NCV3020B PDF даташит
Спецификация NCV3020B изготовлена «ON Semiconductor» и имеет функцию, называемую «Synchronous PWM Controller». |
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Детали детали
Номер произв | NCV3020B |
Описание | Synchronous PWM Controller |
Производители | ON Semiconductor |
логотип |
23 Pages
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NCP3020A, NCP3020B,
NCV3020A, NCV3020B
Synchronous PWM Controller
The NCP3020 is a PWM device designed to operate from a wide
input range and is capable of producing an output voltage as low as
0.6 V. The NCP3020 provides integrated gate drivers and an internally
set 300 kHz (NCP3020A) or 600 kHz (NCP3020B) oscillator. The
NCP3020 also has an externally compensated transconductance error
amplifier with an internally fixed soft−start. Protection features
include lossless current limit and short circuit protection, output
overvoltage protection, output undervoltage protection, and input
undervoltage lockout. The NCP3020 is currently available in a
SOIC−8 package.
Features
• Input Voltage Range from 4.7 V to 28 V
• 300 kHz Operation (NCP3020B – 600 kHz)
• 0.6 V Internal Reference Voltage
• Internally Programmed 6.8 ms Soft−Start (NCP3020B – 4.4 ms)
• Current Limit and Short Circuit Protection
• Transconductance Amplifier with External Compensation
• Input Undervoltage Lockout
• Output Overvoltage and Undervoltage Detection
• NCV Prefix for Automotive and Other Applications Requiring Site
and Change Controls
• This is a Pb−Free Device
VIN
CIN
CBST
VCC BST
HSDR
Q1
COMP
VSW
L0 Vout
RC
CC2
CC1 FB
LSDR
GND
Q2
RISET
RFB1
RFB2
C0
Figure 1. Typical Application Circuit
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8
1
SOIC−8 NB
CASE 751
MARKING DIAGRAM
8
3020x
ALYW
G
1
3020x
A
L
Y
W
G
= Specific Device Code
x = A or B
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
PIN CONNECTIONS
VCC
COMP
FB
GND
BST
HSDR
VSW
LSDR
ORDERING INFORMATION
Device
Package
Shipping†
NCP3020ADR2G SOIC−8 2500 / Tape & Reel
(Pb−Free)
NCP3020BDR2G SOIC−8 2500 / Tape & Reel
(Pb−Free)
NCV3020ADR2G SOIC−8 2500 / Tape & Reel
(Pb−Free)
NCV3020BDR2G SOIC−8 2500 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
January, 2013 − Rev. 6
1
Publication Order Number:
NCP3020/D
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VCC
COMP
FB
NCP3020A, NCP3020B, NCV3020A, NCV3020B
INTERNAL BIAS
POR/STARTUP
THERMAL SD
VC
BOOST
CLAMP
OSCILLATOR
CLK/
DMAX/
SOFT
START
RAMP
1.5 V
GATE
DRIVE
LOGIC
REF
OTA
+
−
PWM
COMP
LEVEL
SHIFT
VCC
CURRENT SAMPLE &
LIMIT
HOLD
ISET
VC
+
−
OOV
OUV
+
−
Figure 2. NCP3020 Block Diagram
BST_CHRG
BST
HSDR
VSW
LSDR
GND
PIN FUNCTION DESCRIPTION
Pin Pin Name
Description
1 VCC The VCC pin is the main voltage supply input. It is also used in conjunction with the VSW pin to sense current
in the high side MOSFET.
2 COMP The COMP pin connects to the output of the Operational Transconductance Amplifier (OTA) and the positive
terminal of the PWM comparator. This pin is used in conjunction with the FB pin to compensate the voltage
mode control feedback loop.
3 FB The FB pin is connected to the inverting input of the OTA. This pin is used in conjunction with the COMP pin to
compensate the voltage mode control feedback loop.
4
GND
Ground Pin
5
LSDR
The LSDR pin is connected to the output of the low side driver which connects to the gate of the low side
N−FET. It is also used to set the threshold of the current limit circuit (ISET) by connecting a resistor from LSDR
to GND.
6
VSW
The VSW
current in
pin
the
is the return path for
high side MOSFET.
the
high
side
driver.
It
is
also
used
in
conjunction
with
the
VCC
pin
to
sense
7 HSDR The HSDR pin is connected to the output of the high side driver which connects to the gate of the high side
N−FET.
8 BST The BST pin is the supply rail for the gate drivers. A capacitor must be connected between this pin and the
VSW pin.
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NCP3020A, NCP3020B, NCV3020A, NCV3020B
ABSOLUTE MAXIMUM RATINGS (measured vs. GND pin 8, unless otherwise noted)
Rating
Symbol
High Side Drive Boost Pin
BST
Boost to VSW differential voltage
BST−VSW
COMP
COMP
Feedback
High−Side Driver Output
Low−Side Driver Output
Main Supply Voltage Input
Switch Node Voltage
Maximum Average Current
VCC, BST, HSDRV, LSDRV, VSW, GND
Operating Junction Temperature Range (Note 1)
Maximum Junction Temperature
Storage Temperature Range
Thermal Characteristics (Note 2)
SOIC−8 Plastic Package
Thermal Resistance Junction−to−Air
Lead Temperature Soldering (10 sec): Reflow (SMD styles only) Pb−Free
(Note 3)
FB
HSDR
LSDR
VCC
VSW
Imax
TJ
TJ(MAX)
Tstg
RqJA
RF
VMAX
45
13.2
5.5
5.5
40
13.2
40
40
VMIN
−0.3
−0.3
−0.3
−0.3
−0.3
−0.3
−0.3
−0.6
130
−40 to +140
+150
−55 to +150
165
260 Peak
Unit
V
V
V
V
V
V
V
V
mA
°C
°C
°C
°C/W
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The maximum package power dissipation limit must not be exceeded.
PD
+
TJ(max) *
RqJA
TA
2. When mounted on minimum recommended FR−4 or G−10 board
3. 60−180 seconds minimum above 237°C.
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Номер в каталоге | Описание | Производители |
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