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Número de pieza | HFC1N60 | |
Descripción | N-Channel MOSFET | |
Fabricantes | SemiHow | |
Logotipo | ||
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HFC1N60
600V N-Channel MOSFET
BVDSS = 600 V
RDS(on) typ ȍ
ID = 0.5 A
FEATURES
Originative New Design
Superior Avalanche Rugged Technology
Robust Gate Oxide Technology
Very Low Intrinsic Capacitances
Excellent Switching Characteristics
Unrivalled Gate Charge : 4.0 nC (Typ.)
Extended Safe Operating Area
Lower RDS(ON) ȍ7\S#9GS=10V
100% Avalanche Tested
TO-126
1
23
1.Gate 2. Drain 3. Source
Absolute Maximum Ratings TC=25 unless otherwise specified
Symbol
Parameter
Value
VDSS
ID
IDM
VGS
EAS
IAR
EAR
dv/dt
Drain-Source Voltage
Drain Current
Drain Current
Drain Current
– Continuous (TC = 25ఁ͚͑
– Continuous (TC = 100ఁ͚͑
– Pulsed
(Note 1)
Gate-Source Voltage
Single Pulsed Avalanche Energy
(Note 2)
Avalanche Current
(Note 1)
Repetitive Avalanche Energy
(Note 1)
Peak Diode Recovery dv/dt
(Note 3)
600
0.5 *
0.35 *
2.0 *
ρ30
50
0.5
0.75
5.5
PD
TJ, TSTG
TL
Power Dissipation (TC = 25ఁ͚͑
͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͞͵ΖΣΒΥΖ͑ΒΓΠΧΖ͑ͣͦఁ͑
Operating and Storage Temperature Range
Maximum lead temperature for soldering purposes,
1/8” from case for 5 seconds
7.5
0.06
-55 to +150
300
* Drain current limited by junction temperature
Units
V
A
A
A
V
mJ
A
mJ
V/ns
W
W/ఁ͑
ఁ͑
ఁ͑
Thermal Resistance Characteristics
Symbol
RșJC
RșJA
Junction-to-Case
Parameter
Junction-to-Ambient
Typ.
--
--
Max.
17
62.5
Units
ఁ͠Έ͑
క͑΄Ͷ;ͺΈ͑Ͷ·͟Ͳ͡͝΄ΖΡ͑ͣͧ͑͡͡
1 page Typical Characteristics (continued)
1.2
1.1
1.0
0.9
0.8
-100
䈜㻌㻺㼛㼠㼑㻌㻦
1.
2.
VIDGS=0Vȝ
$
-50 0 50 100 150
TJ, Junction Temperature [oC]
200
Figure 7. Breakdown Voltage Variation
vs Temperature
101
Operation in This Area
is Limited by R DS(on)
100 100 Ps
1 ms
DC 10 ms
10-1
䈜㻌㻺㼛㼠㼑㼟㻌㻦
1. TC = 25 oC
2. TJ = 150 oC
3. Single Pulse
10-2
100
101 102
VDS, Drain-Source Voltage [V]
103
Figure 9. Maximum Safe Operating Area
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-100
䈜㻌㻺㼛㼠㼑㻌㻦
1. VGS = 10 V
2. ID = 0.7 A
-50 0 50 100 150
TJ, Junction Temperature [oC]
200
Figure 8. On-Resistance Variation
vs Temperature
0.6
0.5
0.4
0.3
0.2
0.1
0.0
25 50 75 100 125 150
TC, Case Temperature [ 䉝㼉
Figure 10. Maximum Drain Current
vs Case Temperature
101 D=0.5
0.2
0.1
100 0.05
0.02
0.01
10-1
10-2
10-5
single pulse
䈜㻌㻺㼛㼠㼑㼟㻌㻦
1. Zș -&(t) = 17 䉝㻛㼃 㻌㻹㼍㼤㻚
2. Duty Factor, D=t1/t2
3. TJM - TC = PDM * Zș -&(t)
PDM
t1
t2
10-4
10-3
10-2
10-1
100
101
t1, Square Wave Pulse Duration [sec]
102
Figure 11. Transient Thermal Response Curve
క͑΄Ͷ;ͺΈ͑Ͷ·͟Ͳ͡͝΄ΖΡ͑ͣͧ͑͡͡
5 Page |
Páginas | Total 8 Páginas | |
PDF Descargar | [ Datasheet HFC1N60.PDF ] |
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