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NVMFS4C03N PDF даташит

Спецификация NVMFS4C03N изготовлена ​​​​«ON Semiconductor» и имеет функцию, называемую «Power MOSFET ( Transistor )».

Детали детали

Номер произв NVMFS4C03N
Описание Power MOSFET ( Transistor )
Производители ON Semiconductor
логотип ON Semiconductor логотип 

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NVMFS4C03N Даташит, Описание, Даташиты
NVMFS4C03N
Power MOSFET
30 V, 2.1 mW, 143 A, Single N−Channel
Logic Level, SO−8FL
Features
Small Footprint (5x6 mm) for Compact Design
Low RDS(on) to Minimize Conduction Losses
Low QG and Capacitance to Minimize Driver Losses
NVMFS4C03NWF − Wettable Flanks Option for Enhanced Optical
Inspection
AEC−Q101 Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain Cur-
rent RqJC (Notes 1, 2,
3)
Power Dissipation
RqJC (Notes 1, 2)
Steady
State
TC = 25°C
TC = 25°C
Continuous Drain Cur-
rent RqJA (Notes 1, 2,
3)
Power Dissipation
RqJA (Notes 1, 2)
Steady
State
TA = 25°C
TA = 25°C
Pulsed Drain Current TA = 25°C, tp = 10 ms
Operating Junction and Storage Temperature
VDSS
VGS
ID
30
"20
143
PD 77
ID 31.4
PD 3.71
IDM
TJ, Tstg
900
−55 to
175
V
V
A
W
A
W
A
°C
Source Current (Body Diode)
IS 64 A
Single Pulse Drain−to−Source Avalanche
Energy (IL(pk) = 11 A)
EAS 549 mJ
Lead Temperature for Soldering Purposes
(1/8from case for 10 s)
TL 260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)
Parameter
Symbol Value Unit
Junction−to−Case − Steady State (Note 2)
RqJC
1.95 °C/W
Junction−to−Ambient − Steady State (Note 2) RqJA
40
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Surface−mounted on FR4 board using a 650 mm2, 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
http://onsemi.com
V(BR)DSS
30 V
RDS(on) MAX
2.1 mW @ 10 V
2.8 mW @ 4.5 V
D (5,6)
ID MAX
143 A
G (4)
S (1,2,3)
N−CHANNEL MOSFET
MARKING
DIAGRAM
D
1
SO−8 FLAT LEAD
CASE 488AA
STYLE 1
SD
S 4C03xx
S AYWZZ
GD
D
4C03N = Specific Device Code for
NVMFS4C03N
4C03WF= Specific Device Code of
NVMFS4C03NWF
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceabililty
ORDERING INFORMATION
Device
NVMFS4C03NT1G
Package
SO−8 FL
(Pb−Free)
Shipping
1500 /
Tape & Reel
NVMFS4C03NT3G
NVMFS4C03NWFT1G
NVMFS4C03NWFT3G
SO−8 FL
(Pb−Free)
SO−8 FL
(Pb−Free)
SO−8 FL
(Pb−Free)
5000 /
Tape & Reel
1500 /
Tape & Reel
5000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
September, 2014 − Rev. 1
1
Publication Order Number:
NVMFS4C03N/D









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NVMFS4C03N Даташит, Описание, Даташиты
NVMFS4C03N
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified)
Parameter
Symbol
Test Condition
Min Typ Max Unit
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage
Drain−to−Source Breakdown Voltage
Temperature Coefficient
Zero Gate Voltage Drain Current
Gate−to−Source Leakage Current
ON CHARACTERISTICS (Note 4)
V(BR)DSS
V(BR)DSS/
TJ
IDSS
IGSS
VGS = 0 V, ID = 250 mA
30
18.2
V
mV/°C
VGS = 0 V,
VDS = 24 V
TJ = 25 °C
TJ = 125°C
VDS = 0 V, VGS = 20 V
1
mA
10
100 nA
Gate Threshold Voltage
Negative Threshold Temperature Coefficient
Drain−to−Source On Resistance
VGS(TH)
VGS(TH)/TJ
RDS(on)
Forward Transconductance
Gate Resistance
CHARGES AND CAPACITANCES
gFS
RG
VGS = VDS, ID = 250 mA
VGS = 10 V
ID = 30 A
VGS = 4.5 V
ID = 30 A
VDS = 3 V, ID = 30 A
TA = 25 °C
1.3
4.8
1.5
2.2
136
1.0
2.2 V
mV/°C
2.1
mW
2.8
S
W
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Threshold Gate Charge
Gate−to−Source Charge
Gate−to−Drain Charge
Total Gate Charge
CISS
COSS
CRSS
QG(TOT)
QG(TH)
QGS
QGD
QG(TOT)
VGS = 0 V, f = 1 MHz, VDS = 15 V
VGS = 4.5 V, VDS = 15 V; ID = 30 A
VGS = 10 V, VDS = 15 V,
ID = 30 A
3071
1673
67
20.8
4.9
8.5
4.7
45.2
pF
nC
nC
SWITCHING CHARACTERISTICS (Note 5)
Turn−On Delay Time
td(ON)
Rise Time
tr
Turn−Off Delay Time
td(OFF)
Fall Time
tf
DRAIN−SOURCE DIODE CHARACTERISTICS
VGS = 4.5 V, VDS = 15 V, ID = 15 A,
RG = 3.0 W
14
32
27
17
ns
Forward Diode Voltage
VSD
VGS = 0 V,
TJ = 25°C
IS = 10 A
TJ = 125°C
0.75 1.1
0.6
V
Reverse Recovery Time
tRR
47
Charge Time
Discharge Time
ta VGS = 0 V, dIS/dt = 100 A/ms, 23 ns
tb IS = 30 A
24
Reverse Recovery Charge
QRR
39 nC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Pulse Test: pulse width v 300 ms, duty cycle v 2%.
5. Switching characteristics are independent of operating junction temperatures.
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NVMFS4C03N Даташит, Описание, Даташиты
NVMFS4C03N
TYPICAL CHARACTERISTICS
250
225
200
175
150
125
100
75
50
25
0
0.0
4.5 V
3.8 V
VGS = 10 V
TJ = 25°C
3.6 V
3.4 V
3.2 V
3.0 V
2.8 V
2.6 V
0.5 1.0 1.5 2.0 2.5
VDS, DRAIN−TO−SOURCE VOLTAGE (V)
Figure 1. On−Region Characteristics
3.0
250
225 VDS = 3 V
200
175
150
125
100
75 TJ = 150°C
50 TJ = 25°C
25
TJ = −55°C
0
1.5
2
2.5 3
3.5 4
VGS, GATE−TO−SOURCE VOLTAGE (V)
Figure 2. Transfer Characteristics
4.5
3.0 3.0
2.8
ID = 30 A
2.8 TJ = 25°C
TJ = 25°C
2.6 2.6
2.4 2.4 VGS = 4.5 V
2.2 2.2
2.0 2.0
1.8 1.8
1.6
1.4
3
456789
VGS, GATE−TO−SOURCE VOLTAGE (V)
Figure 3. On−Resistance vs. VGS
1.6 VGS = 10 V
1.4
10 0 25 50 75 100 125 150 175 200 225 250
ID, DRAIN CURRENT (A)
Figure 4. On−Resistance vs. Drain Current and
Gate Voltage
1.8
ID = 30 A
1.6 VGS = 10 V
10000
VGS = 0 V
TJ = 125°C
1.4
1000
TJ = 100°C
1.2 TJ = 85°C
1.0 100
0.8
0.6
−50 −25 0 25 50 75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 5. On−Resistance Variation with
Temperature
175
10
0 5 10 15 20 25 30
VDS, DRAIN−TO−SOURCE VOLTAGE (V)
Figure 6. Drain−to−Source Leakage Current
vs. Voltage
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