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PDF HLMP-Y951 Data sheet ( Hoja de datos )
| Número de pieza | HLMP-Y951 | |
| Descripción | LED Lamps | |
| Fabricantes | AVAGO | |
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HLMP-Yxxx
T-1 (3 mm) AlInGaP LED Lamps
Data Sheet
Description
This family of T-1 lamps is widely used in general purpose
indicator and back lighting applications. The optical
design is balanced to yield superior light output and wide
viewing angles. Several intensity choices are available in
each color for increased design flexibility.
Applications
x Status indicator
x Backlighting front panels
x Light pipe sources
x Lighted switches
Package Dimension
5.2
0.205
4.1 ± 0.2
0.161 ± 0.008
3.8 3.5 3.1 ± 0.2
0.15 0.138 0.122 ± 0.008
1.0 (MAX)
0.04
Features
x High luminous intensity output
x Low power consumption
x Choice of bright colors
– Deep Red
– Red
– Red-Orange
– Orange
– Amber
– Green
x High efficiency
x Versatile mounting on PCB or panel
x I.C. Compatible/low current requirement
x Popular T-1 diameter package
x Reliable and rugged
x RoHS compliant
24.0 (MIN)
0.945
CATHODE
0.45 x 0.4 TYP
(0.018 x 0.016)
Notes:
1. All dimensions are in millimeter (inches).
2. Tolerance is ±0.25mm (.010) unless otherwise stated.
3. Lead spacing is measured where the leads emerge from the package.
1.0 (MIN)
0.04
2.54
0.1
1 page  
Intensity Bin Limits
Intensity Range (mcd)
Bin Min. Max.
F
110.0
140.0
G
140.0
180.0
H
180.0
240.0
J
240.0
310.0
K
310.0
400.0
L
400.0
520.0
M
520.0
680.0
N
680.0
880.0
P 880.0
Q 1150
Tolerance for each bin limit is 15%.
1150.0
1500
Color Bin Limits Table
Lambda (nm)
Color Category # Min.
Red-Orange 1
610.5
2 613.5
3 616.5
Yellow-
Orange
2
3
599.5
602.0
4 604.5
5 607.5
Amber
1
584.5
2 587.0
4 589.5
6 592.0
7 594.5
Green
2
573.5
3 570.5
4 567.5
5 564.5
Tolerance for each bin limit is ±1.0 nm.
Max.
613.5
616.5
619.5
602.0
604.5
607.5
610.5
587.0
589.5
592.0
594.5
597.0
576.5
573.5
570.5
567.5
Precautions:
Assembly method:
This product is not meant for auto-insertion.
Lead Forming:
x The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
x If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
x During lead forming, the leads should be bent at a
point at least 3mm from the base of the lens. Do not
use the base of the lead frame as a fulcrum during
forming. Lead forming must be done before soldering
at normal temperature.
x It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
5
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| PDF Descargar | [ Datasheet HLMP-Y951.PDF ] | |
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