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NCP380 PDF даташит

Спецификация NCP380 изготовлена ​​​​«ON Semiconductor» и имеет функцию, называемую «Fixed/Adjustable Current Limiting Power DistributionSwitches».

Детали детали

Номер произв NCP380
Описание Fixed/Adjustable Current Limiting Power DistributionSwitches
Производители ON Semiconductor
логотип ON Semiconductor логотип 

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NCP380 Даташит, Описание, Даташиты
NCP380, NCV380
Fixed/Adjustable
Current‐Limiting
Power‐Distribution
Switches
The NCP380 is a high side power-distribution switch designed for
applications where heavy capacitive loads and short-circuits are likely
to be encountered. The device includes an integrated 55 mW (DFN
package), P-channel MOSFET. The device limits the output current to
a desired level by switching into a constant-current regulation mode
when the output load exceeds the current-limit threshold or a short is
present. The current-limit threshold is either user adjustable between
500 mA and 2.1 A via an external resistor or internally fixed. The
power-switch rise and fall times are controlled to minimize current
ringing during switching.
An internal reverse-voltage detection comparator disables the
power-switch if the output voltage is higher than the input voltage to
protect devices on the input side of the switch.
The FLAG logic output asserts low during over current,
reverse-voltage or over temperature conditions. The switch is
controlled by a logic enable input active high or low.
Features
2.5 V – 5.5 V Operating Range
70 mW High-side MOSFET
Current Limit:
User adjustable from 500 mA to 2.1 A
Fixed 500 mA, 1 A, 1.5 A, 2 A and 2.1 A
Under Voltage Lock-out (UVLO)
Built-in Soft-start
Thermal Protection
Soft Turn-off
Reverse Voltage Protection
Junction Temperature Range: −40°C to 125°C
Enable Active High or Low (EN or EN)
Compliance to IEC61000−4−2 (Level 4)
8.0 kV (Contact)
15 kV (Air)
UL Listed − File No. E343275
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These are Pb-Free Devices
Typical Applications
Laptops
USB Ports/Hubs
TVs
www.onsemi.com
UDFN6
CASE 517AB
TSOP−5
CASE 483
TSOP−6
CASE 318G
MARKING DIAGRAMS
16
2 XXMG 5
3G4
UDFN6
5
XXXAYWG
G
1
TSOP−5
XXXAYWG
G
1
TSOP−6
XXX = Specific Device Code
A =Assembly Location
M = Date Code
Y = Year
W = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 20 of this data sheet.
© Semiconductor Components Industries, LLC, 2016
July, 2016 − Rev. 16
1
Publication Order Number:
NCP380/D









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NCP380 Даташит, Описание, Даташиты
USB INPUT
5V
FLAG
EN
Rfault
100 kW
NCP380, NCV380
1 mF
IN OUT
NCP380
FLAG
EN
ILIM*
GND
120 mF
Rlim
USB
DATA
D+
D−
VBUS
GND
USB
Port
*For Adjustable Version Only.
Figure 1. Typical Application Circuit
OUT 1
6 IN
OUT 1
5 IN
ILIM* 2 PAD1
5 GND
GND 2
FLAG 3
4 EN
UDFN6
(Top view)
FLAG 3
4 EN
TSOP−5
*For adjustable version only, otherwise not connected.
Figure 2. Pin Connections
IN 1
6 OUT
GND 2
5 ILIM*
EN 3
4 FLAG
TSOP−6
Table 1. PIN FUNCTION DESCRIPTION
Pin Name
Type
Description
EN
INPUT
Enable input, logic low/high (i.e. EN or EN) turns on power switch
GND
POWER Ground connection;
IN POWER Power-switch input voltage; connect a 1 mF or greater ceramic capacitor from IN to GND as close as pos-
sible to the IC.
FLAG
OUTPUT
Active-low open-drain output, asserted during overcurrent, overtemperature or reverse-voltage conditions.
Connect a 10 kW or greater resistor pull-up, otherwise leave unconnected.
OUT
OUTPUT
Power-switch output; connect a 1 mF ceramic capacitor from OUT to GND as close as possible to the IC
is recommended. A 1 mF or greater ceramic capacitor from OUT to GND must be connected if the USB
requirement (i.e.120 mF capacitor minimum) is not met.
ILIM*
INPUT
External resistor used to set current-limit threshold; recommended 5 kW < RILIM < 250 kW.
PAD1**
THERMAL Exposed Thermal Pad: Must be soldered to PCB Ground plane
*(For adjustable version only, otherwise not connected.
**For DFN version only.
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NCP380 Даташит, Описание, Даташиты
NCP380, NCV380
Table 2. MAXIMUM RATINGS
Rating
Symbol
Value
Unit
From IN to OUT Pins: Input/Output (Note 1)
IN, OUT, EN, ILIM, FLAG, Pins: Input/Output (Note 1)
FLAG Sink Current
ILIM Source Current
ESD Withstand Voltage (IEC 61000−4−2)
(Output Only, when Bypassed with 1.0 mF Capacitor Minimum)
VIN , VOUT
VEN, VILIM, VFLAG, VIN, VOUT
ISINK
ILIM
ESD IEC
−7.0 to +7.0
−0.3 to +7.0
1
1
15 Air, 8 Contact
V
V
mA
mA
kV
Human Body Model (HBM) ESD Rating (Note 2)
ESD HBM
2,000
V
Machine Model (MM) ESD Rating (Notes 2 and 3)
ESD MM
200 V
Latch-up Protection (Note 4)
Pins IN, OUT, EN, ILIM, FLAG
LU mA
100
Maximum Junction Temperature Range (Note 6)
Storage Temperature Range
Moisture Sensitivity (Note 5)
TJ
TSTG
MSL
−40 to +TSD
−40 to +150
Level 1
°C
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. According to JEDEC standard JESD22−A108.
2. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115 for all pins.
3. Except EN pin, 150 V.
4. Latch up Current Maximum Rating: ±100 mA per JEDEC standard: JESD78 class II.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020.
6. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation.
Table 3. OPERATING CONDITIONS
Symbol
Parameter
Conditions
Min Typ Max Unit
VIN
VEN
TA
TJ
RILIM
ISINK
CIN
COUT
RqJA
Operational Power Supply
Enable Voltage
Ambient Temperature Range
Junction Temperature Range
Resistor from ILIM to GND Pin
FLAG Sink Current
Decoupling Input Capacitor
Decoupling Output Capacitor
Thermal Resistance Junction-to-Air
USB Port per Hub
UDFN−6 Package (Notes 7 and 8)
TSOP−5 Package (Notes 7 and 8)
2.5 − 5.5 V
0 − 5.5
−40 25 +85 °C
−40 25 +125 °C
5.0 − 250 kW
− − 1.0 mA
1.0 −
mF
120 −
mF
− 120 − °C/W
− 305 − °C/W
TSOP−6 Package (Notes 7 and 8)
− 280 − °C/W
IOUT
Maximum DC Current
UDFN−6 Package
TSOP−5, TSOP−6 Package
− − 2.1 A
− − 1.0 A
PD Power Dissipation Rating (Note 9)
TA v 25°C
UDFN−6 Package
− 830 − mW
TSOP−5 Package
− 325 − mW
TSOP−6 Package
− 350 − mW
TA = 85°C
UDFN−6 Package
TSOP−5 Package
− 325 − mW
− 130 − mW
TSOP−6 Package
− 145 − mW
7. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation.
8. The RqJA is dependent of the PCB heat dissipation. Board used to drive this data was a 2” × 2” NCP380EVB board. It is a 2 layers board
with 2-once copper traces on top and bottom of the board. Exposed pad is connected to ground plane for UDFN−6 version only.
9. The maximum power dissipation (PD) is given by the following formula:
TJMAX * TA
PD +
RqJA
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