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PDF NB3M8304C Data sheet ( Hoja de datos )

Número de pieza NB3M8304C
Descripción 3.3V 200 MHz 1:4 LVCMOS/LVTTL Low Skew Fanout Buffer
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NB3M8304C
3.3 V 200 MHz 1:4
LVCMOS/LVTTL Low Skew
Fanout Buffer
Description
The NB3M8304C is 1:4 fanout buffer with LVCMOS/LVTTL input
and output. The device supports the core supply voltage of 3.3 V (VDD
pin) and output supply voltage of 2.5 V or 3.3 V (VDDO pin). The
VDDO pin powers the four single ended LVCMOS/LVTTL outputs.
The NB3M8304C is Form, Fit and Function (pin to pin) compatible
to ICS8304 and ICS8304I. The NB3M8304C is qualified for industrial
operating temperature range.
Features
Input Clock Frequency up to 200 MHz
Low Output to Output Skew: 45 ps max
Low Part to Part Skew: 500 ps max
Low Additive RMS Phase Jitter
Input Clock Accepts LVCMOS/ LVTTL Levels
Operating Voltage:
Core Supply: VDD = 3.3 V ±5%
Output Supply: VDDO = 3.3 V ±5% or 2.5 V ±5%
Operating Temperature Range:
Industrial: −40°C to +85°C
These Devices are Pb−Free and are RoHS Compliant
www.onsemi.com
8
1
SOIC−8
D SUFFIX
CASE 751
MARKING
DIAGRAMS*
8
8304C
ALYWG
G
1
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information on page 5 of
this data sheet.
Figure 1. Block Diagram
© Semiconductor Components Industries, LLC, 2014
December, 2014 − Rev. 3
1
Publication Order Number:
NB3M8304C/D

1 page




NB3M8304C pdf
NB3M8304C
70%
30%
70%
30%
Figure 3. AC Reference Measurement
VDD
VDDO
NB3M8304C
Qx
DUT
GND
ZO = 50 W
D
50 W
Receiver /
Scope
Spec Condition:
VDD = VDDO = 3.3 V ±5%
VDD = 3.3 V ±5%;
VDDO = 2.5 V ±5%
TEST SETUP VDD:
1.65 V ±5%
2.05 V ±5%
TEST SETUP VDDO:
1.65 V ±5%
1.25 V ±5%
TEST SETUP DUT GND:
−1.65 V ±5%
−1.25 V ±5%
Figure 4. Output Driver Typical Device Evaluation and Termination Setup
ORDERING INFORMATION
Device
Package
Shipping
NB3M8304CDG
SOIC−8
(Pb−Free)
98 Units / Rail
NB3M8304CDR2G
SOIC−8
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
5

5 Page










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