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PDF HC125 Data sheet ( Hoja de datos )
| Número de pieza | HC125 | |
| Descripción | Quad Buffer with 3-STATE Outputs | |
| Fabricantes | Fairchild Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de HC125 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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August 1993
Revised March 1999
74VHC125
Quad Buffer with 3-STATE Outputs
General Description
The VHC125 contains four independent non-inverting buff-
ers with 3-STATE outputs. It is an advanced high-speed
CMOS device fabricated with silicon gate CMOS technol-
ogy and achieves the high-speed operation similar to
equivalent Bipolar Schottky TTL while maintaining the
CMOS low power dissipation.
An input protection circuit insures that 0V to 7V can be
applied to the input pins without regard to the supply volt-
age. This device can be used to interface 5V to 3V systems
and two supply systems such as battery backup. This cir-
cuit prevents device destruction due to mismatched supply
and input voltages.
Features
s High Speed: tPD = 3.8 ns (typ) at VCC = 5V
s Lower power dissipation: ICC = 4 µA (max) at TA = 25°C
s High noise immunity: VNIH = VNIL = 28% VCC (min)
s Power down protection is provided on all inputs
s Low noise: VOLP = 0.8V (max)
Ordering Code:
Order Number Package Number
Package Description
74VHC125M
M14A
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, 0.150 Narrow
74VHC125SJ
M14D
14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74VHC125MTC
MTC14
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74VHC125N
N14A
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
Surface mount packages are also available on Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbol
Connection Diagram
IEEE/IEC
Pin Descriptions
Pin Names
An, Bn
On
Description
Inputs
Outputs
Function Table
Inputs
An Bn
LL
LH
HX
H = HIGH Voltage Level
L = LOW Voltage Level
Z = HIGH Impedance
X = Immaterial
Output
On
L
H
Z
© 1999 Fairchild Semiconductor Corporation DS011632.prf
www.fairchildsemi.com
1 page  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC14
5 www.fairchildsemi.com
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet HC125.PDF ] | |
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