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25L6406E Datasheet Download - Macronix International

Номер произв 25L6406E
Описание MX25L6406E
Производители Macronix International
логотип Macronix International логотип 

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25L6406E Даташит, Описание, Даташиты
MX25L6406E
MX25L6406E
DATASHEET
P/N: PM1577
REV. 1.1, NOV. 17, 2010
1







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25L6406E Даташит, Описание, Даташиты
MX25L6406E
Contents
FEATURES................................................................................................................................................................... 5
GENERAL DESCRIPTION.......................................................................................................................................... 6
PIN CONFIGURATIONS .............................................................................................................................................. 7
PIN DESCRIPTION....................................................................................................................................................... 7
BLOCK DIAGRAM....................................................................................................................................................... 8
MEMORY ORGANIZATION.......................................................................................................................................... 9
Table 1. Memory Organization............................................................................................................................. 9
DEVICE OPERATION................................................................................................................................................. 10
Figure 1. Serial Modes Supported....................................................................................................... 10
DATA PROTECTION.................................................................................................................................................. 11
Table 2. Protected Area Sizes............................................................................................................................. 12
Table 3. 512 bit Secured OTP Definition............................................................................................................ 12
HOLD FEATURES...................................................................................................................................................... 13
Figure 2. Hold Condition Operation ........................................................................................................ 13
COMMAND DESCRIPTION....................................................................................................................................... 14
Table 4. COMMAND DEFINITION...................................................................................................................... 14
(1) Write Enable (WREN).................................................................................................................................... 15
(2) Write Disable (WRDI).................................................................................................................................... 15
(3) Read Status Register (RDSR)....................................................................................................................... 15
(4) Write Status Register (WRSR)...................................................................................................................... 16
Table 5. Protection Modes.................................................................................................................................. 17
(5) Read Data Bytes (READ).............................................................................................................................. 18
(6) Read Data Bytes at Higher Speed (FAST_READ)........................................................................................ 18
(7) Dual Output Mode (DREAD)......................................................................................................................... 18
(8) Sector Erase (SE).......................................................................................................................................... 18
(9) Block Erase (BE)........................................................................................................................................... 19
(10) Chip Erase (CE).......................................................................................................................................... 19
(11) Page Program (PP)..................................................................................................................................... 19
(12) Deep Power-down (DP)............................................................................................................................... 20
(13) Release from Deep Power-down (RDP), Read Electronic Signature (RES) .............................................. 20
(14) Read Identification (RDID)........................................................................................................................... 21
(15) Read Electronic Manufacturer ID & Device ID (REMS)............................................................................... 21
Table 6. ID DEFINITIONS .................................................................................................................................. 22
(16) Enter Secured OTP (ENSO)........................................................................................................................ 22
(17) Exit Secured OTP (EXSO).......................................................................................................................... 22
(18) Read Security Register (RDSCUR)............................................................................................................. 23
Table 7. SECURITY REGISTER DEFINITION................................................................................................... 23
(19) Write Security Register (WRSCUR)............................................................................................................ 23
P/N: PM1577
REV. 1.1, NOV. 17, 2010
2







No Preview Available !

25L6406E Даташит, Описание, Даташиты
MX25L6406E
POWER-ON STATE.................................................................................................................................................... 24
ELECTRICAL SPECIFICATIONS.............................................................................................................................. 25
ABSOLUTE MAXIMUM RATINGS...................................................................................................................... 25
Figure 3.Maximum Negative Overshoot Waveform............................................................................................ 25
CAPACITANCE TA = 25°C, f = 1.0 MHz............................................................................................................. 25
Figure 4. Maximum Positive Overshoot Waveform............................................................................................. 25
Figure 5. INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL.............................................................. 26
Figure 6. OUTPUT LOADING............................................................................................................................ 26
Table 8. DC CHARACTERISTICS...................................................................................................................... 27
Table 9. AC CHARACTERISTICS....................................................................................................................... 28
Timing Analysis......................................................................................................................................................... 29
Figure 7. Serial Input Timing............................................................................................................................... 29
Figure 8. Output Timing...................................................................................................................................... 29
Figure 9. Hold Timing.......................................................................................................................................... 30
Figure 10. WP# Disable Setup and Hold Timing during WRSR when SRWD=1................................................ 30
Figure 11. Write Enable (WREN) Sequence (Command 06).............................................................................. 31
Figure 12. Write Disable (WRDI) Sequence (Command 04).............................................................................. 31
Figure 13. Read Status Register (RDSR) Sequence (Command 05)................................................................. 32
Figure 14. Write Status Register (WRSR) Sequence (Command 01)............................................................... 32
Figure 15. Read Data Bytes (READ) Sequence (Command 03)....................................................................... 32
Figure 16. Read at Higher Speed (FAST_READ) Sequence (Command 0B)................................................... 33
Figure 17. Dual Output Read Mode Sequence (Command 3B)......................................................................... 34
Figure 18. Sector Erase (SE) Sequence (Command 20)................................................................................... 34
Figure 19. Block Erase (BE) Sequence (Command 52 or D8).......................................................................... 34
Figure 20. Chip Erase (CE) Sequence (Command 60 or C7)............................................................................ 35
Figure 21. Page Program (PP) Sequence (Command 02)................................................................................ 35
Figure 22. Deep Power-down (DP) Sequence (Command B9)......................................................................... 36
Figure 23. Release from Deep Power-down (RDP) Sequence (Command AB)................................................ 36
Figure 24. Release from Deep Power-down and Read Electronic Signature (RES) Sequence (Command AB).36
Figure 25. Read Identification (RDID) Sequence (Command 9F)...................................................................... 37
Figure 26. Read Electronic Manufacturer & Device ID (REMS) Sequence (Command 90).............................. 37
Figure 27. Read Security Register (RDSCUR) Sequence (Command 2B)........................................................ 38
Figure 28. Write Security Register (WRSCUR) Sequence (Command 2F)........................................................ 38
Figure 29. Program/ Erase flow with read array data......................................................................................... 39
Figure 30. Power-up Timing................................................................................................................................ 40
Table 10. Power-Up Timing ................................................................................................................................ 40
OPERATING CONDITIONS....................................................................................................................................... 41
Figure 31. AC Timing at Device Power-Up......................................................................................................... 41
Figure 32. Power-Down Sequence..................................................................................................................... 42
P/N: PM1577
REV. 1.1, NOV. 17, 2010
3










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