESET 1
PIN 20 = VCC
PIN 10 = GND
FUNCTION TABLE
Inputs
Output
Reset Clock D
Q
L XX
L
H HH
H LL
H L X No Change
H X No Change
X = Don’t Care
Z = High Impedance
http://onsemi.com
20
1
20
1
PDIP–20
N SUFFIX
CASE 738
MARKING
DIAGRAMS
20
MC74HCT273AN
AWLYYWW
SOIC WIDE–20
DW SUFFIX
CASE 751D
1
20
HCT273A
AWLYYWW
1
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
PIN ASSIGNMENT
RESET
Q0
D0
D1
Q1
Q2
D2
D3
Q3
GND
1
2
3
4
5
6
7
8
9
10
20 VCC
19 Q7
18 D7
17 D6
16 Q6
15 Q5
14 D5
13 D4
12 Q4
11 CLOCK
ORDERING INFORMATION
Device
Package Shipping
MC74HCT273AN
PDIP–20 1440 / Box
MC74HCT273ADW SOIC–WIDE 38 / Rail
MC74HCT273ADWR2 SOIC–WIDE 1000 / Reel
© Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 8
1
Publication Order Number:
MC74HCT273A/D
1 page  
–A–
20
1
–T–
SEATING
PLANE
E
GF
MC74HCT273A
PACKAGE DIMENSIONS
PDIP–20
N SUFFIX
PLASTIC DIP PACKAGE
CASE 738–03
ISSUE E
11
B
10
CL
K
N
D 20 PL
0.25 (0.010) M T A M
M
J 20 PL
0.25 (0.010) M
TBM
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 1.010 1.070 25.66 27.17
B 0.240 0.260 6.10 6.60
C 0.150 0.180 3.81 4.57
D 0.015 0.022 0.39 0.55
E 0.050 BSC
1.27 BSC
F 0.050 0.070 1.27 1.77
G 0.100 BSC
2.54 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.140 2.80 3.55
L 0.300 BSC
7.62 BSC
M 0_ 15_ 0_ 15_
N 0.020 0.040 0.51 1.01
SO–20
DW SUFFIX
CASE 751D–05
ISSUE F
D
A
q
20 11
E
1 10
20X B
B
0.25 M T A S B S
18X e
A
SEATING
PLANE
A1 T
C
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT
MAXIMUM MATERIAL CONDITION.
MILLIMETERS
DIM MIN MAX
A 2.35 2.65
A1 0.10 0.25
B 0.35 0.49
C 0.23 0.32
D 12.65 12.95
E 7.40 7.60
e 1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
q 0_ 7_
http://onsemi.com
5
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet HCT273.PDF ] | |
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