NGD8209N Datasheet PDF ( Pinout )

NGD8209N Datasheet PDF - ON Semiconductor

Part Number	*NGD8209N*
Description	Ignition IGBT
Manufacturers	ON Semiconductor
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NGD8209N

Ignition IGBT 12 A, 410 V

N−Channel DPAK

This Logic Level Insulated Gate Bipolar Transistor (IGBT) features

monolithic circuitry integrating ESD and Over−Voltage clamped

protection for use in inductive coil drivers applications. Primary uses

include motorbike ignition, Direct Fuel Injection, or wherever high

voltage and high current switching is required.

Features

• Ideal for Coil−on−Plug Applications

• DPAK Package Offers Smaller Footprint and Increased Board Space

• Gate−Emitter ESD Protection

• Temperature Compensated Gate−Collector Voltage Clamp Limits

Stress Applied to Load

• Low Saturation Voltage

• High Pulsed Current Capability

• These are Pb−Free Devices

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

Rating

Symbol Value

Unit

Collector−Emitter Voltage

Collector−Gate Voltage

Gate−Emitter Voltage

Collector Current−Continuous

@ TC = 25°C − Pulsed

VCES

VCER

VGE

445 VDC

15 VDC

12 ADC

30 AAC

ESD (Human Body Model)

R = 1500 Ω, C = 100 pF

ESD

8.0

ESD (Machine Model) R = 0 Ω, C = 200 pF

ESD 800 V

Total Power Dissipation @ TC = 25°C

Derate above 25°C

PD 94 Watts

0.63 W/°C

Operating and Storage Temperature Range

TJ, Tstg −55 to

+175

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

http://onsemi.com

12 AMPS

410 VOLTS

VCE(on) 3 2.0 V @

IC = 6.0 A, VGE . 4.0 V

G RG

RGE

DPAK

CASE 369C

STYLE 7

MARKING DIAGRAM

Gate

Collector

YWW

NGD

8209G

Collector

Emitter

Y = Year

WW = Work Week

G = Pb−Free Device

ORDERING INFORMATION

Device

NGD8209NT4G

Package

DPAK

(Pb−Free)

Shipping†

2500 / Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

October, 2012 − Rev. 0

Publication Order Number:

NGD8209N/D

NGD8209N

PACKAGE DIMENSIONS

DPAK (SINGLE GAUGE)

CASE 369C

ISSUE D

12 3

B c2

DETAIL A

0.005 (0.13) M C

GAUGE

PLANE

DETAIL A

ROTATED 905 CW

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: INCHES.

3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-

MENSIONS b3, L3 and Z.

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS, OR BURRS. MOLD

FLASH, PROTRUSIONS, OR GATE BURRS SHALL

NOT EXCEED 0.006 INCHES PER SIDE.

5. DIMENSIONS D AND E ARE DETERMINED AT THE

OUTERMOST EXTREMES OF THE PLASTIC BODY.

6. DATUMS A AND B ARE DETERMINED AT DATUM

PLANE H.

SEATING

PLANE

INCHES

DIM MIN MAX

A 0.086 0.094

A1 0.000 0.005

b 0.025 0.035

b2 0.030 0.045

b3 0.180 0.215

c 0.018 0.024

c2 0.018 0.024

D 0.235 0.245

E 0.250 0.265

e 0.090 BSC

H 0.370 0.410

L 0.055 0.070

L1 0.108 REF

L2 0.020 BSC

L3 0.035 0.050

L4 −−− 0.040

Z 0.155 −−−

MILLIMETERS

MIN MAX

2.18 2.38

0.00 0.13

0.63 0.89

0.76 1.14

4.57 5.46

0.46 0.61

5.97 6.22

6.35 6.73

2.29 BSC

9.40 10.41

1.40 1.78

2.74 REF

0.51 BSC

0.89 1.27

−−− 1.01

3.93 −−−

SOLDERING FOOTPRINT*

6.20

0.244

2.58

0.102

3.00

0.118

STYLE 7:

PIN 1. GATE

2. COLLECTOR

3. EMITTER

4. COLLECTOR

5.80

0.228

1.60

0.063

6.17

0.243

ǒ ǓSCALE 3:1

inches

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,

copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC

reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any

particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without

limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications

and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC

does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for

surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where

personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and

its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,

any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture

of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor

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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: [email protected]

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

http://onsemi.com

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your local

Sales Representative

NGD8209N/D

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NGD8209N Datasheet PDF - ON Semiconductor

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