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PDF NRVUB1620CTRT4G Data sheet ( Hoja de datos )

Número de pieza NRVUB1620CTRT4G
Descripción SWITCHMODE Power Rectifier
Fabricantes ON Semiconductor 
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MUR1620CTRG,
MURB1620CTRG,
NRVUB1620CTRT4G
Switch Mode
Power Rectifier
These state−of−the−art devices are designed for use in negative
switching power supplies, inverters and as free wheeling diodes. Also,
used in conjunction with common cathode dual Ultrafast Rectifiers,
makes a single phase full−wave bridge.
Features
Common Anode Dual Rectifier (8.0 A per Leg or 16 A per Package)
Ultrafast 35 Nanosecond Reverse Recovery Times
Exhibits Soft Recovery Characteristics
High Temperature Glass Passivated Junction
Low Leakage Specified @ 150°C Case Temperature
Current Derating @ Both Case and Ambient Temperatures
Epoxy Meets UL 94 V−0 @ 0.125 in
Complement to MUR1620CT and MURB1620CT Common Cathode
Device
ESD Ratings:
Machine Model = C (> 400 V)
Human Body Model = 3B (> 16,000 V)
NRVU Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These are Pb−Free Devices*
Mechanical Characteristics:
Case: Epoxy, Molded
Weight: MUR1620CTR: 1.9 Grams (Approximately)
MURB1620CTR: 1.7 Grams (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
www.onsemi.com
ULTRAFAST RECTIFIER
16 AMPERES, 200 VOLTS
TO−220AB
CASE 221A
STYLE 7
D2PAK
CASE 418AJ
1
2, 4
3
MARKING DIAGRAMS
AYWW
U1620RG
KAK
AYWW
U1620RG
KAK
TO−220AB
D2PAK
U1620R = Device Code
KAK = Diode Polarity
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2015
January, 2015 − Rev. 9
1
Publication Order Number:
MUR1620CTR/D

1 page




NRVUB1620CTRT4G pdf
MUR1620CTRG, MURB1620CTRG, NRVUB1620CTRT4G
PACKAGE DIMENSIONS
L1
H
e
NOTE 6
E
E2
TOP VIEW
D2PAK−3 (TO−263, 3−LEAD)
CASE 418AJ
ISSUE B
AA
NOTE 3
D
B
SEATING
PLANE
c2
A
D1
DETAIL C
L1
E1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. CHAMFER OPTIONAL
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH. MOLD FLASH SHALL NOT EXCEED 0.005
PER SIDE. THESE DIMENSIONS ARE MEASURED
AT THE OUTERMOST EXTREMES OF THE PLAS-
TIC BODY AT DATUM H.
5. THERMAL PAD CONTOUR IS OPTIONAL WITHIN
DIMENSIONS E, L1, D1 AND E1.
6. OPTIONAL MOLD FEATURE
L2
A
c
2X b SIDE VIEW
0.10 M B A M
0.10 M B A M
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.160 0.190 4.06 4.83
A1 0.000 0.010 0.00 0.25
VIEW A−A
b 0.020 0.039
c 0.012 0.029
0.51
0.30
0.99
0.74
c2 0.045 0.065 1.14 1.65
GAUGE
H
D 0.330 0.380 8.38 9.65
D1 0.260 −−−− 6.60 −−−−
PLANE
E 0.380 0.420 9.65 10.67
L3 E1 0.245 −−−− 6.22 −−−−
e 0.100 BSC
2.54 BSC
H 0.575 0.625 14.60 15.88
L 0.070 0.110 1.78 2.79
L1 −−−− 0.066 −−−− 1.68
M
L A1
DETAIL C
B
SEATING
PLANE
L2 −−−− 0.070 −−−− 1.78
L3 0.010 BSC
0.25 BSC
M 0° 8° 0° 8°
VIEW A−A
OPTIONAL CONSTRUCTIONS
RECOMMENDED
SOLDERING FOOTPRINT*
0.436
0.653
0.366
2X
0.169
2X
0.063
0.100
PITCH
DIMENSIONS: INCHES
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
5

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